Abstract: A gift card system includes a gift card imprinted with indicia identifying the issuer, an adhesively coated security label permanently adhered to the card and imprinted on one surface with the value of the gift, and a gift record for recording information concerning the gift including the date of issuance and the value thereof. A recording sheet providing the gift record and the opposite surface of the substrate and the face of the recording sheet have cooperating interactive coatings thereon to imprint the recording sheet. A second security label is substantially permanently adhered on the first security label and imprinted with a reduced value to reflect a partial charge against the value on the first mentioned security label.

Abstract: A gift card system includes a gift card imprinted with indicia identifying the issuer, an adhesively coated security label permanently adhered to the card and imprinted on one surface with the value of the gift, and a gift record for recording information concerning the gift including the date of issuance and the value thereof. A recording sheet providing the gift record and the opposite surface of the substrate and the face of the recording sheet have cooperating interactive coatings thereon to imprint the recording sheet. A second security label is substantially permanently adhered on the first security label and imprinted with a reduced value to reflect a partial charge against the value on the first mentioned security label.

Abstract: A firmly adherent film 16 of bondable metal, such as silver, is applied to the surface 10 of glass or other substrate by decomposing a layer 14 of a solution of a thermally decomposable metallo-organic deposition (MOD) compound such as silver neodecanoate in xylene. The MOD compound thermally decomposes into metal and gaseous by-products. Sealing is accomplished by depositing a layer 18 of bonding metal, such as solder or a brazing alloy, on the metal film and then forming an assembly with another high melting point metal surface 20 such as a layer of Kovar. When the assembly is heated above the temperature of the solder, the solder flows, wets the adjacent surfaces and forms a hermetic seal between the metal film 14 and metal surface 20 when the assembly cools.

Abstract: A photovoltaic cell, such as a solar cell, is provided which has a higher output voltage than prior cells. The improved cell includes a substrate of doped silicon, a first layer of silicon disposed on the substrate and having opposite doping, and a second layer of silicon carbide disposed on the first layer. The silicon carbide preferably has the same type of doping as the first layer.