Patents by Inventor Brian Harkness

Brian Harkness has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9346945
    Abstract: Filled silicone composition, in situ preparation and use thereof are provided. The composition comprises a mixture of (A) an in situ-prepared treated silica, (B) an in situ-prepared (siloxane-alkylene)-endblocked polydiorganosiloxane, (c) a cure catalyst and (D) a crosslinker. Moreover, the composition can be used as adhesive, coating and sealant.
    Type: Grant
    Filed: October 11, 2011
    Date of Patent: May 24, 2016
    Assignees: DOW CORNING CORPORATION, DOW CORNING (CHINA) HOLDING CO., LTD.
    Inventors: Lei Fang, Brian Harkness, Xiucuo Li, Lauren Tonge, James Tonge
  • Publication number: 20150051345
    Abstract: Filled silicone composition, in situ preparation and use thereof are provided. The composition comprises a mixture of (A) an in situ-prepared treated silica, (B) an in situ-prepared (siloxane-alkylene)-endblocked polydiorganosiloxane, (c) a cure catalyst and (D) a crosslinker. Moreover, the composition can be used as adhesive, coating and sealant.
    Type: Application
    Filed: October 11, 2011
    Publication date: February 19, 2015
    Inventors: Lei Fang, Brian Harkness, Xiucuo Li, Lauren Tonge, James Tonge
  • Patent number: 8734708
    Abstract: A method includes the steps of (I) fabricating a cured silicone product and (II) using the cured silicone product in a patterning technique. The cured silicone product is a reaction product of (A) a silicone cure package and (B) is a polar additive having a polyalkylene oxide functionality and a reactive functionality. The method is useful in soft lithography applications.
    Type: Grant
    Filed: October 23, 2008
    Date of Patent: May 27, 2014
    Assignee: Dow Corning Corporation
    Inventors: Wei Chen, Brian Harkness, Jae Woong Lim, Michael Stanga
  • Patent number: 8647964
    Abstract: A method for temporary wafer bonding employs a curable adhesive composition and a degradation agent combined with the curable adhesive composition. The adhesive composition may include (A) a polyorganosiloxane containing an average of at least two silicon-bonded unsaturated organic groups per molecule, (B) an organosilicon compound containing an average of at least two silicon-bonded hydrogen atoms per molecule in an amount sufficient to cure the composition, (C) a catalytic amount of a hydrosilylation catalyst, and (D) a base. The film prepared by curing the composition is degradable and removable by heating.
    Type: Grant
    Filed: December 15, 2010
    Date of Patent: February 11, 2014
    Assignee: Dow Corning Corporation
    Inventor: Brian Harkness
  • Publication number: 20130023109
    Abstract: A method for temporary wafer bonding employs a curable adhesive composition and a degradation agent combined with the curable adhesive composition. The adhesive composition may include (A) a polyorganosiloxane containing an average of at least two silicon-bonded unsaturated organic groups per molecule, (B) an organosilicon compound containing an average of at least two silicon-bonded hydrogen atoms per molecule in an amount sufficient to cure the composition, (C) a catalytic amount of a hydrosilylation catalyst, and (D) a base. The film prepared by curing the composition is degradable and removable by heating.
    Type: Application
    Filed: December 15, 2010
    Publication date: January 24, 2013
    Inventor: Brian Harkness
  • Publication number: 20120256303
    Abstract: A method of preparing a patterned film on a substrate includes applying a silicone composition onto a substrate to form a film of the silicone composition. A portion of the film is exposed to radiation to produce a partially exposed film having an exposed region and a non-exposed region. The partially exposed film is heated for a sufficient amount of time and at a sufficient temperature to substantially insolubilize the exposed region in a developing solvent that includes a siloxane component. The non-exposed region of the partially exposed film is removed with the developing solvent to reveal a film-free region on the substrate and to form the patterned film including the exposed region that remains on the substrate. The film-free regions is substantially free of residual silicone due to the presence of the siloxane component in the developing solvent.
    Type: Application
    Filed: June 12, 2012
    Publication date: October 11, 2012
    Inventors: Herman C.G.D.C. MEYNEN, Brian HARKNESS
  • Patent number: 8258502
    Abstract: A composition includes: (I) an alkenyl functional, phenyl-containing polyorganosiloxane, an Si—H functional phenyl-containing polyorganosiloxane, or a combination thereof; (II) a hydrogendiorganosiloxy terminated oligodiphenylsiloxane having specific molecular weight, an alkenyl-functional, diorganosiloxy-terminated oligodiphenylsiloxane having specific molecular weight, or a combination thereof; and (III) a hydrosilylation catalyst. A light emitting device is made by applying the composition onto a light source followed by curing. The composition provides a cured material with mechanical properties suited for use as an encapsulant for a light emitting device.
