Patents by Inventor Brian Warwick
Brian Warwick has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240196411Abstract: A terminal device in a wireless telecommunication system which transmits a master information block and a first and a second system information block the first and second system information block comprising first and second scheduling information relating to the timing of at least one additional block of system information. The terminal device configured to receive the master information block of system information that comprises a marker instructing the terminal device to ignore the first scheduling information and process only the second scheduling information.Type: ApplicationFiled: February 21, 2024Publication date: June 13, 2024Applicant: Sony Group CorporationInventors: Brian Alexander MARTIN, Martin Warwick BEALE
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Patent number: 11968751Abstract: A base station for transmitting system related information in a mobile telecommunications network. The base station is configured to transmit system information for the cell provided by the base station and to broadcast a version synchronisation signal, wherein the version synchronisation signal provides version information regarding the current version of the system information for the cell.Type: GrantFiled: March 9, 2023Date of Patent: April 23, 2024Assignees: SONY GROUP CORPORATION, SONY MOBILE COMMUNICATIONS INC.Inventors: Shin Horng Wong, Martin Warwick Beale, Brian Alexander Martin, Basuki Priyanto, Nafiseh Mazloum
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Patent number: 11950243Abstract: A terminal device in a wireless telecommunication system which transmits a master information block and a first and a second system information block the first and second system information block comprising first and second scheduling information relating to the timing of at least one additional block of system information. The terminal device configured to receive the master information block of system information that comprises a marker instructing the terminal device to ignore the first scheduling information and process only the second scheduling information.Type: GrantFiled: November 30, 2020Date of Patent: April 2, 2024Assignee: Sony CorporationInventors: Brian Alexander Martin, Martin Warwick Beale
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Patent number: 11924913Abstract: An apparatus comprising circuitry configured to generate a user equipment identifier which is unique on Anchor cell level or which is unique in RAN notified area level.Type: GrantFiled: March 14, 2022Date of Patent: March 5, 2024Assignee: Sony Group CorporationInventors: Brian Alexander Martin, Shin Horng Wong, Martin Warwick Beale, Yuxin Wei, Vivek Sharma, Shinichiro Tsuda, Hideji Wakabayashi, Samuel Asangbeng Atungsiri
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Patent number: 11917539Abstract: A terminal device for use with a wireless telecommunications system, the terminal device configured to attempt to receive or to transmit a first signal during one or more of a plurality of predetermined time periods in response to determining that one or more second signals indicating, respectively, that the one or more of the plurality of predetermined time periods should be used for the attempted reception or transmission of a first signal have been received by the transceiver; determine a characteristic associated with the one or more second signals; and to control the transceiver to receive a third signal from the infrastructure equipment or to transmit a third signal to the infrastructure equipment, the third signal comprising information on the basis of which it is determinable whether or not a predetermined condition associated with the characteristic associated with the one or more second signals has been met.Type: GrantFiled: April 4, 2022Date of Patent: February 27, 2024Assignee: SONY GROUP CORPORATIONInventors: Martin Warwick Beale, Shin Horng Wong, Brian Alexander Martin, Basuki Priyanto, Nafiseh Mazloum
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Patent number: 10877090Abstract: The terminals of a device under test are temporarily electrically connected to corresponding contact pads on a load board by a series of electrically conductive pin pairs. The pin pairs are held in place by an interposer membrane that includes a top contact plate facing the device under test, a bottom contact plate facing the load board, and a vertically resilient, non-conductive member between the top and bottom contact plates. Each pin pair includes a top and bottom pin, which extend beyond the top and bottom contact plates, respectively, toward the device under test and the load board, respectively. The top and bottom pins contact each other at an interface that is inclined with respect to the membrane surface normal. When compressed longitudinally, the pins translate toward each other by sliding along the interface. The sliding is largely longitudinal, with a small and desirable lateral component determined by the inclination of the interface.Type: GrantFiled: July 19, 2017Date of Patent: December 29, 2020Assignee: Johnstech International CorporationInventors: John E. Nelson, Jeffrey C. Sherry, Patrick J. Alladio, Russell F. Oberg, Brian Warwick, Gary W. Michalko
