Patents by Inventor Brian L. Singletary
Brian L. Singletary has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 8722536Abstract: A circuit substrate uses post-fed top side power supply connections to provide improved routing flexibility and lower power supply voltage drop/power loss. Plated-through holes are used near the outside edges of the substrate to provide power supply connections to the top metal layers of the substrate adjacent to the die, which act as power supply planes. Pins are inserted through the plated-through holes to further lower the resistance of the power supply path(s). The bottom ends of the pins may extend past the bottom of the substrate to provide solderable interconnects for the power supply connections, or the bottom ends of the pins may be soldered to “jog” circuit patterns on a bottom metal layer of the substrate which connect the pins to one or more power supply terminals of an integrated circuit package including the substrate.Type: GrantFiled: August 5, 2013Date of Patent: May 13, 2014Assignee: International Business Machines CorporationInventors: Daniel Douriet, Francesco Preda, Brian L. Singletary, Lloyd A. Walls
-
Patent number: 8634877Abstract: Mechanisms for modifying a notification mode for notifying a user of an incoming communication is provided. In a first communication device, an incoming communication from a second communication device is received. A total number of received incoming communications from the second communication device within a predetermined period of time is determined and compared to a first threshold. In response to the total number of received incoming communications from the second communication device within the predetermined period of time meeting or exceeding the first predetermined threshold, a notification mode of the first communication device is modified to be different from a current default notification mode of the first communication device for incoming communications from the second communication device. A notification of the incoming communication from the second communication device is generated using the modified notification mode of the first communication device.Type: GrantFiled: April 9, 2012Date of Patent: January 21, 2014Assignee: International Business Machines CorporationInventors: Fallon M. Delco, Donna L. Johnson, Manjunath N. Mangalur, Brian L. Singletary
-
Publication number: 20130316534Abstract: A circuit substrate uses post-fed top side power supply connections to provide improved routing flexibility and lower power supply voltage drop/power loss. Plated-through holes are used near the outside edges of the substrate to provide power supply connections to the top metal layers of the substrate adjacent to the die, which act as power supply planes. Pins are inserted through the plated-through holes to further lower the resistance of the power supply path(s). The bottom ends of the pins may extend past the bottom of the substrate to provide solderable interconnects for the power supply connections, or the bottom ends of the pins may be soldered to “jog” circuit patterns on a bottom metal layer of the substrate which connect the pins to one or more power supply terminals of an integrated circuit package including the substrate.Type: ApplicationFiled: August 5, 2013Publication date: November 28, 2013Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Daniel Douriet, Francesco Preda, Brian L. Singletary, Lloyd A. Walls
-
Patent number: 8586476Abstract: A circuit substrate uses post-fed top side power supply connections to provide improved routing flexibility and lower power supply voltage drop/power loss. Plated-through holes are used near the outside edges of the substrate to provide power supply connections to the top metal layers of the substrate adjacent to the die, which act as power supply planes. Pins are inserted through the plated-through holes to further lower the resistance of the power supply path(s). The bottom ends of the pins may extend past the bottom of the substrate to provide solderable interconnects for the power supply connections, or the bottom ends of the pins may be soldered to “jog” circuit patterns on a bottom metal layer of the substrate which connect the pins to one or more power supply terminals of an integrated circuit package including the substrate.Type: GrantFiled: September 2, 2010Date of Patent: November 19, 2013Assignee: International Business Machines CorporationInventors: Daniel Douriet, Francesco Preda, Brian L. Singletary, Lloyd A. Walls
-
Publication number: 20130267280Abstract: Mechanisms for modifying a notification mode for notifying a user of an incoming communication is provided. In a first communication device, an incoming communication from a second communication device is received. A total number of received incoming communications from the second communication device within a predetermined period of time is determined and compared to a first threshold. In response to the total number of received incoming communications from the second communication device within the predetermined period of time meeting or exceeding the first predetermined threshold, a notification mode of the first communication device is modified to be different from a current default notification mode of the first communication device for incoming communications from the second communication device. A notification of the incoming communication from the second communication device is generated using the modified notification mode of the first communication device.Type: ApplicationFiled: April 9, 2012Publication date: October 10, 2013Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Fallon M. Delco, Donna L. Johnson, Manjunath N. Mangalur, Brian L. Singletary
-
Patent number: 7863724Abstract: A circuit substrate uses post-fed top side power supply connections to provide improved routing flexibility and lower power supply voltage drop/power loss. Plated-through holes are used near the outside edges of the substrate to provide power supply connections to the top metal layers of the substrate adjacent to the die, which act as power supply planes. Pins are inserted through the plated-through holes to further lower the resistance of the power supply path(s). The bottom ends of the pins may extend past the bottom of the substrate to provide solderable interconnects for the power supply connections, or the bottom ends of the pins may be soldered to “jog” circuit patterns on a bottom metal layer of the substrate which connect the pins to one or more power supply terminals of an integrated circuit package including the substrate.Type: GrantFiled: February 12, 2008Date of Patent: January 4, 2011Assignee: International Business Machines CorporationInventors: Daniel Douriet, Francesco Preda, Brian L. Singletary, Lloyd A. Walls
-
Publication number: 20100330797Abstract: A circuit substrate uses post-fed top side power supply connections to provide improved routing flexibility and lower power supply voltage drop/power loss. Plated-through holes are used near the outside edges of the substrate to provide power supply connections to the top metal layers of the substrate adjacent to the die, which act as power supply planes. Pins are inserted through the plated-through holes to further lower the resistance of the power supply path(s). The bottom ends of the pins may extend past the bottom of the substrate to provide solderable interconnects for the power supply connections, or the bottom ends of the pins may be soldered to “jog” circuit patterns on a bottom metal layer of the substrate which connect the pins to one or more power supply terminals of an integrated circuit package including the substrate.Type: ApplicationFiled: September 2, 2010Publication date: December 30, 2010Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Daniel Douriet, Francesco Preda, Brian L. Singletary, Lloyd A. Walls
-
Publication number: 20090200074Abstract: A circuit substrate uses post-fed top side power supply connections to provide improved routing flexibility and lower power supply voltage drop/power loss. Plated-through holes are used near the outside edges of the substrate to provide power supply connections to the top metal layers of the substrate adjacent to the die, which act as power supply planes. Pins are inserted through the plated-through holes to further lower the resistance of the power supply path(s). The bottom ends of the pins may extend past the bottom of the substrate to provide solderable interconnects for the power supply connections, or the bottom ends of the pins may be soldered to “jog” circuit patterns on a bottom metal layer of the substrate which connect the pins to one or more power supply terminals of an integrated circuit package including the substrate.Type: ApplicationFiled: February 12, 2008Publication date: August 13, 2009Applicant: International Business Machines CorporationInventors: Daniel Douriet, Francesco Preda, Brian L. Singletary, Lloyd A. Walls