Patents by Inventor Brian Burwick

Brian Burwick has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20070293099
    Abstract: A connector circuit assembly for use in an implantable medical device, and a method of making the assembly that includes a core portion formed of a thermoplastic material using either an injection molding process or a machining process. This core portion is adapted to be fitted with at least one electrically-conductive circuit component such as a connector member, a set-screw block, or a conductive jumper member. In one embodiment of the invention, the core portion includes multiple receptacles or other spaces that are adapted to be loaded with the various circuit components. The core assembly is positioned into a second-shot mold assembly, and a second thermoplastic material is injected into the mold so that the second thermoplastic material extends over and adheres to the core portion and the circuit component.
    Type: Application
    Filed: August 21, 2007
    Publication date: December 20, 2007
    Inventors: Bryan Zart, Brian Burwick, Andrew Ries, John Nicholson, Jay Lahti, Gregory Theis
  • Publication number: 20070190866
    Abstract: A connector assembly for coupling to an implantable medical device includes a core element formed of a first thermoplastic material shaped to receive a connector member for receiving a lead. The connector assembly further includes a circuit member positioned adjacent to the core element. The circuit member includes a portion extending along the core element to the connector member and an antenna structure extending over a portion of the core element outer surface.
    Type: Application
    Filed: January 29, 2007
    Publication date: August 16, 2007
    Inventors: Bryan Zart, Andrew Ries, Brian Burwick, John Nicholson, Jay Lahti, Gregory Theis
  • Publication number: 20070087637
    Abstract: A connector circuit assembly for use in an implantable medical device, and a method of making the assembly that includes a core portion formed of a thermoplastic material using either an injection molding process or a machining process. This core portion is adapted to be fitted with at least one electrically-conductive circuit component such as a connector member, a set-screw block, or a conductive jumper member. In one embodiment of the invention, the core portion includes multiple receptacles or other spaces that are adapted to be loaded with the various circuit components. The core assembly is positioned into a second-shot mold assembly, and a second thermoplastic material is injected into the mold so that the second thermoplastic material extends over and adheres to the core portion and the circuit component.
    Type: Application
    Filed: December 18, 2006
    Publication date: April 19, 2007
    Inventors: Bryan Zart, Brian Burwick, Andrew Ries, John Nicholson, Jay Lahti, Gregory Theis
  • Publication number: 20050137642
    Abstract: An improved circuit assembly for use in an implantable medical device, and a method of making the assembly is disclosed. The circuit assembly includes a core portion formed of a thermoplastic material using either an injection molding process or a machining process. This core portion is adapted to be fitted with at least one electrically-conductive circuit component such as a connector member, a set-screw block, or a conductive jumper member. In one embodiment of the invention, the core portion includes multiple receptacles or other spaces that are adapted to be loaded with the various circuit components. Core portion may further be provided with groove and ridge members designed to position and retain the circuit components at predetermined locations around the various surfaces of the core portion. One or more of the circuit components may be welded or soldered together to form electrical contacts.
    Type: Application
    Filed: October 15, 2004
    Publication date: June 23, 2005
    Inventors: Bryan Zart, Brian Burwick, Andrew Ries, John Nicholson, Jay Lahti, Gregory Theis