Abstract: Processes of polymerizing olefin monomers.

Abstract: An encapsulant film is made from a composition comprising (A) a non-polar ethylene-based polymer; (B) an organic peroxide; (C) a silane coupling agent; and (D) a co-agent comprising a compound of Structure I wherein R1-R6 each is independently selected from the group consisting of hydrogen, a C1-C8 hydrocarbyl group, a C1-C36 substituted hydrocarbyl group, and combinations thereof.

Abstract: An encapsulant film is made from a composition comprising (A) a non-polar ethylene-based polymer having a density of 0.850 g/cc to 0.890 g/cc; (B) an organic peroxide; (C) a silane coupling agent; and (D) a co-agent comprising triallyl phosphate.

Abstract: A composition comprising an ethylene/alpha-olefin interpolymer that comprises the following properties: a) a total unsaturation/1000C?0.30; b) a molecular weight distribution (MWD)?3.0; c) a TGIC broadness parameter B1/4?8.0. A solution N polymerization process to prepare an ethylene/alpha-olefin/interpolymer, said process comprising polymerizing, in one reactor, at a reactor temperature ?150° C., a reaction mixture comprising ethylene, an alpha-olefin, a solvent, and a metal complex as described herein. A method to determine the TGIC broadness parameter B1/x of a polymer composition comprising one or more olefin-based polymers.

Abstract: A composition comprising the following components a)-c): a) an alpha composition comprising a multimodal ethylene/alpha-olefin interpolymer, and wherein the alpha composition comprises the following properties: i) an Mz/Mn?8.0, ii) a density from 0.855 to 0.890 g/cc, iii) a V100 (100° C.)?2,000 Pa·s, iv) a V1.0 (100° C.)?15,000 Pa·s, v) a Mn?16,000 g/mol; b) a peroxide; and c) a silane coupling agent.

Abstract: The present disclosure relates to a curable composition for an encapsulant film, the curable composition comprising: (A) a polyolefin; (B) a fumed alumina; (C) an organic peroxide; (D) a silane coupling agent; (E) a crosslinking co-agent; and, optionally, (F) an additive component comprising a UV stabilizer, wherein the polyolefin has a volume resistivity of less than 4.0E+15 ohm·cm. The present disclosure further relates to an encapsulant film made from such a curable composition and a PV module containing such an encapsulant film.

Abstract: A composition for use as a film layer comprises (A) an olefin-based polymer having a volume resistivity greater than 5.0*1015 ohm·cm; (B) a hydrophobic-treated fumed silica; (C) an alkoxysilane; (D) an organic peroxide; and (E) from 0 wt % to 1.5 wt % of a crosslinking co-agent.

Abstract: A composition for use as a film layer comprises (A) an olefin-based polymer having a volume resistivity greater than 5.0*1015 ohm·cm; (B) a hydrophilic fumed silica; (C) an alkoxysilane; (D) an organic peroxide; and, optionally, (E) from 0 wt % to 1.5 wt % of a crosslinking co-agent.

Abstract: The present disclosure relates to unsaturated polyolefins and processes for preparing the same. The present disclosure further relates to curable formulations comprising the unsaturated polyolefins that show improved crosslinking.

Abstract: Disclosed relates to unsaturated polyolefins and processes for preparing the same. Disclosed further relates to curable formulations comprising the unsaturated polyolefins that show improved crosslinking.

Abstract: An encapsulant film is made from a composition comprising (A) a non-polar ethylene-based polymer; (B) an organic peroxide; (C) a silane coupling agent; and (D) a co-agent comprising a compound of Structure I wherein R1-R6 each is independently selected from the group consisting of hydrogen, a C1-C8 hydrocarbyl group, a C1-C36 substituted hydrocarbyl group, and combinations thereof.

Abstract: The present disclosure provides an article. In an embodiment, the article includes a first structural component and a second structural component. The first structural component includes a polycarbonate composition. The second structural component includes a polymeric blend of (i) an ethylene/?-olefin multi-block copolymer, and (ii) a functional polymer modifier that is an ethylene/ester copolymer. The second structural component is adhered to the first structural component.

Abstract: An encapsulant film is made from a composition comprising (A) a non-polar ethylene-based polymer having a density of 0.850 g/cc to 0.890 g/cc; (B) an organic peroxide; (C) a silane coupling agent; and (D) a co-agent comprising triallyl phosphate.

Abstract: The present disclosure provides an article. In an embodiment, the article includes a first structural component and a second structural component. The first structural component includes a polycarbonate composition. The second structural component includes a polymeric blend of (i) an ethylene/?-olefin multi-block copolymer, and (ii) a functional polymer modifier that is an ethylene/ester copolymer. The second structural component is adhered to the first structural component.