Abstract: An apparatus includes logic to control heat generation in a device. The device to operate at least in one of a first state and a second state, wherein the device to consume more power in the first state than in the second state. The device to connect to a network at least for a portion of time while in the second state. The logic to select a plurality of thermal control solutions to decrease the generation of heat in the device in the second state, the selected thermal control solution to be performed while the device is in the second state to reduce the generated heat to below a predetermined level.

Abstract: An apparatus includes logic to control heat generation in a device. The device to operate ate leas in one of a first state and a second state, wherein the device to consume more power in the first state than in the second state. The device to connect to a network at least for a portion of time while in the second state. The logic to select a plurality of thermal control solutions to decrease the generation of heat in the device in the second state, the selected thermal control solution to be performed while the device is in the second state to reduce the generated heat to below a predetermined level.

Abstract: A method and a structure for reducing socket warpage in an embodiment by forming at least one groove in a socket housing contiguous to a surface mount region for an electrical device and securing a rigid bar in the groove.

Abstract: Socket warpage reduction apparatus and method.

Abstract: Socket warpage reduction apparatus and method.

Abstract: An advanced zero-insertion force (ZIF) socket for coupling an electronic package having a plurality of electrical pins onto a printed circuit board (PCB) of a computer system. Such a ZIF socket comprises a base having a plurality of receptacles adapted to receive electrical pins of an electronic package; a top plate slidably mounted on the base, having a plurality of pin insertion apertures adapted to permit insertion of the electrical pins of the electronic package; and a cam mechanism having an integrated lever which is operable for actuation in the same plane as the socket, for sliding the top plate over the base in a first direction to permit insertion of the electrical pins of the electronic package into respective apertures of the base, and for sliding the top plate over the base in a second direction opposite to the first direction to secure an electrical coupling of the electrical pins of the electronic package with the receptacles of the base.

Abstract: Socket warpage reduction apparatus and method.

Abstract: An advanced zero-insertion force (ZIF) socket for coupling an electronic package having a plurality of electrical pins onto a printed circuit board (PCB) of a computer system. Such a ZIF socket comprises a base having a plurality of receptacles adapted to receive electrical pins of an electronic package; a top plate slidably mounted on the base, having a plurality of pin insertion apertures adapted to permit insertion of the electrical pins of the electronic package; and a cam mechanism having an integrated lever which is operable for actuation in the same plane as the socket, for sliding the top plate over the base in a first direction to permit insertion of the electrical pins of the electronic package into respective apertures of the base, and for sliding the top plate over the base in a second direction opposite to the first direction to secure an electrical coupling of the electrical pins of the electronic package with the receptacles of the base.