Abstract: Thin-film devices, for example electrochromic devices for windows, and methods of manufacturing are described. Particular focus is given to methods of patterning optical devices. Various edge deletion and isolation scribes are performed, for example, to ensure the optical device has appropriate isolation from any edge defects. Methods described herein apply to any thin-film device having one or more material layers sandwiched between two thin film electrical conductor layers. The described methods create novel optical device configurations.

Abstract: Thin-film devices, for example electrochromic devices for windows, and methods of manufacturing are described. Particular focus is given to methods of patterning optical devices. Various edge deletion and isolation scribes are performed, for example, to ensure the optical device has appropriate isolation from any edge defects. Methods described herein apply to any thin-film device having one or more material layers sandwiched between two thin film electrical conductor layers. The described methods create novel optical device configurations.

Abstract: Thin-film devices, for example electrochromic devices for windows, and methods of manufacturing are described. Particular focus is given to methods of patterning optical devices. Various edge deletion and isolation scribes are performed, for example, to ensure the optical device has appropriate isolation from any edge defects. Methods described herein apply to any thin-film device having one or more material layers sandwiched between two thin film electrical conductor layers. The described methods create novel optical device configurations.

Abstract: Electrochromic devices such as electrochromic windows may employ accretively deposited bus bars. Forming bus bars by accretive deposition rather than by conductive inks can reduce fabrication time and costs. Accretive deposition processes may be implemented with high throughput to create highly conductive pure metal and/or alloy features that have good surface adhesion to a substrate such as glass or a transparent conducting layer. Accretive deposition may be used to mechanically and/or electrically bond a wire to a bus bar. In some processes, deposition is primarily ballistic, and particles ejected from a nozzle are deposited by mechanical or metallurgical bonding upon impact. In some cases, particles are heated via a gas or plasma before impacting a substrate.

Abstract: Thin-film devices, for example electrochromic devices for windows, and methods of manufacturing are described. Particular focus is given to methods of patterning optical devices. Various edge deletion and isolation scribes are performed, for example, to ensure the optical device has appropriate isolation from any edge defects. Methods described herein apply to any thin-film device having one or more material layers sandwiched between two thin film electrical conductor layers. The described methods create novel optical device configurations.

Abstract: Thin-film devices, for example electrochromic devices for windows, and methods of manufacturing are described. Particular focus is given to methods of patterning optical devices. Various edge deletion and isolation scribes are performed, for example, to ensure the optical device has appropriate isolation from any edge defects. Methods described herein apply to any thin-film device having one or more material layers sandwiched between two thin film electrical conductor layers. The described methods create novel optical device configurations.

Abstract: A compound is disclosed, which is useful in treating a mammal having a disease-state characterized by thrombotic activity. The compound is of the following formula: wherein A, B, R1, R2, R3 and R4 are as defined herein or an isomer or isomeric mixture thereof or a pharmaceutically acceptable salt thereof.

Abstract: A compound is disclosed, which is useful in treating a mammal having a disease-state characterized by thrombotic activity.

Abstract: This invention is directed to compounds of formula (III): wherein B, C, D, E, R1, R2 and R3 are disclosed herein. These compounds are disclosed as being useful as anti coagulants.

Abstract: This invention is directed to compounds of formula (III): wherein B, C, D, E, R1, R2 and R3 are disclosed herein. These components are disclosed as being useful as anti-coagulants.

Abstract: This invention is directed to compounds of formula (III): ##STR1## wherein B, C, D, E, R.sup.1, R.sup.2 and R.sup.3 are disclosed herein. These compounds are disclosed as being useful as anti-coagulants.

Abstract: Compounds of formula (I): ##STR1## wherein: n,A,R.sup.1,R.sup.2,R.sup.3, and R.sup.4 have meanings as defined herein, or a pharmaceutically acceptable salt thereof, are useful as anti-coagulants.