Patents by Inventor Brian J. Long
Brian J. Long has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11933453Abstract: A system includes at least one article of personal protective equipment, one or more industrial devices, an industrial controller device configured to output industrial controller data indicative of one or more attributes of the one or more industrial devices, and a computing device. The computing devices is configured to determine a set of one or more safety rules corresponding to a work environment at the first time and determine a change in an attribute of the one or more attributes of the one or more industrial devices. The computing device is further configured to identify an updated set of one or more worker safety rules corresponding to the work environment at the second time and determine whether the status of at least one article of personal protective equipment satisfies the updated set of one or more worker safety rules.Type: GrantFiled: September 19, 2019Date of Patent: March 19, 2024Assignee: 3M Innovative Properties CompanyInventors: Brian J. Swift, Andrew W. Long, David R. Stein
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Patent number: 11246217Abstract: Electronic device package technology is disclosed. In one example, a connector for coupling an electronics sub-assembly to an electronics assembly includes a connector body. The connector body has a sub-assembly interface and a circuit board interface. The connector body has at least one passive electronic component that is necessary for operating the sub-assembly, thereby maximizing available space for computational components on the sub-assembly. The connector body can comprise two separate bodies wherein the passives are contained between the bodies. At least one extension cable can electrically couple the connector to the sub-assembly. A method of making an electronics assembly, capable of receiving a sub-assembly via a connector, comprises providing an assembly circuit board having an electrically coupled connector with at least one passive electronic component.Type: GrantFiled: October 1, 2016Date of Patent: February 8, 2022Assignee: Intel CorporationInventor: Brian J. Long
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Patent number: 11147153Abstract: Aspects of the embodiments include an edge card and methods of making the same. The edge card can include a printed circuit board (PCB) comprising a first end and a second end, the first end comprising a plurality of metal contact fingers configured to interface with an edge connector, and the second end comprising a through-hole configured to mate with a post of a screw, the PCB further comprising an aperture proximate the second end of the PCB. The PCB can also include a thermal conduction element secured to the PCB, the thermal conduction element supporting an integrated circuit package, the integrated circuit package received by the aperture, wherein the thermal conduction element contacts the PCB proximate the through-hole and the thermal conduction element is configured to conduct heat from the integrated circuit towards the second portion of the printed circuit board.Type: GrantFiled: June 18, 2020Date of Patent: October 12, 2021Assignee: Intel CorporationInventor: Brian J. Long
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Patent number: 10937464Abstract: A case suitable for solid state memory is described that offers enhanced cooling. In one example, a memory case includes a base, a cover having a plurality of fins on a top of the cover, channels between the fins, defined by the fins, and a ramp extending from a front on the top of the cover to the channels, and an inner cavity defined by the base and the cover to house a solid state memory.Type: GrantFiled: March 17, 2017Date of Patent: March 2, 2021Assignee: Intel CorporationInventor: Brian J. Long
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Publication number: 20200323076Abstract: Aspects of the embodiments include an edge card and methods of making the same. The edge card can include a printed circuit board (PCB) comprising a first end and a second end, the first end comprising a plurality of metal contact fingers configured to interface with an edge connector, and the second end comprising a through-hole configured to mate with a post of a screw, the PCB further comprising an aperture proximate the second end of the PCB. The PCB can also include a thermal conduction element secured to the PCB, the thermal conduction element supporting an integrated circuit package, the integrated circuit package received by the aperture, wherein the thermal conduction element contacts the PCB proximate the through-hole and the thermal conduction element is configured to conduct heat from the integrated circuit towards the second portion of the printed circuit board.Type: ApplicationFiled: June 18, 2020Publication date: October 8, 2020Applicant: Intel CorporationInventor: Brian J. Long
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Patent number: 10729000Abstract: Aspects of the embodiments include an edge card and methods of making the same. The edge card can include a printed circuit board (PCB) comprising a first end and a second end, the first end comprising a plurality of metal contact fingers configured to interface with an edge connector, and the second end comprising a through-hole configured to mate with a post of a screw, the PCB further comprising an aperture proximate the second end of the PCB. The PCB can also include a thermal conduction element secured to the PCB, the thermal conduction element supporting an integrated circuit package, the integrated circuit package received by the aperture, wherein the thermal conduction element contacts the PCB proximate the through-hole and the thermal conduction element is configured to conduct heat from the integrated circuit towards the second portion of the printed circuit board.Type: GrantFiled: September 28, 2016Date of Patent: July 28, 2020Assignee: Intel CorporationInventor: Brian J. Long
