Abstract: Foam for making pads and belts with controlled, reproducible microcellular structure and method of making such foam in a fast and efficient manner. Under constant pressure and temperature, a prepolymer is mixed with the nucleation surfactant in a tank in the presence of a frothing agent metered into the tank by way of a dip tube or sparge. The nitrogen gas is sheared into small bubbles and is drawn off from the headspace of the tank creating a continuous flow of nitrogen. The pressure of the tank may vary from any absolute pressure down to near complete vacuum, thereby all but eliminating the pressure requirement. The froth of the present invention has a more consistent cell structure and increased cell count.

Abstract: Foam for making pads and belts with controlled, reproducible microcellular structure and method of making such foam in a fast and efficient manner. Under constant pressure and temperature, a prepolymer is mixed with the nucleation surfactant in a tank in the presence of a frothing agent metered into the tank by way of a dip tube or sparge. The nitrogen gas is sheared into small bubbles and is drawn off from the headspace of the tank creating a continuous flow of nitrogen. The pressure of the tank may vary from any absolute pressure down to near complete vacuum, thereby all but eliminating the pressure requirement. The froth of the present invention has a more consistent cell structure and increased cell count.

Abstract: Accordingly, this invention provides a fastener system which is weldable to a substructure that overcomes the problems and disadvantages of the fasteners of the prior art. Generally, a weldable fastener is disclosed that has a coating applied to at least one surface of the fastener. The coating functions to prevent the deposit of a further coating, particularly an electrodeposition coating, upon further processing.

Abstract: Accordingly, this invention provides a fastener system which is weldable to a substructure that overcomes the problems and disadvantages of the fasteners of the prior art. Generally, a weldable fastener is disclosed that has a coating applied to at least one surface of the fastener. The coating functions to prevent the deposit of a further coating, particularly an electrodeposition coating, upon further processing.

Abstract: Provided are encapsulated belts and encapsulated pads for use in a variety of polishing application, including the chemical-mechanical polishing and planarization of semiconductor wafers and other workpieces. The encapsulated belts and pads are characterized by a robust seal between a polishing layer of the pad or belt and the edges of the subpad layer of the pad or belt. The robust seal is accomplished by casting a polymer directly over the subpad layer. The edges of the subpad layer may include one or more functional features that promote the formation of a watertight and slurry-resistant seal when the subpad layer is covered with a cast polymer. Also provided is a method of producing a robust seal between the polishing layer and the edge region of the subpad by encapsulating a subpad layer with a polymeric material.

Abstract: Accordingly, this invention provides a fastener system which is weldable to a substructure that overcomes the problems and disadvantages of the fasteners of the prior art. Generally, a weldable fastener is disclosed that has a coating applied to at least one surface of the fastener. The coating functions to prevent the deposit of a further coating, particularly an electrodeposition coating, upon further processing.

Abstract: Accordingly, this invention provides a fastener system which is weldable to a substructure that overcomes the problems and disadvantages of the fasteners of the prior art. Generally, a weldable fastener is disclosed that has a coating applied to at least one surface of the fastener. The coating functions to prevent the deposit of a further coating, particularly an electrodeposition coating, upon further processing.

Abstract: Accordingly, this invention provides a fastener system which is weldable to a substructure that overcomes the problems and disadvantages of the fasteners of the prior art. Generally, a weldable fastener is disclosed that has a coating applied to at least one surface of the fastener. The coating functions to prevent the deposit of a further coating, particularly an electrodeposition coating, upon further processing.

Abstract: Accordingly, this invention provides a fastener system which is weldable to a substructure that overcomes the problems and disadvantages of the fasteners of the prior art. Generally, a weldable fastener is disclosed that has a coating applied to at least one surface of the fastener. The coating functions to prevent the deposit of a further coating, particularly an electrodeposition coating, upon further processing.

Abstract: Provided are encapsulated belts and encapsulated pads for use in a variety of polishing application, including the chemical-mechanical polishing and planarization of semiconductor wafers and other workpieces. The encapsulated belts and pads are characterized by a robust seal between a polishing layer of the pad or belt and the edges of the subpad layer of the pad or belt. The robust seal is accomplished by casting a polymer directly over the subpad layer. The edges of the subpad layer may include one or more functional features that promote the formation of a watertight and slurry-resistant seal when the subpad layer is covered with a cast polymer. Also provided is a method of producing a robust seal between the polishing layer and the edge region of the subpad by encapsulating a subpad layer with a polymeric material.

Abstract: Foam for making pads and belts with controlled, reproducible microcellular structure and method of making such foam in a fast and efficient manner. Under constant pressure and temperature, a prepolymer is mixed with the nucleation surfactant in a tank in the presence of a frothing agent metered into the tank by way of a dip tube or sparge. The nitrogen gas is sheared into small bubbles and is drawn off from the headspace of the tank creating a continuous flow of nitrogen. The pressure of the tank may vary from any absolute pressure down to near complete vacuum, thereby all but eliminating the pressure requirement. The froth of the present invention has a more consistent cell structure and increased cell count.

Abstract: A polishing pad for use in chemical mechanical polishing (CMP) is disclosed. The polishing pad has a pad surface for polishing wafer surfaces. The pad surface is composed of a polymeric matrix material. The polishing pad also contains a polymeric additive which is defined in the polymeric matrix of the pad surface and in cells of the pad surface. The polymeric additive may include one of a polyurethane, a polyamide, a polyester, a polyacrylonitrile, a polyacrylate, a polymethacrylate, a polyvinylchloride, and a polyvinylidene chloride. The polymeric additive is configured to be hydrophilic so that the pad surface is wettable to enable improved slurry distribution over the pad surface.

Abstract: A method for making high density foam semiconductor polishing pads and belts with controlled, reproducible microcellular structure by mechanical frothing. The method involves agitating a liquid polymer resin at a controlled temperature and pressure in order to produce a stable froth. Next, the resin froth is metered under pressure to a mix head where it is typically combined with a desired amount of curative before being injected or poured into a mold.

Abstract: A seamless, composite belt that is designed to maintain a substantially flat surface in the span between two rollers. The belts typically have one or more polymer layers, including the polishing layer, and one or more supporting woven or non-woven layers. The belts have the necessary balance between down-cupping and up-cupping forces achieved by: 1) varying the relative thickness of the different polymer and supporting layers in the belt, 2) varying the relative hardness or rigidity of the different layers in the belt, 3) varying the temperatures at which the different layers are formed, 4) varying the compositions of supporting layers, and 5) prestressing one or more of the composite layers. The belts are particularly useful in chemical mechanical polishing of semiconductor wafers.