Abstract: Apparatus and methods are provided for constructing waveguide-to-transmission line transitions that provide broadband, high performance coupling of power at microwave and millimeter wave frequencies. More specifically, exemplary embodiments of the invention include wideband, low-loss and compact CPW-to-rectangular waveguide transition structures and ACPS (or CPS)-to-rectangular waveguide transition structures that are particularly suitable for microwave and millimeter wave applications.

Abstract: Apparatus and methods are provided for integrally packaging semiconductor IC (integrated circuit) chips with antennas having one or more radiating elements and tuning elements that are formed from package lead wires that are appropriated shaped and arranged to form antenna structures for millimeter wave applications.

Abstract: Apparatus and methods are provided for integrally packaging antenna devices with semiconductor IC (integrated circuit) chips, wherein IC chips are packaged with dielectric resonators antennas that are integrally constructed as part of a package molding (encapsulation) process, for example, to form compact integrated radio/wireless communications systems for millimeter wave applications.

Abstract: Apparatus and methods are provided for packaging IC chips together with integrated antenna modules designed to provide a closed EM (electromagnetic) environment for antenna radiators, thereby allowing antennas to be designed independent from the packaging technology.

Abstract: Apparatus and methods are provided for integrally packaging antennas with semiconductor IC (integrated circuit) chips to provide highly-integrated and high-performance radio/wireless communications systems for millimeter wave applications including, e.g., voice communication, data communication and radar applications. For example, wireless communication modules are constructed with IC chips having receiver/transmitter/transceiver integrated circuits and planar antennas that are integrally constructed from BEOL (back end of line) metallization structures of the IC chip.

Abstract: Printed antenna devices are provided, which can operate at RF and microwave frequencies, for example, while simultaneously providing antenna performance characteristics such as high gain/directivity/radiation efficiency, high bandwidth, hemispherical radiation patterns, impedance, etc., that render the antennas suitable for voice communication, data communication or radar applications, for example. Further, apparatus are provided for integrally packaging such printed antenna devices with IC (integrated circuit) chips (e.g., transceiver) to construct IC packages for, e.g., wireless communications applications.

Abstract: Low-profile, compact UWB embedded antenna designs are provided for use with computing devices, such as laptop computers, which enable ease of integration within computing devices with limited space, while providing suitable antenna characteristics (e.g., impedance matching and radiation efficiency) over an operating bandwidth of about 1 GHz to about 11 GHz.

Abstract: Low-profile, compact UWB embedded antenna designs are provided for use with computing devices, such as laptop computers, which enable ease of integration within computing devices with limited space, while providing suitable antenna characteristics (e.g., impedance matching and radiation efficiency) over an operating bandwidth of about 1 GHz to about 11 GHz.

Abstract: Low-profile, compact embedded antenna designs are provided for use with computing devices, such as laptop computers, which enable ease of integration within computing devices with limited space, while providing suitable antenna characteristics (e.g., impedance matching and radiation efficiency) over a desired bandwidth of operation. Compact antenna designs with reduced antenna size (e.g., antenna height) and increased operational bandwidth (e.g., broadband impedance matching) are achieved using slotted ground plane designs and/or doubling antenna feeding schemes.

Abstract: A compact sized embedded, multiband, multi-standard, interoperable antenna for portable devices used in wireless applications is provided. The antenna design includes an asymmetrical structure provided on a double-sided printed circuit board. The asymmetrical structure covers both the ultra-wideband and the wireless local area network band. The asymmetrical structure provided on the front side of the printed circuit board is a primary radiator with a supplement strip radiator, whereby the bottom of the primary radiator is close to the vertical ground plane and fed by a probe extended from a coaxial line. The asymmetrical structure on the front side provides a well-matched bandwidth covering the ultra-wideband band of 3.1 GHz to 10.6 GHz. A second supplement strip is provided on the backside of the printed circuit board which provides the second resonance at the 2.4 GHz wireless local area network band.

Abstract: A compact sized integrated quadband antenna for portable devices used in wireless applications is provided to provide wireless wide area network quadband coverage for world wide applications. The antenna design includes a combination of F-shaped and variations of L-shaped metal pieces. The F-shaped and variations of L-shaped metal pieces are provided on a double-sided printed circuit board. The F-shaped metal piece covers 800 MHz and 900 MHz bands. Two variations of L-shaped metal pieces are provided, whereby the two variations produce two resonants in the 1800 MHz and 1900 MHz bands. The two variations of L-shaped metal pieces are provided inside the F-shaped metal piece. The laptop display frame or the metal display supporters are used as part of the antenna, the display frame or the metal display supporters providing the ground plane to the antenna design.

Abstract: Antenna devices are provided comprising antenna structures encapsulated or molded into plastic covers of computing devices to enable wireless communication. For example, one or more antenna structures can be encasulated within, or molded into, a plastic display cover of a portable laptop computer. Embedded antenna designs can include various antenna types that are built using one or more wires or thin metallic strips encapsulated into plastic device covers. Insert/injection molding methods can be used to encapsulate antenna structures in plastic device covers during fabrication of the plastic device covers.

Abstract: Antennas are provided which are constructed using one or more wires as radiating elements attached to a substrate or chip, wherein wire bonding methods can be used to attach and form loop profiles for the wires. The antennas can be integrally packaged with IC chips (e.g., IC transceivers, receivers, transmitters, etc.) to build integrated wireless or RF (radio frequency) communications systems.

Abstract: Printed antenna devices are provided, which can operate at RF and microwave frequencies, for example, while simultaneously providing antenna performance characteristics such as high gain/directivity/radiation efficiency, high bandwidth, hemispherical radiation patterns, impedance, etc., that render the antennas suitable for voice communication, data communication or radar applications, for example. Further, apparatus are provided for integrally packaging such printed antenna devices with IC (integrated circuit) chips (e.g., transceiver) to construct IC packages for, e.g., wireless communications applications.

Abstract: Antennas are provided which are constructed using one or more conductive via stubs as radiating elements formed in a substrate. The antennas can be integrally packaged with IC chips (e.g., IC transceivers, receivers, transmitters, etc.) to build integrated wireless or RF (radio frequency) communications systems.