Abstract: A vehicle monitoring device includes a camera or other optical sensor configured to be disposed at a trailing end of a first vehicle system. The camera or other optical sensor is configured to output one or more images or video of a field of view behind the first vehicle system. The monitoring device also includes a controller configured to receive output from one or more sensors and to activate the camera or other optical sensor to output the one or more images or video based on the output from the one or more sensors. The output from the one or more sensors indicates one or more of a change in movement of the first vehicle system, a temperature, an acoustic sound, or movement of a second vehicle system.

Abstract: A system is provided that may include a first communication controller that may communicate with a vehicle system formed from two or more vehicles. The first communication controller may operate in different modes, including a first mode to control movement of the vehicle system without repeating any control signals communicated between the vehicles, and in a second mode to monitor different frequencies for receipt of the control signals, receive and repeat a first control signal of the control signals at a first frequency, and receive and repeats a second control signal of the control signals at a second frequency. The first communication controller may also operate in a third mode in which the first communication controller may monitor the first frequency but not the second frequency for the first control signal, receives the first control signal at the first frequency, and repeats the first control signal at the first frequency.

Abstract: Computer-implemented methods and systems for determining a configuration for a light scattering inspection system are provided. One computer-implemented method includes determining a three-dimensional map of signal-to-noise ratio values for data that would be acquired for a specimen and a potential defect on the specimen by the light scattering inspection system across a scattering hemisphere of the inspection system. The method also includes determining one or more portions of the scattering hemisphere in which the signal-to-noise ratio values are higher than in other portions of the scattering hemisphere based on the three-dimensional map. In addition, the method includes determining a configuration for a detection subsystem of the inspection system based on the one or more portions of the scattering hemisphere.

Abstract: A thermal processing method is described in which a temperature response of a substrate may be controlled during a heat-up phase or a cool-down phase, or during both phases. This reduces the thermal budget of the substrate and improves the quality and performance of devices formed on the substrate. In particular, by controlling the rate of heat transfer between the substrate and a thermal reservoir (e.g., a water-cooled reflector plate assembly), the temperature response of the substrate may be controlled during the thermal process. The rate of heat transfer may be changed by changing the thermal conductivity between the substrate and the thermal reservoir, by changing the emissivity of a surface of the thermal reservoir, or by changing the distance between the substrate and the thermal reservoir.

Abstract: A system and a method for reducing the rate at which volatile contaminants are deposited onto one or more optical components of a substrate processing system are disclosed. A purge fluid is introduced into the processing system at an interior surface of the processing system. A flow of purge fluid is produced across the interior surface to form a contaminant-entraining barrier between a source of the volatile contaminants and the one or more optical components and thereby reduce the rate at which volatile contaminants are deposited onto the optical components of the system. The purge fluid is substantially removed from the processing system.

Abstract: A thermal processing method is described in which a temperature response of a substrate may be controlled during a heat-up phase or a cool-down phase, or during both phases. This reduces the thermal budget of the substrate and improves the quality and performance of devices formed on the substrate. In particular, by controlling the rate of heat transfer between the substrate and a thermal reservoir (e.g., a watercooled reflector plate assembly), the temperature response of the substrate may be controlled during the thermal process. The rate of heat transfer may changed by changing the thermal conductivity between the substrate and the thermal reservoir, by changing the emissivity of a surface of the thermal reservoir, or by changing the distance between the substrate and the thermal reservoir. The thermal conductivity may be changed by changing the characteristics of a thermal transport medium (e.g., a purge gas) located between the substrate and the thermal reservoir.