Abstract: System and method of controlling an object via control device having integrated touch and displacement control. An embodiment includes an input device having a control stick with an integrated touch sensor, where the control stick may be displaced to provide control of a first functionality of an object, and a user touch sensed by the integrated touch sensor provides control of a second functionality of the object. Additionally, a method is described for controlling an object using a control device integrating displacement and touch control modes. A motion of the object may be controlled, such that inputs from the control device control a relative movement, an absolute movement, and/or a combination of relative and absolute movement for the object. An embodiment includes a game controller having a control device according to the present disclosure.

Abstract: System and method of controlling an object via control device having integrated touch and displacement control. An embodiment includes an input device having a control stick with an integrated touch sensor, where the control stick may be displaced to provide control of a first functionality of an object, and a user touch sensed by the integrated touch sensor provides control of a second functionality of the object. Additionally, a method is described for controlling an object using a control device integrating displacement and touch control modes. A motion of the object may be controlled, such that inputs from the control device control a relative movement, an absolute movement, and/or a combination of relative and absolute movement for the object. An embodiment includes a game controller having a control device according to the present disclosure.

Abstract: A system for cooling a heat-generating electronic device in a computer system includes a printed circuit board having one or more ventilation holes and coupled to a first side of the heat-generating electronic device, and a fan assembly having a top side and a bottom side and coupled to a second side of the heat-generating electronic device. The fan assembly is disposed relative to the printed circuit board to allow air to flow into the top side of the fan assembly and into the bottom side of the fan assembly through the one or more ventilation holes. One advantage of this design is that it enables a greater volume of air to flow through the fan assembly relative to prior art designs, thereby resulting in more efficient cooling of the heat-generating electronic device.

Abstract: A system is provided for sensing, orienting, and transporting wafers in an automated wafer handling process that reduces the generation of particles and contamination so that the wafer yield is increased. The system includes a robotic arm for moving a wafer from one station to a destination station, and an end-effector connected to an end of the robotic arm for receiving the wafer. The end-effector includes a mechanism for gripping the wafer, a direct drive motor for rotating the wafer gripping mechanism, and at least one sensor for sensing the location and orientation of the wafer. A control processor is provided for calculating the location of the center and the notch of the wafer based on measurements by the sensor(s). Then, the control processor generates an alignment signal for rotating the wafer gripping mechanism so that the wafer is oriented at a predetermined position on the end-effector while the robotic arm is moving to another station.

Abstract: A system is provided for sensing, orienting, and transporting wafers in an automated wafer handling process that reduces the generation of particles and contamination so that the wafer yield is increased. The system includes a robotic arm for moving a wafer from one station to a destination station, and an end-effector connected to an end of the robotic arm for receiving the wafer. The end-effector includes a mechanism for gripping the wafer, a direct drive motor for rotating the wafer gripping mechanism, and at least one sensor for sensing the location and orientation of the wafer. A control processor is provided for calculating the location of the center and the notch of the wafer based on measurements by the sensor(s). Then, the control processor generates an alignment signal for rotating the wafer gripping mechanism so that the wafer is oriented at a predetermined position on the end-effector while the robotic arm is moving to another station.