Patents by Inventor Brian W. Kaplun
Brian W. Kaplun has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10548243Abstract: A disclosed apparatus for use with a conduction-cooled card assembly may include a frame comprising first and second thermally conductive portions adapted to engage respective thermal management interfaces on opposite sides of a conduction cooling frame for at least one circuit card. The apparatus may also include a passageway extending between first and second openings in the frame so as to allow cooling fluid to flow into the first opening, through the passageway, and out of the second opening. According to a disclosed method, an insert may be installed between components of a mezzanine connector so as to increase a height of the connector. In some implementations, the installing of the insert may be performed while the first and second components of the mezzanine connector are mounted on a host card and a mezzanine card, respectively, so that installation of the insert between the first and second components increases a spacing between the host card and the mezzanine card.Type: GrantFiled: June 1, 2016Date of Patent: January 28, 2020Assignee: Lockheed Martin CorporationInventors: Brian W. Kaplun, James S. Eiche, David L. Vos
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Patent number: 10362713Abstract: A disclosed apparatus for use with a conduction-cooled card assembly may include a frame comprising first and second thermally conductive portions adapted to engage respective thermal management interfaces on opposite sides of a conduction cooling frame for at least one circuit card. The apparatus may also include a passageway extending between first and second openings in the frame so as to allow cooling fluid to flow into the first opening, through the passageway, and out of the second opening. According to a disclosed method, an insert may be installed between components of a mezzanine connector so as to increase a height of the connector. In some implementations, the installing of the insert may be performed while the first and second components of the mezzanine connector are mounted on a host card and a mezzanine card, respectively, so that installation of the insert between the first and second components increases a spacing between the host card and the mezzanine card.Type: GrantFiled: June 1, 2016Date of Patent: July 23, 2019Assignee: Lockheed Martin CorporationInventors: Brian W. Kaplun, James S. Eiche, David L. Vos
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Patent number: 9673514Abstract: Some embodiments relate to a multiband antenna array formed on a flexible substrate. Low frequency antenna elements may be formed using nanoink. High frequency elements may be provided on a prefabricated antenna chip. The antenna array may be heated in a low temperature oven to sinter the nanoink into a solid antenna element. In some embodiments, an adhesive insulation layer may be provided which allows the antenna array to be attached to any surface. In other embodiments, the antenna array may be embedded in a composite material.Type: GrantFiled: August 25, 2014Date of Patent: June 6, 2017Assignee: Lockheed Martin CorporationInventors: David L. Vos, Carl Baldwin, David R. Darling, Brian W. Kaplun, David R. Dorough
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Publication number: 20160278241Abstract: A disclosed apparatus for use with a conduction-cooled card assembly may include a frame comprising first and second thermally conductive portions adapted to engage respective thermal management interfaces on opposite sides of a conduction cooling frame for at least one circuit card. The apparatus may also include a passageway extending between first and second openings in the frame so as to allow cooling fluid to flow into the first opening, through the passageway, and out of the second opening. According to a disclosed method, an insert may be installed between components of a mezzanine connector so as to increase a height of the connector. In some implementations, the installing of the insert may be performed while the first and second components of the mezzanine connector are mounted on a host card and a mezzanine card, respectively, so that installation of the insert between the first and second components increases a spacing between the host card and the mezzanine card.Type: ApplicationFiled: June 1, 2016Publication date: September 22, 2016Applicant: Lockheed Martin CorporationInventors: Brian W. Kaplun, James S. Eiche, David L. Vos
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Publication number: 20160278240Abstract: A disclosed apparatus for use with a conduction-cooled card assembly may include a frame comprising first and second thermally conductive portions adapted to engage respective thermal management interfaces on opposite sides of a conduction cooling frame for at least one circuit card. The apparatus may also include a passageway extending between first and second openings in the frame so as to allow cooling fluid to flow into the first opening, through the passageway, and out of the second opening. According to a disclosed method, an insert may be installed between components of a mezzanine connector so as to increase a height of the connector. In some implementations, the installing of the insert may be performed while the first and second components of the mezzanine connector are mounted on a host card and a mezzanine card, respectively, so that installation of the insert between the first and second components increases a spacing between the host card and the mezzanine card.Type: ApplicationFiled: June 1, 2016Publication date: September 22, 2016Applicant: Lockheed Martin CorporationInventors: Brian W. Kaplun, James S. Eiche, David L. Vos
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Patent number: 9426931Abstract: A disclosed apparatus for use with a conduction-cooled card assembly may include a frame comprising first and second thermally conductive portions adapted to engage respective thermal management interfaces on opposite sides of a conduction cooling frame for at least one circuit card. The apparatus may also include a passageway extending between first and second openings in the frame so as to allow cooling fluid to flow into the first opening, through the passageway, and out of the second opening. According to a disclosed method, an insert may be installed between components of a mezzanine connector so as to increase a height of the connector. In some implementations, the installing of the insert may be performed while the first and second components of the mezzanine connector are mounted on a host card and a mezzanine card, respectively, so that installation of the insert between the first and second components increases a spacing between the host card and the mezzanine card.Type: GrantFiled: February 7, 2014Date of Patent: August 23, 2016Assignee: Lockheed Martin CorporationInventors: Brian W. Kaplun, James S. Eiche, David L. Vos
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Publication number: 20150303554Abstract: Some embodiments relate to a multiband antenna array formed on a flexible substrate. Low frequency antenna elements may be formed using nanoink. High frequency elements may be provided on a prefabricated antenna chip. The antenna array may be heated in a low temperature oven to sinter the nanoink into a solid antenna element. In some embodiments, an adhesive insulation layer may be provided which allows the antenna array to be attached to any surface. In other embodiments, the antenna array may be embedded in a composite material.Type: ApplicationFiled: August 25, 2014Publication date: October 22, 2015Applicant: Lockheed Martin CorporationInventors: DAVID L. VOS, Carl Baldwin, David R. Darling, Brian W. Kaplun, David R. Dorough
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Publication number: 20150230365Abstract: A disclosed apparatus for use with a conduction-cooled card assembly may include a frame comprising first and second thermally conductive portions adapted to engage respective thermal management interfaces on opposite sides of a conduction cooling frame for at least one circuit card. The apparatus may also include a passageway extending between first and second openings in the frame so as to allow cooling fluid to flow into the first opening, through the passageway, and out of the second opening. According to a disclosed method, an insert may be installed between components of a mezzanine connector so as to increase a height of the connector. In some implementations, the installing of the insert may be performed while the first and second components of the mezzanine connector are mounted on a host card and a mezzanine card, respectively, so that installation of the insert between the first and second components increases a spacing between the host card and the mezzanine card.Type: ApplicationFiled: February 7, 2014Publication date: August 13, 2015Applicant: Lockheed Martin CorporationInventors: Brian W. Kaplun, James S. Eiche, David L. Vos