Patents by Inventor Brian Scott Thornton

Brian Scott Thornton has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7307816
    Abstract: A slider/suspension design and assembly method include securing a slider to a suspension assembly for use in a magnetic disk drive data recording device. To this end, solder bumps are applied to a metalized backside surface of the slider, and are patterned and flown within a plurality of receptacles to form a rigid mechanical connection between the slider to the flexure, while also enabling the slider-suspension assembly to be separated without damage during the process. The slider/suspension assembly is initiated by forming a plurality of slider bars on a wafer, in such a manner that the trailing edge surfaces of the sliders form a front side of the wafer. A plurality of thin film read/write elements and a plurality of electrical contact pads are formed on the wafer front side. Slider bars are then diced from the wafer, and the slider backsides are metalized on the slider bars.
    Type: Grant
    Filed: December 21, 2001
    Date of Patent: December 11, 2007
    Assignee: Western Digital (Fremont), LLC
    Inventors: Brian Scott Thornton, Edmund Bruno Fanslau, Jr.
  • Patent number: 6796018
    Abstract: A slider/suspension design and assembly method include securing a slider to a suspension assembly for use in a magnetic disk drive data recording device. To this end, a solder fillet bond is applied at the leading edge surface of the slider to provide a structural connection of the slider to the flexure, while also enabling the slider-suspension assembly to be separated without damage during the process. The slider/suspension assembly is initiated by forming a plurality of sliders on a wafer, in such a manner that the trailing edge surfaces of the sliders form the front side of the wafer, and the leading edge surfaces of the sliders form the backside of the wafer. A plurality of thin film data transducing elements and a plurality of electrical contact pads are then formed on the wafer front side.
    Type: Grant
    Filed: December 21, 2001
    Date of Patent: September 28, 2004
    Assignee: Western Digital (Fremont), Inc.
    Inventor: Brian Scott Thornton