    Type: Grant
    Filed: February 1, 2007
    Date of Patent: September 4, 2012
    Assignee: Dow Corning Corporation
    Inventors: Makoto Yoshitake, Masashi Murakami, Yoshitsugu Morita, Tomoko Kato, Hiroji Enami, Masayoshi Terada, Brian Harkness, Tammy Cheng, Michelle Cummings, Ann Norris, Malinda Howell
  • Patent number: 8227181
    Abstract: A method of preparing a patterned film on a substrate includes applying a silicone composition onto a substrate to form a film of the silicone composition. A portion of the film is exposed to radiation to produce a partially exposed film having an exposed region and a non-exposed region. The partially exposed film is heated for a sufficient amount of time and at a sufficient temperature to substantially insolubilize the exposed region in a developing solvent that includes a siloxane component. The non-exposed region of the partially exposed film is removed with the developing solvent to reveal a film-free region on the substrate and to form the patterned film including the exposed region that remains on the substrate. The film-free regions is substantially free of residual silicone due to the presence of the siloxane component in the developing solvent.
    Type: Grant
    Filed: August 8, 2007
    Date of Patent: July 24, 2012
    Assignee: Dow Corning Corporation
    Inventors: Herman C. G. D. C. Meynen, Brian Harkness
  • Publication number: 20100276721
    Abstract: A composition includes: (I) an alkenyl functional, phenyl-containing polyorganosiloxane, an Si—H functional phenyl-containing polyorganosiloxane, or a combination thereof; (II) a hydrogendiorganosiloxy terminated oligodiphenylsiloxane having specific molecular weight, an alkenyl-functional, diorganosiloxy-terminated oligodiphenylsiloxane having specific molecular weight, or a combination thereof; and (III) a hydrosilylation catalyst. A light emitting device is made by applying the composition onto a light source followed by curing. The composition provides a cured material with mechanical properties suited for use as an encapsulant for a light emitting device.
    Type: Application
    Filed: February 1, 2007
    Publication date: November 4, 2010
    Applicants: DOW CORNING CORPORATION, DOW CORNING TORAY CO., LTD.
    Inventors: Makoto Yoshitake, Masashi Murakami, Yoshitsugu Morita, Tomoko Kato, Hiroji Enami, Masayoshi Terada, Brian Harkness, Tammy Cheng, Michelle Cummings, Ann Norris, Malinda Howell
  • Publication number: 20100206470
    Abstract: A method includes the steps of (I) fabricating a cured silicone product and (II) using the cured silicone product in a patterning technique. The cured silicone product is a reaction product of (A) a silicone cure package and (B) is a polar additive having a polyalkylene oxide functionality and a reactive functionality. The method is useful in soft lithography applications.
    Type: Application
    Filed: October 23, 2008
    Publication date: August 19, 2010
    Inventors: Wei Chen, Brian Harkness, Jae Woong Lim, Michael Stanga
  • Publication number: 20100178472
    Abstract: A method of preparing a patterned film on a substrate includes applying a silicone composition onto a substrate to form a film of the silicone composition. A portion of the film is exposed to radiation to produce a partially exposed film having an exposed region and a non-exposed region. The partially exposed film is heated for a sufficient amount of time and at a sufficient temperature to substantially insolubilize the exposed region in a developing solvent that includes a siloxane component. The non-exposed region of the partially exposed film is removed with the developing solvent to reveal a film-free region on the substrate and to form the patterned film including the exposed region that remains on the substrate. The film-free regions is substantially free of residual silicone due to the presence of the siloxane component in the developing solvent.
    Type: Application
    Filed: August 8, 2007
    Publication date: July 15, 2010
    Inventors: Herman C.G.D.C. Meynen, Brian Harkness
  • Patent number: 7517808
    Abstract: A method for reworking semiconductor materials includes: (i) applying a silicone composition to a surface of a substrate to form a film, (ii) exposing a portion of the film to radiation to produce a partially exposed film having non-exposed regions covering a portion of the surface and exposed regions covering the remainder of the surface; (iii) heating the partially exposed film for an amount of time such that the exposed regions are substantially insoluble in a developing solvent and the non-exposed regions are soluble in the developing solvent; (iv) removing the non-exposed regions of the heated film with the developing solvent to form a patterned film; (v) heating the patterned film for an amount of time sufficient to form a cured silicone layer; and (vi) removing all or a portion of the cured silicone layer by exposure to an anhydrous etching solution including an organic solvent and abase.
    Type: Grant
    Filed: July 28, 2003
    Date of Patent: April 14, 2009
    Assignee: Dow Corning Corporation
    Inventors: Gregory Becker, Geoffrey Gardner, Brian Harkness
  • Publication number: 20080090380
    Abstract: A method for temporary wafer bonding employs an addition reaction curable adhesive composition. The adhesive composition may include (A) a polyorganosiloxane containing an average of at least two silicon-bonded unsaturated organic groups per molecule, (B) an organosilicon compound containing an average of at least two silicon-bonded hydrogen atoms per molecule in an amount sufficient to cure the composition, (C) a catalytic amount of a hydrosilylation catalyst, and (D) a solvent. The film prepared by curing the composition is removable with an etching solution.
