Abstract: Integrated multiple optical elements may be formed by bonding substrates containing such optical elements together or by providing optical elements on either side of the wafer substrate. The wafer is subsequently diced to obtain the individual units themselves. The optical elements may be formed lithographically, directly, or using a lithographically generated master to emboss the elements. Alignment features facilitate the efficient production of such integrated multiple optical elements, as well as post creation processing thereof on the wafer level.

Abstract: Integrated multiple optical elements may be formed by bonding substrates containing such optical elements together or by providing optical elements on either side of the wafer substrate. The wafer is subsequently diced to obtain the individual units themselves. The optical elements may be formed lithographically, directly, or using a lithographically generated master to emboss the elements. Alignment features facilitate the efficient production of such integrated multiple optical elements, as well as post creation processing thereof on the wafer level.

Abstract: An integrated optical imaging system includes a first substrate having first and second opposing surfaces, a second substrate having third and fourth opposing surfaces, a spacer between a substantially planar portion of the third surface of the second substrate and a substantially planar portion of the second surface of the first substrate, at least two of the spacer, the first substrate and the second substrate sealing an interior space between the third surface of the second substrate and the second surface of the first substrate, and an optical imaging system having n surfaces, where n is greater than or equal to two, at least two of the n surfaces of the optical imaging system are on respective ones of the first, second, third and fourth surfaces.

Abstract: A method for forming a camera including an integrated optical subsystem, includes aligning a plurality of second dies with a plurality of first dies, each first die having a second die aligned therewith, at least one of the plurality of first dies and the plurality of the second dies include a corresponding number of optical elements, securing aligned dies, and dividing secured aligned dies into a plurality of portions, a portion containing a first die, a second die and at least one optical element, thereby forming the integrated optical subsystem.

Abstract: An integrated optical imaging system includes a first substrate having first and second opposing surfaces, a second substrate having third and fourth opposing surfaces, a spacer between a substantially planar portion of the third surface of the second substrate and a substantially planar portion of the second surface of the first substrate, at least two of the spacer, the first substrate and the second substrate sealing an interior space between the third surface of the second substrate and the second surface of the first substrate, and an optical imaging system having n surfaces, where n is greater than or equal to two, at least two of the n surfaces of the optical imaging system are on respective ones of the first, second, third and fourth surfaces.

Abstract: Integrated multiple optical elements may be formed by bonding substrates containing such optical elements together or by providing optical elements on either side of the wafer substrate. The wafer is subsequently diced to obtain the individual units themselves. The optical elements may be formed lithographically, directly, or using a lithographically generated master to emboss the elements. Alignment features facilitate the efficient production of such integrated multiple optical elements, as well as post creation processing thereof on the wafer level.

Abstract: Integrated multiple optical elements may be formed by bonding substrates containing such optical elements together or by providing optical elements on either side of the wafer substrate. The wafer is subsequently diced to obtain the individual units themselves. The optical elements may be formed lithographically, directly, or using a lithographically generated master to emboss the elements. Alignment features facilitate the efficient production of such integrated multiple optical elements, as well as post creation processing thereof on the wafer level.

Abstract: Integrated multiple optical elements may be formed by bonding substrates containing such optical elements together or by providing optical elements on either side of the wafer substrate. The wafer is subsequently diced to obtain the individual units themselves. The optical elements may be formed lithographically, directly, or using a lithographically generated master to emboss the elements. Alignment features facilitate the efficient production of such integrated multiple optical elements, as well as post creation processing thereof on the wafer level.

Abstract: Integrated multiple optical elements may be formed by bonding substrates containing such optical elements together or by providing optical elements on either side of the wafer substrate. The wafer is subsequently diced to obtain the individual units themselves. The optical elements may be formed lithographically, directly, or using a lithographically generated master to emboss the elements. Alignment features facilitate the efficient production of such integrated multiple optical elements, as well as post creation processing thereof on the wafer level.

Abstract: Integrated multiple optical elements may be formed by bonding substrates containing such optical elements together or by providing optical elements on either side of the wafer substrate. The wafer is subsequently diced to obtain the individual units themselves. The optical elements may be formed lithographically, directly, or using a lithographically generated master to emboss the elements. Alignment features facilitate the efficient production of such integrated multiple optical elements, as well as post creation processing thereof on the wafer level.

Abstract: Integrated multiple optical elements may be formed by bonding substrates containing such optical elements together or by providing optical elements on either side of the wafer substrate. The wafer is subsequently diced to obtain the individual units themselves. The optical elements may be formed lithographically, directly, or using a lithographically generated master to emboss the elements. Alignment features facilitate the efficient production of such integrated multiple optical elements, as well as post creation processing thereof on the wafer level.

Abstract: Integrated multiple optical elements may be formed by bonding substrates containing such optical elements together or by providing optical elements on either side of the wafer substrate. The wafer is subsequently diced to obtain the individual units themselves. The optical elements may be formed lithographically, directly, or using a lithographically generated master to emboss the elements. Alignment features facilitate the efficient production of such integrated multiple optical elements, as well as post creation processing thereof on the wafer level.