Abstract: In one embodiment, a metallic micro-cantilever, comprises a silicon substrate, at least one via plug extending from a surface of the silicon substrate, a metallic layer cantilevered from the at least one via plug, and a metallic probe tip extending from a surface of the metallic layer.

Abstract: A system that accepts and stores raw time and expense data for a plurality of businesses—each business defining a separate account that is accessible and usable by authorized users for the particular business. The inventive system automatically converts the raw time and expense data by considering any client or project-specific billing requirements (e.g., flat-fee, maximum fee, discount, write-offs, etc.) and by applying such specific requirements to the raw time and/or expense data in generating an invoice. The raw data may be referred to as internal data in that it is used only by the business providing a service to their client, and in connection with that business's account by the inventive system. A client will not have access to internal data. The invoice data, on the other hand, may be referred to as external data because it is communicated to the client and also used in connection with that business's account.

Abstract: A method of planarizing comprising providing a substrate having an uneven surface topography, forming a layer on the substrate, wherein the layer has a graded resistance to polishing, and polishing the layer.

Abstract: A method of forming a device and the device itself that utilizes a high density plasma-enhanced TEOS-based intermetal dielectric is disclosed. The high density is accomplished though the use of higher RF power and higher oxygen flow rate so that the TEOS is more completely oxidized. The higher density intermetal dielectric absorbs water from air slower than a standard intermetal dielectric film. This lower water absorbance reduces the amount of water in the device and reduces hot electron induced device degradation.