Abstract: A printhead assembly includes a carrier having a first side and a second side contiguous with the first side, a plurality of printhead dies each mounted on the first side of the carrier, an electrical circuit including a first portion disposed on the first side of the carrier and a second portion disposed on the second side of the carrier, and a plurality of electrical connectors each electrically coupled to the first portion of the electrical circuit and one of the printhead dies. The electrical circuit has a plurality of openings defined in the first portion thereof such that each of the openings are sized to accommodate one of the printhead dies, and has a first side facing the carrier and a second side opposite the first side thereof such that each of the electrical connectors are electrically coupled to the second side of the electrical circuit and one of the printhead dies.

Abstract: A fluid ejection assembly includes a substrate and a plurality of fluid ejection devices each mounted on the substrate. The substrate includes a frame formed of a first material and a body formed of a second material such that the body substantially surrounds the frame and forms a first side and a second side of the substrate with each of the fluid ejection devices being mounted on the first side of the substrate.

Abstract: A fluid ejection assembly includes a substrate and a plurality of fluid ejection devices each mounted on the substrate. The substrate includes a frame formed of a first material and a body formed of a second material such that the body substantially surrounds the frame and forms a first side and a second side of the substrate with each of the fluid ejection devices being mounted on the first side of the substrate.

Abstract: A fluid ejection assembly includes a substrate including a plurality of layers and having a plurality of fluid passages extending through the plurality of layers, with each of the fluid passages having a support extending between opposite sides thereof, and a plurality of fluid ejection devices each mounted on the substrate and communicating with a respective one of the fluid passages.

Abstract: An ink-jet printhead is provided having a thin film substrate comprising a plurality of thin film layers; a plurality of ink firing heater resistors defined in said plurality of thin film layers; a polymer fluid barrier layer; and a carbon rich layer disposed on said plurality of thin film layers, for bonding said polymer fluid barrier layer to said thin film substrate.

Abstract: An ink-jet printhead is provided having a thin film substrate comprising a plurality of thin film layers; a plurality of ink firing heater resistors defined in said plurality of thin film layers; a polymer fluid barrier layer; and a carbon rich layer disposed on said plurality of thin film layers, for bonding said polymer fluid barrier layer to said thin film substrate.

Abstract: A wide-array inkjet printhead assembly includes a carrier having a first side and a second side contiguous with the first side, and a plurality of printhead dies each mounted on the first side of the carrier. An electrical circuit is disposed on the first side and the second side of the carrier. As such, a plurality of electrical connectors are each electrically coupled to the electrical circuit and one of the printhead dies.

Abstract: A wide-array inkjet printhead assembly includes a carrier having a first side and a second side contiguous with the first side, and a plurality of printhead dies each mounted on the first side of the carrier. An electrical circuit is disposed on the first side and the second side of the carrier. As such, a plurality of electrical connectors are each electrically coupled to the electrical circuit and one of the printhead dies.

Abstract: A method of forming an inkjet printhead assembly includes providing a substrate, disposing a planarization layer on a face of the substrate such that a first surface of the planarization layer contacts the face of the substrate, mechanically planarizing a second surface of the planarization layer opposite the first surface, including reducing a thickness of at least a portion of the first planarization layer, and mounting a plurality of printhead dies on the second surface of the planarization layer.

Abstract: A fluid ejection assembly includes a carrier including a substrate and an electrical circuit with the substrate having a first side and a second side opposite the first side and the electrical circuit being disposed on the second side of the substrate, a fluid ejection device mounted on the first side of the substrate, and at least one electrical connector electrically coupled to the electrical circuit and the fluid ejection device, wherein the electrical circuit includes a printed circuit board such that the printed circuit board and the substrate both have at least one fluid passage extending therethrough with the at least one fluid passage communicating with the first side of the substrate and the fluid ejection device.

Abstract: A fluid ejection assembly includes a substrate including a plurality of layers and having a plurality of fluid passages extending through the plurality of layers, with each of the fluid passages having a support extending between opposite sides thereof, and a plurality of fluid ejection devices each mounted on the substrate and communicating with a respective one of the fluid passages.