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Patent number: 10681817Abstract: Aspects of the disclosure are directed to an edge card that includes a printed circuit board having a top side and a bottom side. The top side of the printed circuit board can include one or more top-side circuit components, and a plurality of top-side metal contact fingers, at least some of the top-side metal contact fingers electrically connected to at least one of the one or more circuit components. The bottom side of the printed circuit board can include one or more bottom-side circuit components. The bottom side of the printed circuit board can also include a substrate interposer having a top side and a bottom side. The top side of the substrate interposer can include one or more passive circuit components at least partially embedded in the substrate interposer, and one or more solder balls arranged around the one or more passive circuit components.Type: GrantFiled: September 27, 2016Date of Patent: June 9, 2020Assignee: Intel CorporationInventor: Brian J. Long
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Publication number: 20200174533Abstract: A case suitable for solid state memory is described that offers enhanced cooling. In one example, a memory case includes a base, a cover having a plurality of fins on a top of the cover, channels between the fins, defined by the fins, and a ramp extending from a front on the top of the cover to the channels, and an inner cavity defined by the base and the cover to house a solid state memory.Type: ApplicationFiled: March 17, 2017Publication date: June 4, 2020Inventor: Brian J. LONG
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Patent number: 10490516Abstract: Techniques and mechanisms to facilitate connection with one or more integrated circuit (IC) dies of a packaged device. In an embodiment, the packaged device includes a first substrate coupled to a first side of a package, and a second substrate coupled to a second side of the package opposite the first side. Circuitry, coupled via the first substrate to one or more IC dies disposed in the package, includes a circuit structure disposed at a cantilever portion of the first substrate. The cantilever portion extends past one or both of an edge of the first side and an edge of the second side. In another embodiment, a hardware interface disposed on the second substrate enables coupling of the packaged device to another device.Type: GrantFiled: January 12, 2018Date of Patent: November 26, 2019Assignee: Intel CorporationInventors: John G. Meyers, Bilal Khalaf, Sireesha Gogineni, Brian J. Long
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Publication number: 20190215964Abstract: Aspects of the disclosure are directed to an edge card that includes a printed circuit board having a top side and a bottom side. The top side of the printed circuit board can include one or more top-side circuit components, and a plurality of top-side metal contact fingers, at least some of the top-side metal contact fingers electrically connected to at least one of the one or more circuit components. The bottom side of the printed circuit board can include one or more bottom-side circuit components. The bottom side of the printed circuit board can also include a substrate interposer having a top side and a bottom side. The top side of the substrate interposer can include one or more passive circuit components at least partially embedded in the substrate interposer, and one or more solder balls arranged around the one or more passive circuit components.Type: ApplicationFiled: September 27, 2016Publication date: July 11, 2019Applicant: Intel CorporationInventor: Brian J. Long
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Publication number: 20190215960Abstract: Electronic device package technology is disclosed. In one example, a connector for coupling an electronics sub-assembly to an electronics assembly includes a connector body. The connector body has a sub-assembly interface and a circuit board interface. The connector body has at least one passive electronic component that is necessary for operating the sub-assembly, thereby maximizing available space for computational components on the sub-assembly. The connector body can comprise two separate bodies wherein the passives are contained between the bodies. At least one extension cable can electrically couple the connector to the sub-assembly. A method of making an electronics assembly, capable of receiving a sub-assembly via a connector, comprises providing an assembly circuit board having an electrically coupled connector with at least one passive electronic component.Type: ApplicationFiled: October 1, 2016Publication date: July 11, 2019Applicant: Intel CorporationInventor: Brian J. LONG
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Publication number: 20190200446Abstract: Aspects of the embodiments include an edge card and methods of making the same. The edge card can include a printed circuit board (PCB) comprising a first end and a second end, the first end comprising a plurality of metal contact fingers configured to interface with an edge connector, and the second end comprising a through-hole configured to mate with a post of a screw, the PCB further comprising an aperture proximate the second end of the PCB. The PCB can also include a thermal conduction element secured to the PCB, the thermal conduction element supporting an integrated circuit package, the integrated circuit package received by the aperture, wherein the thermal conduction element contacts the PCB proximate the through-hole and the thermal conduction element is configured to conduct heat from the integrated circuit towards the second portion of the printed circuit board.Type: ApplicationFiled: September 28, 2016Publication date: June 27, 2019Applicant: Intel CorporationInventor: Brian J. Long
