Abstract: Embodiments include methods, systems, and computer program products method for aerial vehicle in-flight servicing. The computer-implemented method includes monitoring, using a processor, an aerial vehicle status of a delivery aerial vehicle. The processor compares the aerial vehicle status of the aerial vehicle to a delivery schedule associated with the delivery aerial vehicle. The processor further assigns a service aerial vehicle to provide service in response to the aerial vehicle status conflicting with the delivery schedule associated with the delivery aerial vehicle. The method further couples the delivery aerial vehicle to the service aerial vehicle while the delivery aerial vehicle and service aerial vehicle are in-flight. The method further provides power source assistance or aerial vehicle component assistance to the delivery aerial vehicle by the service aerial vehicle while the delivery aerial vehicle and service aerial vehicle are in-flight.

Abstract: Disclosed herein is a method for producing a land grid array (LGA) socket connector assembly and the resultant assembly. The method comprises providing a carrier having a first carrier thickness with an array of vias, each having a first diameter, providing pockets around top surfaces of the vias, each having a second diameter and creating a portion of the pockets having a second carrier thickness that is less than the first carrier thickness, providing socket contact springs, each comprising a hole support structure that supports the socket contact spring within the via, and a contact beam configured to contact a conductor of an integrated circuit to be placed within the socket connector assembly, wherein a portion of carrier having a first carrier thickness is configured to prevent the contact beam from inelastically deforming when bent under load. Alternately, a contact feature may be used to prevent the inelastic deformation.

Abstract: Embodiments include methods, systems, and computer program products method for aerial vehicle in-flight servicing. The computer-implemented method includes monitoring, using a processor, an aerial vehicle status of a delivery aerial vehicle. The processor compares the aerial vehicle status of the aerial vehicle to a delivery schedule associated with the delivery aerial vehicle. The processor further assigns a service aerial vehicle to provide service in response to the aerial vehicle status conflicting with the delivery schedule associated with the delivery aerial vehicle. The method further couples the delivery aerial vehicle to the service aerial vehicle while the delivery aerial vehicle and service aerial vehicle are in-flight. The method further provides power source assistance or aerial vehicle component assistance to the delivery aerial vehicle by the service aerial vehicle while the delivery aerial vehicle and service aerial vehicle are in-flight.

Abstract: An Off The Module (OTM) cable assembly includes a back shell assembly and a guide block, where the guide block is disposed on a top surface of a electronic package. The back shell assembly is disposed inside a cavity of the guide block, where the back shell assembly includes a plurality of cable subassemblies and a back shell holder. Each cable subassembly from the plurality of cable subassemblies includes a compression connector portion and a cable portion, where the cable portion is mechanically coupled and electrically coupled to the compression connector portion. A contact wire and a contact spring of each cable subassembly is compressed against a respective plated contact pad on the top surface of the electronic package, where the compressed contact wire and the compressed contact spring of each cable subassembly is electrical coupled to the electronic package via the respective plated contact pad.

Abstract: An Off The Module (OTM) cable assembly includes a back shell assembly and a guide block, where the guide block is disposed on a top surface of a electronic package. The back shell assembly is disposed inside a cavity of the guide block, where the back shell assembly includes a plurality of cable subassemblies and a back shell holder. Each cable subassembly from the plurality of cable subassemblies includes a compression connector portion and a cable portion, where the cable portion is mechanically coupled and electrically coupled to the compression connector portion. A contact wire and a contact spring of each cable subassembly is compressed against a respective plated contact pad on the top surface of the electronic package, where the compressed contact wire and the compressed contact spring of each cable subassembly is electrical coupled to the electronic package via the respective plated contact pad.

Abstract: An interposer comprises a metal-plated via that spans the depth of a printed circuit board. The interposer also comprises a metal plug inserted into a first end of the metal-plated via. The metal plug is attached to the metal-plated via. The metal plug may take the form of a solid plug or a sintered via plug. The interposer also comprises a solder ball soldered to the metal plug.

Abstract: Embodiments are directed to an electrical contact for use in an LGA connector having a split beam cantilever. The contact includes a base adapted for retention in an LGA connector. The contact also includes two cantilever beams extending from the base. The cantilever beams are each connected to the base at a first end of each respective cantilever beam. The contact includes a neck defining a region where a second end of each the two cantilever beams are connected. A contact tip extends from the neck.

Abstract: Embodiments are directed to an electrical contact for use in an LGA connector having a split beam cantilever. The contact includes a base adapted for retention in an LGA connector. The contact also includes two cantilever beams extending from the base. The cantilever beams are each connected to the base at a first end of each respective cantilever beam. The contact includes a neck defining a region where a second end of each the two cantilever beams are connected. A contact tip extends from the neck.

Abstract: Embodiments are directed to an electrical contact for use in an LGA connector having a split beam cantilever. The contact includes a base adapted for retention in an LGA connector. The contact also includes two cantilever beams extending from the base. The cantilever beams are each connected to the base at a first end of each respective cantilever beam. The contact includes a neck defining a region where a second end of each the two cantilever beams are connected. A contact tip extends from the neck.