Abstract: A fluid ejection assembly includes a substrate and a plurality of fluid ejection devices each mounted on the substrate. The substrate includes a frame formed of a first material and a body formed of a second material such that the body substantially surrounds the frame and forms a first side and a second side of the substrate with each of the fluid ejection devices being mounted on the first side of the substrate.

Abstract: An inkjet printhead assembly includes a carrier and a plurality of printhead dies. The carrier includes a substrate and an electrical circuit. The substrate has a first side and a second side such that the electrical circuit is disposed on the second side of the substrate. The printhead dies are each mounted on the first side of the substrate and electrically coupled to the electrical circuit Thus, the substrate provides support for the printhead dies while the substrate and the electrical circuit together accommodate fluidic and electrical routing to the printhead dies.

Abstract: A wide-array inkjet printhead assembly includes a carrier having a first side and a second side contiguous with the first side, and a plurality of printhead dies each mounted on the first side of the carrier. An electrical circuit is disposed on the first side and the second side of the carrier. As such, a plurality of electrical connectors are each electrically coupled to the electrical circuit and one of the printhead dies.

Abstract: A wide-array inkjet printhead assembly includes a carrier and a plurality of printhead dies each mounted on the carrier. The carrier includes a substructure and a substrate mounted on the substructure. The substrate includes a plurality of layers and has a plurality of conductive paths extending therethrough. As such, each of the printhead dies are mounted on the substrate and electrically coupled to at least one of the conductive paths of the substrate.

Abstract: An inkjet printhead assembly includes a substrate having a non-planar surface and a plurality of adhesive quantities each disposed on the non-planar surface of the substrate. As such, a plurality of printhead dies are each adhered to the non-planar surface of the substrate by one of the adhesive quantities. A thickness of at least one of the adhesive quantities varies from the thickness of another of the adhesive quantities such that the thickness of the adhesive quantities compensates for the non-planar surface of the substrate. Thus, the adhesive quantities support the printhead dies and establish a substantially coplanar relationship among the printhead dies.

Abstract: A wide-array inkjet printhead assembly includes a carrier and a printhead die. The carrier includes a substrate and an electrical circuit. The substrate has a first side and a second side such that the electrical circuit is disposed on the second side of the substrate. The printhead die is mounted on the first side of the substrate and electrically coupled to the electrical circuit. Thus, electrical connection is established between the first side of the substrate and second side of the substrate.

Abstract: A wide-array inkjet printhead assembly includes a carrier and a printhead die. The carrier includes a substrate and an electrical circuit. The substrate has a first side and a second side such that the electrical circuit is disposed on the second side of the substrate. The printhead die is mounted on the first side of the substrate and electrically coupled to the electrical circuit. Thus, electrical connection is established between the first side of the substrate and second side of the substrate.

Abstract: An inkjet printhead includes a compact substrate of increased stability and structural integrity to provide a high resolution 600 dot-per-inch nozzle array having a one-half inch swath. A plurality of ink vaporization chambers are respectively aligned with the nozzles in two longitudinal columns, one column extending longitudinally along one edge of the substrate and a second column extending longitudinally along an opposite edge of the substrate, with ink feed channels communicating through an ink passage from an underside of the substrate around both edges of the substrate to the vaporization chambers. The ink feed channels have thereby been eliminated from the central portion of the substrate, and replaced by the ink feed channels at the edges of the substrate.

Abstract: A technique for improving lamination quality and for controlling NCA in an ink-jet printhead. With respect to lamination quality, printhead regions are identified where it is desirable to improve planarity or to reduce the likelihood of corner lift or barrier/orifice plate delamination. Planarization is accomplished by the insertion of a suitably configured composition of gold, metal-2 or metal-3 into an identified region in the thin film substrate, thereby eliminating substantially delamination between ink barrier layer and substrate. Substantial NCA control is achieved when a similarly configured composition is inserted into the thin film substrate to achieve planarization in the printhead region near the ink drop generators.