Abstract: A burn-in oven is provided with a wall that has a number of vertically stacked, laterally extending slots aligned with each of the burn-in-board supports in the oven. When a burn-in-board is placed in the oven on the supports, an edge portion of the burn-in-board extends through a slot into a connector area. Each of the slots has a shutter associated therewith that will move from an open position to permit the burn-in-board connector portion to extend through the slot, to a closed position wherein the shutter covers the slot. A cam operator moves the shutters to a closed position, except when a burn-in-board is extending through a particular slot, it will support the shutter in its open position and the shutter will not be moved by the cam. All the shutters associated with openings through which no burn-in-board connector portion extends will be closed to prevent air flow from the burn-in oven.

Abstract: An automatic loading and unloading support for use on the interior of a burn-in oven includes a frame that supports a rack of printed circuit burn-in boards connected to connectors along edges of the burn-in boards at one end of the rack. The frame has a track for supporting the rack for movement from an open end toward a closed end of the oven. Driver/receiver boards are mounted at the closed end and have connectors aligning with the connectors on the burn-in boards on a rack. When the rack is moved to a position closely adjacent to the driver/receiver board connectors, alignment pins will align the rack properly and then actuators are used for moving inserter bars that press against the back side of the rack and push the connectors on the burn-in boards into the connectors on the driver/receiver boards.

Abstract: A thermal control system for use with a burn-in system, the thermal control system capable of delivering a thermally preconditioned liquid to a plurality of semiconductor devices during burn-in. The thermal control system comprises a liquid reservoir containing a liquid, a pump, and a plurality of spray nozzle arrays. The liquid contained in the liquid reservoir is thermally preconditioned through the use of a heating element and a cooling element and the temperature of the liquid provided to each spray nozzle array is individually controlled through the use of a pipe heating element. The liquid is collected and returned to the liquid reservoir after being sprayed on the semiconductor devices.

Abstract: A thermal control system for use with a burn-in system, the thermal control system capable of delivering a thermally preconditioned liquid to a plurality of semiconductor devices during burn-in. The thermal control system comprises a liquid reservoir containing a liquid, a pump, and a plurality of spray nozzle arrays. The liquid contained in the liquid reservoir is thermally preconditioned through the use of a heating element and a cooling element and the temperature of the liquid provided to each spray nozzle array is individually controlled through the use of a pipe heating element. The liquid is collected and returned to the liquid reservoir after being sprayed on the semiconductor devices.

Abstract: A rear module wall before a burn-in system that provides burn-in boards for electronic components to permit passing connections through slots while maintaining a good heat seal. The module rear wall is a sandwich type construction of a plurality of layers with insulating silicon rubber sandwiched between slotted backing sheets to provide for double insulation for the boards as then are slid through the slots from the interior of the oven into a tempered zone or to the exterior where they are connected to driver receiver boards and other connections.