Abstract: Systems for monitoring and adjusting the air pressure in a rotating wheel in air-tight connection with a non-rotating axle, a hub comprising dynamic and static seals, quick release axle adapters and a quick release axle comprising a quick release hollow axle handle, a quick release hollow axle tensioner, a quick release hollow axle outer circumference, a quick release hollow axle passageway in fluid communication with a quick release hollow axle interior, a quick release hollow axle outer threads, and a quick release hollow axle air-port in fluid communication with the quick release hollow axle interior. Some embodiments further comprise an axle sheath.

Abstract: Systems for monitoring and adjusting the air pressure in a rotating wheel in air-tight connection with a non-rotating axle. In one embodiment, a non-rotating tank air pressure system is separated from a wheel air pressure system by a fill-purge valve. Manipulating the fill-purge valve changes the air pressure in the wheel air pressure system, while the wheel may be rotating, and the change in air pressure is monitored by a gauge.

Abstract: A card housing for printed circuit boards, wherein the card housing is provided with stamped covers having grounding members extending unitarily therefrom, wherein at least one grounding member is bent so that an outward surface of the grounding member is contiguous with an outward face of the cover. The cover having the bent grounding member is stamped from a metallic sheet having an insulative frame on one side that forms the outward face and surface. An insulative frame overlays a peripheral edge of each cover so that the two covers may be sealed to encase a printed circuit board inserted therein.

Abstract: A process by which a package for a memory card is manufactured. The package comprises chiefly two stamped steel covers, (an upper and a lower cover half), each secured to a plastic frame element. The cover halves are secured by extended fingers which wrap around the plastic frame. This provides a double layer of metal at the perimeter of the frame. The two cover halves are situated so as to encapsulate the subject PCB and to affix it in its proper position. The two cover halves are then welded together using sonic welding on the plastic frame. The package has been designed to meet all PCMCIA standards, including polarizing keys and grounding points.

Abstract: A container for a memory card and the process by which the container is manufactured. The container comprises chiefly two stamped steel covers, (an upper and a lower cover half), each secured to a plastic frame element. The cover halves are secured by extended fingers which wrap around the plastic frame. This provides a double layer of metal at the perimeter of the frame. The two cover halves are situated so as to encapsulate the subject PCB and to affix it in its proper position. The two cover halves are then welded together using sonic welding on the plastic frame. The frame has been designed to meet all PCMCIA standards, including polarizing keys and grounding points.

Abstract: A process by which a package for a memory card is manufactured. The package comprises chiefly two stamped steel covers, (an upper and a lower cover half), each secured to a plastic frame element. The cover halves are secured by extended fingers which wrap around the plastic frame. This provides a double layer of metal at the perimeter of the frame. The two cover halves are situated so as to encapsulate the subject PCB and to affix it in its proper position. The two cover halves are then welded together using sonic welding on the plastic frame. The package has been designed to meet all PCMCIA standards, including polarizing keys and grounding points.