Abstract: A photolithography lens system is disclosed. The system has several elements perpendicularly aligned to an optical axis. The elements include a light source that generates an exposing light, a first lens that has a front focal plane and a pupil plane, and a binary mask between the light source and the first lens. The binary mask is placed at the front focal plane of the first lens. A pupil filter is placed at the pupil plane. Finally, a second lens is provided that has a front focal plane at substantially the same position as the pupil plane. The second lens also has a back focal plane where a semiconductor wafer is placed.

Abstract: A photolithography lens system is disclosed. The system has several elements all perpendicularly aligned to an optical axis. The elements include a light source that generates an exposing light; a first lens that has a front focal plane and a pupil plane, and a binary mask between the light source and the first lens. The binary mask is placed at the front focal plane of the first lens. A pupil filter is placed at the pupil plane. Finally, a second lens is provided that has a front focal plane at substantially the same position as the pupil plane. The second lens also has a back focal plane where a semiconductor wafer is placed.

Abstract: A package allowing both electrical and optical coupling between one or more integrated circuits and a printed circuit board (PCB) has optical waveguide structures in addition to electrical connections. An optically active device is flip-chip bonded directly to an integrated circuit using solder bump technology. The optically active device has a lens attached to it to facillitate optical coupling to the optical waveguide. The integrated circuit is flip-chip bonded to a BGA package. The BGA package is bonded to the PCB using solder reflow technology.