Patents by Inventor Brian Girvin

Brian Girvin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11276915
    Abstract: Embodiments include apparatuses, methods, and systems including an electronic apparatus having a configurable sector cavity antenna integrated into a PCB. The configurable sector cavity antenna may include a first panel embedded within a first layer of the PCB along an edge of the first layer, and a second panel embedded within a second layer of the PCB along an edge of the second layer. The configurable sector cavity antenna may further include a fixed via wall to couple the first panel and the second panel along an inner edge of the first panel and the inner edge of the second panel, and a switchable via wall to selectively couple multiple interior points of the first panel and multiple interior points of the second panel.
    Type: Grant
    Filed: March 27, 2017
    Date of Patent: March 15, 2022
    Assignee: Intel Corporation
    Inventors: Jose Rodrigo Camacho Perez, Aycan Erentok, Huan-Sheng Hwang, Paul Beaucourt, Thomas H. Liu, Brian Girvin
  • Publication number: 20200153080
    Abstract: Embodiments include apparatuses, methods, and systems including an electronic apparatus having a configurable sector cavity antenna integrated into a PCB. The configurable sector cavity antenna may include a first panel embedded within a first layer of the PCB along an edge of the first layer, and a second panel embedded within a second layer of the PCB along an edge of the second layer. The configurable sector cavity antenna may further include a fixed via wall to couple the first panel and the second panel along an inner edge of the first panel and the inner edge of the second panel, and a switchable via wall to selectively couple multiple interior points of the first panel and multiple interior points of the second panel.
    Type: Application
    Filed: March 27, 2017
    Publication date: May 14, 2020
    Inventors: JOSE RODRIGO CAMACHO PEREZ, AYCAN ERENTOK, HUAN-SHENG HWANG, PAUL BEAUCOURT, THOMAS H. LIU, BRIAN GIRVIN
  • Patent number: 10516199
    Abstract: A wearable mobile device may include circuitry for transmissive communication, and a slotted cavity radiator in communication with the circuitry for transmissive communication to transmit or receive transmissive communication. In embodiments, the wearable mobile device may further include a pair of conductive faces between which the circuitry for transmissive communication is positioned and that bound a cavity of the slotted cavity radiator.
    Type: Grant
    Filed: January 26, 2017
    Date of Patent: December 24, 2019
    Assignee: North Inc.
    Inventors: Jose Rodrigo Camacho Perez, Aycan Erentok, Bryce D. Horine, Brian Girvin
  • Patent number: 10461402
    Abstract: An mobile device may include circuitry for transmissive communication and to operate with a ground reference. An antenna element may be in communication with the circuitry for transmissive communication to transmit or receive transmissive communication. A housing may house the circuitry for transmissive communication and the antenna element and may include a conductive circumferential case element. A coupling device may be electrically coupled to provide the ground reference over an elongate segment of the conductive circumferential case element.
    Type: Grant
    Filed: February 8, 2017
    Date of Patent: October 29, 2019
    Assignee: Intel Corporation
    Inventors: Aycan Erentok, Jose Rodrigo Camacho Perez, Brian Girvin
  • Publication number: 20180262226
    Abstract: Example customizable example customizable wearable electronic devices, and methods of assembling the same are disclosed. An example customizable wearable electronic device includes a housing bottom member, a housing top member including a radio frequency (RF) attenuating portion that includes a material that attenuates RF energy and an RF conducting portion that includes an electrically-conductive material, the housing top member separated from the housing bottom member by an electrical isolation gap member, an electrically-conductive contact to couple the RF conducting portion of the top housing member to a communication module in the customizable wearable electronic device, and a customization part selected from a plurality of different customization parts having respective different configurations, the selected customization part electrically coupled to the RF conducting portion of the housing top member when the selected customization part is assembled to the housing top member.
    Type: Application
    Filed: March 13, 2017
    Publication date: September 13, 2018
    Inventors: Aycan Erentok, John Groff, Huan-Sheng Hwang, Paul Beaucourt, Thomas H. Liu, Jose R. Camacho Perez, Brian Girvin
  • Patent number: 10075206
    Abstract: Example customizable example customizable wearable electronic devices, and methods of assembling the same are disclosed. An example customizable wearable electronic device includes a housing bottom member, a housing top member including a radio frequency (RF) attenuating portion that includes a material that attenuates RF energy and an RF conducting portion that includes an electrically-conductive material, the housing top member separated from the housing bottom member by an electrical isolation gap member, an electrically-conductive contact to couple the RF conducting portion of the top housing member to a communication module in the customizable wearable electronic device, and a customization part selected from a plurality of different customization parts having respective different configurations, the selected customization part electrically coupled to the RF conducting portion of the housing top member when the selected customization part is assembled to the housing top member.
    Type: Grant
    Filed: March 13, 2017
    Date of Patent: September 11, 2018
    Assignee: Intel Corporation
    Inventors: Aycan Erentok, John Groff, Huan-Sheng Hwang, Paul Beaucourt, Thomas H. Liu, Jose R. Camacho Perez, Brian Girvin
  • Publication number: 20180226711
    Abstract: An mobile device may include circuitry for transmissive communication and to operate with a ground reference. An antenna element may be in communication with the circuitry for transmissive communication to transmit or receive transmissive communication. A housing may house the circuitry for transmissive communication and the antenna element and may include a conductive circumferential case element. A coupling device may be electrically coupled to provide the ground reference over an elongate segment of the conductive circumferential case element.
    Type: Application
    Filed: February 8, 2017
    Publication date: August 9, 2018
    Inventors: Aycan Erentok, Jose Rodrigo Camacho Perez, Brian Girvin
  • Publication number: 20180212309
    Abstract: A wearable mobile device may include circuitry for transmissive communication, and a slotted cavity radiator in communication with the circuitry for transmissive communication to transmit or receive transmissive communication. In embodiments, the wearable mobile device may further include a pair of conductive faces between which the circuitry for transmissive communication is positioned and that bound a cavity of the slotted cavity radiator.
    Type: Application
    Filed: January 26, 2017
    Publication date: July 26, 2018
    Inventors: Jose Rodrigo Camacho Perez, Aycan Erentok, Bryce D. Horine, Brian Girvin
  • Publication number: 20070085516
    Abstract: The invention relates, in an embodiment, to a power supply module configured to be coupled to a power outlet to supply an operating voltage to a data processing device. The power supply module includes a set of signal connectors having at least a first signal connector. The set of signal connectors is configured to provide at least a portion of data received from the data processing device to devices external to the data processing device, whereby the power supply module is disposed in a flexibly-coupled, spaced-apart relationship relative to the data processing device.
    Type: Application
    Filed: June 30, 2005
    Publication date: April 19, 2007
    Inventors: Stephen Fenwick, John DiFonzo, Tang Tan, Brian Girvin