Abstract: The present disclosure includes systems, methods and program products for identifying a drawing scale for a graphical view of a drawing having associated annotations, each of the annotations being associated with one or more views and support at least one drawing scale; selected one or more annotations as a subset of the associated annotations by identifying the subset of annotations while excluding from the subset ones that are not associated with the graphical view or do not support the drawing scale, based at least in part on the graphical view and the drawing scale; retrieving for each of the selected annotations, associated context for the drawing scale, the context specifying one or more of: the annotation's position, style or rotation in the graphical view; and adding a graphical representation of each of the selected annotations to the graphical view according to the drawing scale and each annotation's respective context.

Abstract: An electromechanical assembly includes a socket housing having a cavity for seating an integrated circuit and a first plurality of electrical contacts in the cavity to electrically connect an integrated circuit seated in the socket housing with a circuit board upon which the electromechanical assembly is mounted. The socket housing has a supporting body on a different plane than a bottom surface of the cavity. The socket housing has a second plurality of electrical contacts that form a first row across the supporting body and a third plurality of electrical contacts that form a second row across the supporting body. The socket housing has alignment elements. The electromechanical assembly also includes a card edge connector having slots that accept the alignment elements of the socket housing, a fourth plurality of electrical contacts that form a third row, and a fifth plurality of electrical contacts that form a fourth row.

Abstract: A printed circuit board assembly and method of assembly is provided for a printed circuit board having a top and bottom surface with at least one edge portion having a rounded surface extending from the top surface to a point below the top surface and at least one electrical contact pad located on the top surface and extending over the edge portion rounded surface to a point below the top surface.

Abstract: An electromechanical assembly includes a socket housing having a cavity for seating an integrated circuit and a first plurality of electrical contacts in the cavity to electrically connect an integrated circuit seated in the socket housing with a circuit board upon which the electromechanical assembly is mounted. The socket housing has a supporting body on a different plane than a bottom surface of the cavity. The socket housing has a second plurality of electrical contacts that form a first row across the supporting body and a third plurality of electrical contacts that form a second row across the supporting body. The socket housing has alignment elements. The electromechanical assembly also includes a card edge connector having slots that accept the alignment elements of the socket housing, a fourth plurality of electrical contacts that form a third row, and a fifth plurality of electrical contacts that form a fourth row.

Abstract: Coaxial probe structures include a plurality of discrete insulated elongated electrical conductors projecting from a support surface which are useful as probes for testing of electrical interconnections to electronic devices, such as integrated circuit devices and other electronic components and particularly for testing of integrated circuit devices with rigid interconnection pads and multi-chip module packages with high density interconnection pads. Coaxial probe structures are fabricated by the methods described providing a high density coaxial probe.

Abstract: The current invention concerns the use of PIP or S100A8 for the generation of regulatory T cells. The current invention provides a method of generating regulatory T cells by contacting immature DC with PIP or S100A8 to produce tolerogenic DC and further contacting naïve T cells to the tolerogenic DC to produce regulatory T cells. The invention also concerns PIP protein where immature DC contacted with PIP produce tolerogenic DC that induce conversion of naïve T-cells into regulatory T cells. The invention also concerns S100A8 protein where immature DC contacted with S100A8 produce tolerogenic DC that induce conversion of naïve T-cells into regulatory T cells. The invention also provides methods for identification of factors secreted by iNKT cells that induce conversion of immature DC into tolerogenic DC. The subject invention also concerns using regulatory T cells for treatment and/or management of cancer or the diseases of the immune system.

Abstract: The present invention is directed to structures having a plurality of discrete insulated elongated electrical conductors projecting from a support surface which are useful as probes for testing of electrical interconnections to electronic devices, such as integrated circuit devices and other electronic components and particularly for testing of integrated circuit devices with rigid interconnection pads and multi-chip module packages with high density interconnection pads and the apparatus for use thereof and to methods of fabrication thereof. Coaxial probe structures are fabricated by the methods described providing a high density coaxial probe.

Abstract: The present disclosure includes, among other things, systems, methods and program products for using, storing and retrieving scale information.

Abstract: Structures having a plurality of discrete insulated elongated electrical conductors projecting from a support surface which are useful as probes for testing of electrical interconnections to electronic devices, such as integrated circuit devices and other electronic components and particularly for testing of integrated circuit devices with rigid interconnection pads and multi-chip module packages with high density interconnection pads and the apparatus for use thereof and to methods of fabrication thereof. Coaxial probe structures are fabricated by the methods described providing a high density coaxial probe.