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Patent number: 10302675Abstract: The terminals of a device under test (DUT) are temporarily electrically connected to corresponding contact pads on a load board by a series of electrically conductive pin pairs. The pin pairs are held in place by an interposer membrane with a top facing the device under test, a bottom facing the load board, and a vertically resilient, non-conductive member between the top and bottom contact plates. Each pin pair includes a top and bottom pin, which extend beyond the top and bottom contact plates, respectively, toward the device under test and the load board, respectively. The bottom pins has a lower contact surface which includes an arcuate portion or ridge which increases contact pressure and ablates oxides by the rocking action of ridge when the DUT in inserted.Type: GrantFiled: September 10, 2018Date of Patent: May 28, 2019Assignee: Johnstech International CorporationInventors: John E. Nelson, Jeffrey C. Sherry, Brian Warwick, Gary W. Michalko
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Publication number: 20190004091Abstract: The terminals of a device under test (DUT) are temporarily electrically connected to corresponding contact pads on a load board by a series of electrically conductive pin pairs. The pin pairs are held in place by an interposer membrane with a top facing the device under test, a bottom facing the load board, and a vertically resilient, non-conductive member between the top and bottom contact plates. Each pin pair includes a top and bottom pin, which extend beyond the top and bottom contact plates, respectively, toward the device under test and the load board, respectively. The bottom pins has a lower contact surface which includes an arcuate portion or ridge which increases contact pressure and ablates oxides by the rocking action of ridge when the DUT in inserted.Type: ApplicationFiled: September 10, 2018Publication date: January 3, 2019Inventors: John E. Nelson, Jeffrey C. Sherry, Brian Warwick, Gary W. Michalko
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Patent number: 10073117Abstract: The terminals of a device under test (DUT) are temporarily electrically connected to corresponding contact pads on a load board by a series of electrically conductive pin pairs. The pin pairs are held in place by an interposer membrane with a top facing the device under test, a bottom facing the load board, and a vertically resilient, non-conductive member between the top and bottom contact plates. Each pin pair includes a top and bottom pin, which extend beyond the top and bottom contact plates, respectively, toward the device under test and the load board, respectively. The bottom pins has a lower contact surface which includes an arcuate portion or ridge which increases contact pressure and ablates oxides by the rocking action of ridge when the DUT in inserted.Type: GrantFiled: June 12, 2017Date of Patent: September 11, 2018Assignee: Johnstech International CorporationInventors: John E. Nelson, Jeffrey C. Sherry, Brian Warwick, Gary W. Michalko
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Publication number: 20170315169Abstract: The terminals of a device under test are temporarily electrically connected to corresponding contact pads on a load board by a series of electrically conductive pin pairs. The pin pairs are held in place by an interposer membrane that includes a top contact plate facing the device under test, a bottom contact plate facing the load board, and a vertically resilient, non-conductive member between the top and bottom contact plates. Each pin pair includes a top and bottom pin, which extend beyond the top and bottom contact plates, respectively, toward the device under test and the load board, respectively. The top and bottom pins contact each other at an interface that is inclined with respect to the membrane surface normal. When compressed longitudinally, the pins translate toward each other by sliding along the interface. The sliding is largely longitudinal, with a small and desirable lateral component determined by the inclination of the interface.Type: ApplicationFiled: July 19, 2017Publication date: November 2, 2017Inventors: John E. Nelson, Jeffrey C. Sherry, Patrick J. Alladio, Russell F. Oberg, Brian Warwick, Gary W. Michalko
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Publication number: 20170276699Abstract: The terminals of a device under test (DUT) are temporarily electrically connected to corresponding contact pads on a load board by a series of electrically conductive pin pairs. The pin pairs are held in place by an interposer membrane with a top facing the device under test, a bottom facing the load board, and a vertically resilient, non-conductive member between the top and bottom contact plates. Each pin pair includes a top and bottom pin, which extend beyond the top and bottom contact plates, respectively, toward the device under test and the load board, respectively. The bottom pins has a lower contact surface which includes an arcuate portion or ridge which increases contact pressure and ablates oxides by the rocking action of ridge when the DUT in inserted.Type: ApplicationFiled: June 12, 2017Publication date: September 28, 2017Inventors: John E. Nelson, Jeffrey C. Sherry, Brian Warwick, Gary W. Michalko
