Patents by Inventor Brendon Shingwoo Wai

Brendon Shingwoo Wai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230000690
    Abstract: A bandage includes a top film, an absorbent layer and a perforated adhesive lower layer positioned under the absorbent layer for adhering the bandage to a user's skin. The absorbent layer includes at least one incision that improves the flexibility of the bandage.
    Type: Application
    Filed: September 13, 2022
    Publication date: January 5, 2023
    Inventors: Daniel Rivest, Brendon Shingwoo Wai
  • Patent number: 11491053
    Abstract: A bandage includes a top film, an absorbent layer and a perforated adhesive lower layer positioned under the absorbent layer for adhering the bandage to a user's skin. The absorbent layer includes at least one incision that improves the flexibility of the bandage.
    Type: Grant
    Filed: March 27, 2020
    Date of Patent: November 8, 2022
    Assignee: BIODAPTIVE ADVANCED MATERIALS, LLC
    Inventors: Daniel Rivest, Brendon Shingwoo Wai
  • Publication number: 20200306093
    Abstract: A bandage includes a top film, an absorbent layer and a perforated adhesive lower layer positioned under the absorbent layer for adhering the bandage to a user's skin. The absorbent layer includes at least one incision that improves the flexibility of the bandage.
    Type: Application
    Filed: March 27, 2020
    Publication date: October 1, 2020
    Inventors: Daniel Rivest, Brendon Shingwoo Wai