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Publication number: 20180138133Abstract: Techniques and mechanisms to facilitate connection with one or more integrated circuit (IC) dies of a packaged device. In an embodiment, the packaged device includes a first substrate coupled to a first side of a package, and a second substrate coupled to a second side of the package opposite the first side. Circuitry, coupled via the first substrate to one or more IC dies disposed in the package, includes a circuit structure disposed at a cantilever portion of the first substrate. The cantilever portion extends past one or both of an edge of the first side and an edge of the second side. In another embodiment, a hardware interface disposed on the second substrate enables coupling of the packaged device to another device.Type: ApplicationFiled: January 12, 2018Publication date: May 17, 2018Inventors: John G. Meyers, Bilal Khalaf, Sireesha Gogineni, Brian J. Long
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Patent number: 9871007Abstract: Techniques and mechanisms to facilitate connection with one or more integrated circuit (IC) dies of a packaged device. In an embodiment, the packaged device includes a first substrate coupled to a first side of a package, and a second substrate coupled to a second side of the package opposite the first side. Circuitry, coupled via the first substrate to one or more IC dies disposed in the package, includes a circuit structure disposed at a cantilever portion of the first substrate. The cantilever portion extends past one or both of an edge of the first side and an edge of the second side. In another embodiment, a hardware interface disposed on the second substrate enables coupling of the packaged device to another device.Type: GrantFiled: September 25, 2015Date of Patent: January 16, 2018Assignee: Intel CorporationInventors: John G. Meyers, Bilal Khalaf, Sireesha Gogineni, Brian J. Long
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Patent number: 9867276Abstract: Electronic device and housing for such devices are described and claimed. In one example a housing comprises a first end cap dimensioned to fit within a first open end of the housing and comprising a first bracket having a first cam surface positioned to engage the second surface of the printed circuit board when the first end cap is inserted into the first open end of the housing. Inserting the first end cap into the first open end of the housing causes the first cam surface to urge the printed circuit board in a direction which compresses the first heat generating component against an interior surface of the housing.Type: GrantFiled: September 25, 2015Date of Patent: January 9, 2018Assignee: Intel CorporationInventors: Paul J. Gwin, Brian J. Long
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Publication number: 20170092602Abstract: Techniques and mechanisms to facilitate connection with one or more integrated circuit (IC) dies of a packaged device. In an embodiment, the packaged device includes a first substrate coupled to a first side of a package, and a second substrate coupled to a second side of the package opposite the first side. Circuitry, coupled via the first substrate to one or more IC dies disposed in the package, includes a circuit structure disposed at a cantilever portion of the first substrate. The cantilever portion extends past one or both of an edge of the first side and an edge of the second side. In another embodiment, a hardware interface disposed on the second substrate enables coupling of the packaged device to another device.Type: ApplicationFiled: September 25, 2015Publication date: March 30, 2017Inventors: John G. Meyers, Bilal Khalaf, Sireesha Gogineni, Brian J. Long
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Publication number: 20170094772Abstract: Electronic devices and housings for such devices are described and claimed.Type: ApplicationFiled: September 25, 2015Publication date: March 30, 2017Applicant: Intel CorporationInventors: Paul J. Gwin, Brian J. Long
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Patent number: 8353176Abstract: In some embodiments, a cooling device may be mounted to a portion of a chassis of an electronic system, wherein the cooling device may be releasably and pivotably attached to the chassis in at least an open position to permit access to components within the electronic system and a closed position to permit installation of a cover on the chassis. Other embodiments are disclosed and claimed.Type: GrantFiled: December 31, 2009Date of Patent: January 15, 2013Assignee: Intel CorporationInventors: Paul J. Gwin, Brian J. Long
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Patent number: 7760500Abstract: In some embodiments, a cooling device may be mounted to a portion of a chassis of an electronic system, wherein the cooling device may be releasably and pivotably attached to the chassis in at least an open position to permit access to components within the electronic system and a closed position to permit installation of a cover on the chassis. Other embodiments are disclosed and claimed.Type: GrantFiled: March 12, 2008Date of Patent: July 20, 2010Assignee: Intel CorporationInventors: Paul J. Gwin, Brian J. Long
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Patent number: 7748229Abstract: In some embodiments, a cooling device may be mounted to a portion of a chassis of an electronic system, wherein the cooling device may be releasably and pivotably attached to the chassis in at least an open position to permit access to components within the electronic system and a closed position to permit installation of a cover on the chassis. Other embodiments are disclosed and claimed.Type: GrantFiled: March 12, 2008Date of Patent: July 6, 2010Assignee: Intel CorporationInventors: Paul J. Gwin, Brian J. Long