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Patent number: 9678106Abstract: The terminals of a device under test (DUT) are temporarily electrically connected to corresponding contact pads on a load board by a series of electrically conductive pin pairs. The pin pairs are held in place by an interposer membrane with a top facing the device under test, a bottom facing the load board, and a vertically resilient, non-conductive member between the top and bottom contact plates. Each pin pair includes a top and bottom pin, which extend beyond the top and bottom contact plates, respectively, toward the device under test and the load board, respectively. The bottom pins has a lower contact surface which includes an arcuate portion or ridge which increases contact pressure and ablates oxides by the rocking action of ridge when the DUT in inserted.Type: GrantFiled: March 28, 2016Date of Patent: June 13, 2017Assignee: Johnstech International CorporationInventors: John E. Nelson, Jeffrey C. Sherry, Brian Warwick, Gary W. Michalko
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Patent number: 9476936Abstract: The IC test system provides a system and method for thermal management of test pins. A test pin array (22) in a pin guide (24) is mounted in a retainer (20) which is located between an IC wafer (12) which contains IC devices to be tested (DUT) and a load board (40) which provides pathways to test signals to the DUT. On the other side of the load board is a contact plate (50) which together with the retainer straddles the load board. Leg extensions (36) pass through the load board apertures (42) and provide a thermal circuit from the contact plate to the retainer and to the pin array. On the upper side of the contact plate is a cooling/heating system with a thermal electric peltier device (62) and a further heat exchanger (64) as needed. Holes (44) are provided in the legs (36) to provide a supply of dry air to the wafer and pin array to minimize condensation as a result of cooling effects.Type: GrantFiled: March 14, 2014Date of Patent: October 25, 2016Assignee: Johnstech International CorporationInventors: David Johnson, Jeffrey Sherry, Harlan Faller, Brian Warwick, Sarosh Patel, John Bucher, Jay Drescher
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Publication number: 20160209444Abstract: The terminals of a device under test (DUT) are temporarily electrically connected to corresponding contact pads on a load board by a series of electrically conductive pin pairs. The pin pairs are held in place by an interposer membrane with a top facing the device under test, a bottom facing the load board, and a vertically resilient, non-conductive member between the top and bottom contact plates. Each pin pair includes a top and bottom pin, which extend beyond the top and bottom contact plates, respectively, toward the device under test and the load board, respectively. The bottom pins has a lower contact surface which includes an arcuate portion or ridge which increases contact pressure and ablates oxides by the rocking action of ridge when the DUT in inserted.Type: ApplicationFiled: March 28, 2016Publication date: July 21, 2016Inventors: John E. Nelson, Jeffrey C. Sherry, Brian Warwick, Gary W. Michalko
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Patent number: 9297832Abstract: The terminals of a device under test (DUT) are temporarily electrically connected to corresponding contact pads on a load board by a series of electrically conductive pin pairs. The pin pairs are held in place by an interposer membrane with a top facing the device under test, a bottom facing the load board, and a vertically resilient, non-conductive member between the top and bottom contact plates. Each pin pair includes a top and bottom pin, which extend beyond the top and bottom contact plates, respectively, toward the device under test and the load board, respectively. The bottom pins has a lower contact surface which includes an arcuate portion or ridge which increases contact pressure and ablates oxides by the rocking action of ridge when the DUT in inserted.Type: GrantFiled: May 27, 2014Date of Patent: March 29, 2016Assignee: Johnstech International CorporationInventors: John E. Nelson, Jeffrey C. Sherry, Brian Warwick, Gary W. Michalko
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Publication number: 20150123689Abstract: The terminals of a device under test are temporarily electrically connected to corresponding contact pads on a load board by a series of electrically conductive pin pairs. The pin pairs are held in place by an interposer membrane that includes a top contact plate facing the device under test, a bottom contact plate facing the load board, and a vertically resilient, non-conductive member between the top and bottom contact plates. Each pin pair includes a top and bottom pin, which extend beyond the top and bottom contact plates, respectively, toward the device under test and the load board, respectively. The top and bottom pins contact each other at an interface that is inclined with respect to the membrane surface normal. When compressed longitudinally, the pins translate toward each other by sliding along the interface.Type: ApplicationFiled: January 12, 2015Publication date: May 7, 2015Inventors: John E. Nelson, Jeffrey C. Sherry, Patrick J. Alladio, Russell F. Oberg, Brian Warwick, Gary W. Michalko
