Abstract: A method and apparatus for improving the fatigue life of a wobblefram utilized in a micro switch. The flexible circular wobblefram can be formed with a fixed edge and a solid center region utilizing a punch and die at elevated temperatures. An external lever can be attached to the solid center region of the wobblefram. The lever can be loaded and actuated to transmit motion from outside of the micro switch to a sealed internal mechanism in order to perform a switching function. Circular and/or sinusoidal shaped corrugations can then be added to the wobblefram and evaluated for performance utilizing a finite element analysis (FEA) model. The FEA model can precisely evaluate and optimize profile, number and height of the circular and/or sinusoidal corrugations. Such a wobblefram with circular and/or sinusoidal corrugations can achieve higher lifetime without affecting the operating characteristics of the micro switch.

Abstract: A spring apparatus can be implemented, which includes a spring for use in a clutch mechanism, wherein the spring is configured to avoid coil clash and end wire lengths of the spring are positioned in order to center the clutch spring without additional features thereof. Additionally, bend radii and a wire diameter associated with the spring. Such a spring can be adapted for use in a centrifugal clutch and/or an automobile latch.

Abstract: A spring apparatus can be implemented, which includes a leaf spring for use in a clutch mechanism, wherein the leaf spring is configured to avoid coil clash and end wire lengths of the leaf spring are positioned in order to center the leaf spring without additional features thereof. Bend radii and a wire diameter associated with the leaf spring. The leaf spring can be adapted for use in a centrifugal clutch and/or automobile latch.

Abstract: A quartz sensor method and system are disclosed in which a plurality of SAW sensing resonators can be mechanically simulated for implementation upon a quartz wafer substrate. The quartz wafer substrate can thereafter be appropriately etched to produce a quartz diaphragm from the quartz wafer substrate. A plurality of SAW sensing resonators (e.g., pressure, reference and/or temperature SAW resonators) can then be located upon the quartz wafer substrate, which is based upon the previously mechanically simulated for implementation upon the substrate to thereby produce a quartz sensor package from the quartz wafer substrate.