Abstract: The present subject matter relates generally to temperature sensors using one or a plurality of temperature sensing devices. Various embodiments of the present subject matter include a temperature sensor assembly. The temperature sensor assembly includes an enclosure having an inside surface and a temperature sensing device housed in the enclosure. A thermally conductive material connects a surface of the temperature sensing device directly to the inside surface of the enclosure in a side mounted manner to provide rapid thermal conduction from the enclosure to the temperature sensing device. In various embodiments, the temperature sensing device is a resistance temperature detector (RTD).

Abstract: The present subject matter relates generally to temperature sensors using a thin film element. Various embodiments of the present subject matter include a temperature sensor assembly. The temperature sensor assembly includes an enclosure having an inside surface and a thin film element housed in the enclosure. A thermally conductive material connects a surface of the thin film element directly to the inside surface of the enclosure in a side mounted manner to provide rapid thermal conduction from the enclosure to the thin film element. In various embodiments, the thin film element is a resistance temperature detector (RTD).