Abstract: A printed circuit board assembly and method of assembly is provided for a printed circuit board having a top and bottom surface with at least one edge portion having a rounded surface extending from the top surface to a point below the top surface and at least one electrical contact pad located on the top surface and extending over the edge portion rounded surface to a point below the top surface.

Abstract: A printed circuit board assembly and method of assembly is provided for a printed circuit board having a top and bottom surface with at least one edge portion having a rounded surface extending from the top surface to a point below the top surface and at least one electrical contact pad located on the top surface and extending over the edge portion rounded surface to a point below the top surface.

Abstract: The present disclosure includes, among other things, systems, methods and program products for identifying a drawing scale for a graphical view of a drawing, the drawing scale specifying a ratio of two units; selecting one or more annotations associated with the view that support the drawing scale, each of the selected annotations associated with context for the drawing scale, the context specifying one or more of: the annotation's position in the view, the annotation's style in the view, or the annotation's rotation in the view; adding a graphical representation of each of the selected annotations to the view according to the drawing scale and each annotation's respective context; and removing any one or more of the annotations from the view that does not support the drawing scale.

Abstract: Apparatus, system and methods of using the apparatus and system to manipulate fiber(s) into a chopper, winder or other fiber(s) processing equipment. By using the apparatus the operator(s) are freed up for pressing duties that will increase productivity and also create a safer workplace. The apparatus supports and constrains slowly or rapidly running fiber(s) and moves through a sequence of movements that reposition the fiber(s) into a path that places the running fiber(s) in the proper location for processing in the chopper, winder or other processing equipment and also places the running fiber(s) into a desired groove or valley on a separator roll or guide.

Abstract: A printed circuit board assembly and method of assembly is provided for a printed circuit board having a top and bottom surface with at least one edge portion having a rounded surface extending from the top surface to a point below the top surface and at least one electrical contact pad located on the top surface and extending over the edge portion rounded surface to a point below the top surface.

Abstract: The present invention is directed to structures having a plurality of discrete insulated elongated electrical conductors projecting from a support surface which are useful as probes for testing of electrical interconnections to electronic devices, such as integrated circuit devices and other electronic components and particularly for testing of integrated circuit devices with rigid interconnection pads and multi-chip module packages with high density interconnection pads and the apparatus for use thereof and to methods of fabrication thereof. Coaxial probe structures are fabricated by the methods described providing a high density coaxial probe.

Abstract: The present invention is directed to structures having a plurality of discrete insulated elongated electrical conductors projecting from a support surface which are useful as probes for testing of electrical interconnections to electronic devices, such as integrated circuit devices and other electronic components and particularly for testing of integrated circuit devices with rigid interconnection pads and multi-chip module packages with high density interconnection pads and the apparatus for use thereof and to methods of fabrication thereof. Coaxial probe structures are fabricated by the methods described providing a high density coaxial probe.

Abstract: Apparatus, system and methods of using the apparatus and system to manipulate fiber(s) into a chopper, winder or other fiber(s) processing equipment. By using the apparatus the operator(s) are freed up for pressing duties that will increase productivity and also create a safer workplace. The apparatus supports and constrains slowly or rapidly running fiber(s) and moves through a sequence of movements that reposition the fiber(s) into a path that places the running fiber(s) in the proper location for processing in the chopper, winder or other processing equipment and also places the running fiber(s) into a desired groove or valley on a separator roll or guide.

Abstract: The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant or high modulus elastomeric material. A standard packaging substrate, such as a ceramic integrated circuit chip packaging substrate is used to provide a space transformer. Wires are bonded to an array of contact pads on the surface of the space transformer. The space transformer formed from a multilayer integrated circuit chip packaging substrate. The wires are as dense as the contact location array. A mold is disposed surrounding the array of outwardly projecting wires. A liquid elastomer is disposed in the mold to fill the spaces between the wires.

Abstract: The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant or high modulus elastomeric material. A standard packaging substrate, such as a ceramic integrated circuit chip packaging substrate is used to provide a space transformer. Wires are bonded to an array of contact pads on the surface of the space transformer. The space transformer formed from a multilayer integrated circuit chip packaging substrate. The wires are as dense as the contact location array. A mold is disposed surrounding the array of outwardly projecting wires. A liquid elastomer is disposed in the mold to fill the spaces between the wires.

Abstract: The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant or high modulus elastomeric material. A standard packaging substrate, such as a ceramic integrated circuit chip packaging substrate is used to provide a space transformer. Wires are bonded to an array of contact pads on the surface of the space transformer. The space transformer formed from a multilayer integrated circuit chip packaging substrate. The wires are as dense as the contact location array. A mold is disposed surrounding the array of outwardly projecting wires. A liquid elastomer is disposed in the mold to fill the spaces between the wires.