Abstract: An apparatus for protecting a module used in a borehole may include a plurality of shock protection elements associated with the module. The plurality of shock protection elements cooperatively has a macroscopic non-linear spring response to an applied shock event. The plurality of shock protection elements may include at least an enclosure and a dampener connecting the module with the enclosure. A related method for protecting a module used in a borehole may include enclosing the module within the plurality of shock protection elements; disposing the module in the borehole; and subjecting the module to a shock event. The plurality of shock protection elements cooperatively has a macroscopic non-linear spring response to the shock event.

Abstract: An apparatus for protecting a module used in a borehole may include a plurality of shock protection elements associated with the module. The plurality of shock protection elements cooperatively has a macroscopic non-linear spring response to an applied shock event. The plurality of shock protection elements may include at least an enclosure and a dampener connecting the module with the enclosure. A related method for protecting a module used in a borehole may include enclosing the module within the plurality of shock protection elements; disposing the module in the borehole; and subjecting the module to a shock event. The plurality of shock protection elements cooperatively has a macroscopic non-linear spring response to the shock event.

Abstract: An electronic component package for installation on a tool includes: a solid molded housing configured to hold an electronic component support structure and surround electronic components disposed on the support structure; the housing including a first portion configured to hold the support structure, and a second portion forming a cavity around the electronic components disposed on the support structure and isolating the electronic components from contact with the housing; and a viscoelastic damping layer disposed within the first portion, the viscoelastic cushion configured to damp vibrations and strain transmitted from the tool, the viscoelastic damping layer forming a constrained layer between the support structure and the first portion and configured to isolate the support structure from the housing.

Abstract: An electronic component package for installation on a tool includes: a solid molded housing configured to hold an electronic component support structure and surround electronic components disposed on the support structure; the housing including a first portion configured to hold the support structure, and a second portion forming a cavity around the electronic components disposed on the support structure and isolating the electronic components from contact with the housing; and a viscoelastic damping layer disposed within the first portion, the viscoelastic cushion configured to damp vibrations and strain transmitted from the tool, the viscoelastic damping layer forming a constrained layer between the support structure and the first portion and configured to isolate the support structure from the housing.

Abstract: A nuclear sensor on a bottomhole assembly (BHA) makes measurements of a property of an earth formation during continued rotation of the BHA. Magnetometers that are susceptible to bias error are deployed on the BHA to make measurements of the magnetic toolface angle. A processor separates the sensor measurements into azimuthal sectors while compensating for inherent time delays in the electronics, non-uniform rotation, and bias.