Abstract: Embodiments are directed to an electrical contact for use in an LGA connector having a split beam cantilever. The contact includes a base adapted for retention in an LGA connector. The contact also includes two cantilever beams extending from the base. The cantilever beams are each connected to the base at a first end of each respective cantilever beam. The contact includes a neck defining a region where a second end of each the two cantilever beams are connected. A contact tip extends from the neck.

Abstract: Embodiments of the present invention include a method for fabricating a hybrid land grid array connector and the resulting structures. A body is provided. The body includes a first plurality of holes and a second plurality of holes. A conductive layer is deposited on the top and bottom surfaces of the body and the wall surfaces of the first plurality of holes resulting in the top and bottom surfaces being electrically common. The conductive layer is removed from the wall surfaces of a first subset of the first plurality of holes. A portion of the conductive layer is removed from the top surface of the body and the bottom surface of the body from an area surrounding the first subset of the first plurality of holes.

Abstract: Embodiments of the present invention include a method for fabricating a hybrid land grid array connector and the resulting structures. A body is provided. The body includes a first plurality of holes and a second plurality of holes. A conductive layer is deposited on the top and bottom surfaces of the body and the wall surfaces of the first plurality of holes resulting in the top and bottom surfaces being electrically common. The conductive layer is removed from the wall surfaces of a first subset of the first plurality of holes. A portion of the conductive layer is removed from the top surface of the body and the bottom surface of the body from an area surrounding the first subset of the first plurality of holes.

Abstract: The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant or high modulus elastomeric material. A standard packaging substrate, such as a ceramic integrated circuit chip packaging substrate is used to provide a space transformer. Wires are bonded to an array of contact pads on the surface of the space transformer. The space transformer formed from a multilayer integrated circuit chip packaging substrate. The wires are as dense as the contact location array. A mold is disposed surrounding the array of outwardly projecting wires. A liquid elastomer is disposed in the mold to fill the spaces between the wires.

Abstract: The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant or high modulus elastomeric material. A standard packaging substrate, such as a ceramic integrated circuit chip packaging substrate is used to provide a space transformer. Wires are bonded to an array of contact pads on the surface of the space transformer. The space transformer formed from a multilayer integrated circuit chip packaging substrate. The wires are as dense as the contact location array. A mold is disposed surrounding the array of outwardly projecting wires. A liquid elastomer is disposed in the mold to fill the spaces between the wires.

Abstract: The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant or high modulus elastomeric material. A standard packaging substrate, such as a ceramic integrated circuit chip packaging substrate is used to provide a space transformer. Wires are bonded to an array of contact pads on the surface of the space transformer. The space transformer formed from a multilayer integrated circuit chip packaging substrate. The wires are as dense as the contact location array. A mold is disposed surrounding the array of outwardly projecting wires. A liquid elastomer is disposed in the mold to fill the spaces between the wires.

Abstract: The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant or high modulus elastomeric material. A standard packaging substrate, such as a ceramic integrated circuit chip packaging substrate is used to provide a space transformer. Wires are bonded to an array of contact pads on the surface of the space transformer. The space transformer formed from a multilayer integrated circuit chip packaging substrate. The wires are as dense as the contact location array. A mold is disposed surrounding the array of outwardly projecting wires. A liquid elastomer is disposed in the mold to fill the spaces between the wires.

Abstract: The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant or high modulus elastomeric material. A standard packaging substrate, such as a ceramic integrated circuit chip packaging substrate is used to provide a space transformer. Wires are bonded to an array of contact pads on the surface of the space transformer. The space transformer formed from a multilayer integrated circuit chip packaging substrate. The wires are as dense as the contact location array. A mold is disposed surrounding the array of outwardly projecting wires. A liquid elastomer is disposed in the mold to fill the spaces between the wires.

Abstract: The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer forms or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant or high modulus elastomeric material. A standard packaging substrate, such as a ceramic integrated circuit chip packaging substrate is used to provide a space transformer. Wires are bonded to an array of contact pads on the surface of the space transformer. The space transformer formed from a multilayer integrated circuit chip packaging substrate. The wires are as dense as the contact location array. A mold is disposed surrounding the array of outwardly projecting wires. A liquid elastomer is disposed in the mold to fill the spaces between the wires. The elastomer is cured and the mold is removed, leaving an array of wires disposed in the elastomer and in electrical contact with the space transformer.

Abstract: The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant or high modulus elastomeric material. A standard packaging substrate, such as a ceramic integrated circuit chip packaging substrate is used to provide a space transformer Wires are bonded to an array of contact pads on the surface of the space transformer. The space transformer formed from a multilayer integrated circuit chip packaging substrate. The wires are as dense as the contact location array. A mold is disposed surrounding the array of outwardly projecting wires. A liquid elastomer is disposed in the mold to fill the spaces between the wires.

Abstract: The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant or high modulus elastomeric material. A standard packaging substrate, such as a ceramic integrated circuit chip packaging substrate is used to provide a space transformer Wires are bonded to an array of contact pads on the surface of the space transformer. The space transformer formed from a multilayer integrated circuit chip packaging substrate. The wires are as dense as the contact location array. A mold is disposed surrounding the array of outwardly projecting wires. A liquid elastomer is disposed in the mold to fill the spaces between the wires.