    Type: Application
    Filed: February 7, 2006
    Publication date: April 17, 2008
    Inventors: Geoffrey Gardner, Brian Harkness
  • Publication number: 20070290387
    Abstract: A lithography method includes the steps of: A) filling a mold having a patterned surface with a phase change composition at a temperature above the phase change temperature of the phase change composition; B) hardening the phase change composition to form a patterned feature; C) separating the mold and the patterned feature; optionally D) etching the patterned feature; optionally E) cleaning the mold; and optionally F) repeating steps A) to D) reusing the mold. The PCC may include an organofunctional silicone wax.
    Type: Application
    Filed: September 23, 2005
    Publication date: December 20, 2007
    Inventors: Wei Chen, Brian Harkness, Joan Sudbury-Holtschlag, Lenin Petroff
  • Publication number: 20070269747
    Abstract: A method includes the steps of: A) filling a silicone mold having a patterned surface with a curable (meth)acrylate formulation, B) curing the curable (meth)acrylate formulation to form a patterned feature, C) separating the silicone mold and the patterned feature, optionally D) etching the patterned feature, and optionally E) repeating steps A) to D) reusing the silicone mold. The curable (meth)acrylate formulation contains a fluorofunctional (meth)acrylate, a (meth)acrylate, and a photoinitiator.
    Type: Application
    Filed: August 31, 2005
    Publication date: November 22, 2007
    Inventors: Maneesh Bahadur, Wei Chen, John Albaugh, Brian Harkness, James Tonge
  • Publication number: 20060286809
    Abstract: A method for reworking semiconductor materials includes: (i) applying a silicone composition to a surface of a substrate to form a film, (ii) exposing a portion of the film to radiation to produce a partially exposed film having non-exposed regions covering a portion of the surface and exposed regions covering the remainder of the surface; (iii) heating the partially exposed film for an amount of time such that the exposed regions are substantially insoluble in a developing solvent and the non-exposed regions are soluble in the developing solvent; (iv) removing the nonexposed regions of the heated film with the developing solvent to form a patterned film; (v) heating the patterned film for an amount of time sufficient to form a cured silicone layer, and (vi) removing all or a portion of the cured silicone layer by exposure to an anhydrous etching solution including an organic solvent and a base.
    Type: Application
    Filed: July 28, 2003
    Publication date: December 21, 2006
    Applicant: DOW CORNING CORPORATION
    Inventors: Gregory Becker, Geoffrey Gardner, Brian Harkness
  • Patent number: 6924346
    Abstract: Silicone resins comprising 5 to 50 mole % of (PhSiO3-x)/2(OH)x) units and 50 to 95 mole % (HSiO(3-x)/2(OH)x), where Ph is a phenyl group, x has a value of 0, 1 or 2 and wherein the cured silicone resin has a critical surface free energy of 30 dynes/cm or higher. These resins are useful as etch stop layers for organic dielectric materials having a critical surface free energy of 40 dynes/cm or higher.
    Type: Grant
    Filed: October 4, 2002
    Date of Patent: August 2, 2005
    Assignee: Dow Corning Corporation
    Inventors: Ronald Boisvert, Stelian Grigoras, David Ha, Brian Harkness, Craig Yeakle
  • Publication number: 20040186223
    Abstract: Silicone resins comprising 5 to 50 mole % of (PhSiO3−x)/2(OH)x) units and 50 to 95 mole % (HSiO(3−x)/2(OH)x), where Ph is a phenyl group, x has a value of 0, 1 or 2 and wherein the cured silicone resin has a critical surface free energy of 30 dynes/cm or higher. These resins are useful as etch stop layers for organic dielectric materials having a critical surface free energy of 40 dynes/cm or higher.
    Type: Application
    Filed: April 1, 2004
    Publication date: September 23, 2004
    Inventors: Ronald Boisvert, Stelian Grigoras, David Ha, Brian Harkness, Craig Yeakle
  • Patent number: 6265086
    Abstract: A method for selective electroless metal deposition on a substrate. The method comprises applying a patterned coating comprising a silyl hydride functional resin onto a substrate. An electroless plating solution comprising a metal ion is then applied onto the silyl hydride functional resin coating to deposit a patterned metal film on the substrate. The process of the invention is especially useful in the electronics industry.
    Type: Grant
    Filed: June 8, 1999
    Date of Patent: July 24, 2001
    Assignee: Dow Corning Limited
    Inventor: Brian Harkness
  • Patent number: 6001928
    Abstract: A process for which making silicone-filler mixtures which comprises effecting the ring-opening polymerisation of a cyclosiloxane with a phosphazene base in the presence of a filler and of water, preferably from 0.5 mil to 10 mols of water per mol of phosphazene base. The filler is preferably selected from silica, alumina, titanium dioxide, carbon black and calcium carbonate, present in an amount of from 1 to 200 parts by weight per 100 parts by weight of cyclosiloxane. An agent or conditions which inhibit catalyst activity may initially be present (e.g. carbon dioxide or excess water), and polymerisation may be initiated by reducing the effect of the inhibiting agent or conditions (e.g. by heating). Silicon-elastomers produced by curing such silicone polymer-filler mixtures are also claimed.
    Type: Grant
    Filed: February 20, 1998
    Date of Patent: December 14, 1999
    Assignee: Dow Corning Limited
    Inventors: Brian Harkness, Richard Taylor