Abstract: A centerbody assembly includes a center tube, a forward bulkhead, an aft bulkhead, at least one baffle, and an outer skin. The center tube extends circumferentially about an axial centerline. The center tube extends between and to a first axial tube end and a second axial tube end. The forward bulkhead is mounted to the center tube at the first axial tube end. The aft bulkhead is mounted to the center tube at the second axial tube end. The at least one baffle extends axially from the forward bulkhead to the aft bulkhead. At least the forward bulkhead, the aft bulkhead, or the at least one baffle include one or more thermal beads. The outer skin circumscribes the center tube, the forward bulkhead, the aft bulkhead, and the at least one baffle to form an acoustic cavity radially inside the outer skin.

Abstract: In one embodiment, a single electrical power supply is used to interchangeably power either a single motherboard or dual motherboards. Switchable output power and individual sequencing may be provided to each motherboard using FETs, such that the power supply may respond to the sequencing of each motherboard as if it were dedicated to that motherboard. In a two motherboard system, power to the first motherboard is reduced by removing some output voltages from the first motherboard. Fault circuitry may also be provided so that a power related fault on one domain does not affect operation of the other motherboard.

Abstract: A system for receiving and supporting a plurality of devices connected to a network. The system comprises a rack having a front side providing access to a plurality of chassis bays for receiving a chassis and aligning a back end of the chassis for blind docking with an electrical power source. The chassis includes a power supply, a fan, and a front side providing access to a plurality of module bays for receiving a module and aligning a back end of the module for blind docking with the power supply. A compute module is received in a module bay and directly blind docked to the power supply. The system further includes at least one other module received in a module bay within the same chassis as the compute module and directly blind docked with the same power supply along with the compute module.

Abstract: In one embodiment, a single electrical power supply is used to interchangeably power either a single motherboard or dual motherboards. Switchable output power and individual sequencing may be provided to each motherboard using FETs, such that the power supply may respond to the sequencing of each motherboard as if it were dedicated to that motherboard. In a two motherboard system, power to the first motherboard is reduced by removing some output voltages from the first motherboard. Fault circuitry may also be provided so that a power related fault on one domain does not affect operation of the other motherboard.

Abstract: A system for receiving and supporting a plurality of devices connected to a network. The system comprises a rack having a front side providing access to a plurality of chassis bays for receiving a chassis and aligning a back end of the chassis for blind docking with an electrical power source. The chassis includes a power supply, a fan, and a front side providing access to a plurality of module bays for receiving a module and aligning a back end of the module for blind docking with the power supply. A compute module is received in a module bay and directly blind docked to the power supply. The system further includes at least one other module received in a module bay within the same chassis as the compute module and directly blind docked with the same power supply along with the compute module.