Patents by Inventor Brian R. Reynolds

Brian R. Reynolds has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Guide wire with hydrophilically coated tip
    Patent number: 5924998
    Abstract: A guide wire including a lubricous distal portion and a less lubricous intermediate portion proximal of said distal portion. One guide wire provides a highly lubricous distal portion with a hydrophilic layer and a less lubricous intermediate portion with a hydrophobic layer. Another guide wire provides a lubricous distal portion with a polymer tip that is itself hydrophilic. Yet another guide wire provides a less lubricous intermediate portion using a stainless steel coil helically wound around the tapering intermediate portion. The coil is preferably coated with a hydrophobic coating such as PTFE or silicone. The coil can either abut the distal portion proximal end or extend into the distal portion interior.
    Type: Grant
    Filed: March 6, 1997
    Date of Patent: July 20, 1999
    Assignee: SciMed Life System, Inc.
    Inventors: Richard G. Cornelius, Anthony Kelzenberg, Michael J. Urick, Brian R. Reynolds
  • Low temperature tin-bismuth electroplating system
    Patent number: 5308464
    Abstract: A system for electroplating a tin-bismuth alloy at near eutectic composition is disclosed. The system includes the plating bath and the process for initially preparing the bath as well as the process for plating an object with tin-bismuth alloy. The system further includes an apparatus for regulating the concentrations of tin and bismuth in the plating bath and the process by which the concentrations are controlled.
    Type: Grant
    Filed: February 23, 1993
    Date of Patent: May 3, 1994
    Assignee: Unisys Corporation
    Inventors: Timothy I. Murphy, Brian R. Reynolds
  • Low temperature tin-bismuth electroplating system
    Patent number: 5227046
    Abstract: A system for electroplating a tin-bismuth alloy at near eutectic composition is disclosed. The system includes the plating bath and the process for initially preparing the bath as well as the process for plating an object with tin-bismuth alloy. The system further includes an apparatus for regulating the concentrations of tin and bismuth in the plating bath and the process by which the concentrations are controlled.
    Type: Grant
    Filed: October 7, 1991
    Date of Patent: July 13, 1993
    Assignee: Unisys Corporation
    Inventors: Timothy I. Murphy, Brian R. Reynolds