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Patent number: 9007082Abstract: The terminals of a device under test are temporarily electrically connected to corresponding contact pads on a load board by a series of electrically conductive pin pairs. The pin pairs are held in place by an interposer membrane that includes a top contact plate facing the device under test, a bottom contact plate facing the load board including a rocker base protrusion, and a vertically resilient, non-conductive member between the top and bottom contact plates. Each pin pair includes a top and bottom pin, which extend beyond the top and bottom contact plates, respectively, toward the device under test and the load board, respectively. The top and bottom pins contact each other at an interface that is inclined with respect to the membrane surface normal. When compressed longitudinally, the pins translate toward each other by sliding along the interface. The sliding is largely longitudinal, with a small and desirable lateral component determined by the inclination of the interface.Type: GrantFiled: June 20, 2012Date of Patent: April 14, 2015Assignee: Johnstech International CorporationInventors: John E. Nelson, Jeffrey C. Sherry, Patrick J. Alladio, Russell F. Oberg, Brian Warwick, Gary W. Michalko
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Patent number: 8937484Abstract: The terminals of a device under test are temporarily electrically connected to corresponding contact pads on a load board by a series of electrically conductive pin pairs. The pin pairs are held in place by an interposer membrane that includes a top contact plate facing the device under test, a bottom contact plate facing the load board, and a vertically resilient, non-conductive member between the top and bottom contact plates. Each pin pair includes a top and bottom pin, which extend beyond the top and bottom contact plates, respectively, toward the device under test and the load board, respectively. The top and bottom pins contact each other at an interface that is inclined with respect to the membrane surface normal. When compressed longitudinally, the pins translate toward each other by sliding along the interface. The sliding is largely longitudinal, with a small and desirable lateral component determined by the inclination of the interface.Type: GrantFiled: June 13, 2013Date of Patent: January 20, 2015Assignee: Johnstech International CorporationInventors: John E. Nelson, Jeffrey C. Sherry, Patrick J. Alladio, Russell F. Oberg, Brian Warwick, Gary W. Michalko
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Publication number: 20140266279Abstract: The terminals of a device under test (DUT) are temporarily electrically connected to corresponding contact pads on a load board by a series of electrically conductive pin pairs. The pin pairs are held in place by an interposer membrane with a top facing the device under test, a bottom facing the load board, and a vertically resilient, non-conductive member between the top and bottom contact plates. Each pin pair includes a top and bottom pin, which extend beyond the top and bottom contact plates, respectively, toward the device under test and the load board, respectively. The bottom pins has a lower contact surface which includes an arcuate portion or ridge which increases contact pressure and ablates oxides by the rocking action of ridge when the DUT in inserted.Type: ApplicationFiled: May 27, 2014Publication date: September 18, 2014Applicant: Johnstech International CorporationInventors: John E. Nelson, Jeffrey C. Sherry, Brian Warwick, Gary W. Michalko
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Publication number: 20130271176Abstract: The terminals of a device under test are temporarily electrically connected to corresponding contact pads on a load board by a series of electrically conductive pin pairs. The pin pairs are held in place by an interposer membrane that includes a top contact plate facing the device under test, a bottom contact plate facing the load board, and a vertically resilient, non-conductive member between the top and bottom contact plates. Each pin pair includes a top and bottom pin, which extend beyond the top and bottom contact plates, respectively, toward the device under test and the load board, respectively. The top and bottom pins contact each other at an interface that is inclined with respect to the membrane surface normal. When compressed longitudinally, the pins translate toward each other by sliding along the interface. The sliding is largely longitudinal, with a small and desirable lateral component determined by the inclination of the interface.Type: ApplicationFiled: June 13, 2013Publication date: October 17, 2013Inventors: John E. Nelson, Jeffrey C. Sherry, Patrick J. Alladio, Russell F. Oberg, Brian Warwick, Gary W. Michalko