Abstract: An assembly for use in bonding an trim cover to a foam pad along a pair of conveyor line in a process of a plurality of stations. A plurality of tool carriers are transported along each of the conveyor lines to each station. The tool carrier supports at least one mold assembly for bonding an air impervious adhesive film between the cover and the foam pad. A collar assembly pivotally supports a press platen above the mold assembly and provides pivotal movement between an open position spaced at a predetermined angle above the mold assembly and a closed position compressing the foam pad against the trim cover and mold assembly. The tool carrier includes a pair of vacuum inlet connectors for engagement by a vacuum snorkel to provide vacuum pressure to the mold assembly and travel with the tool carrier along the conveyor line between consecutive process stations.