Patents by Inventor Brian Washo

Brian Washo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8986789
    Abstract: The invention relates to a substrate having a bondable metal coating comprising, in this order, on an Al or Cu surface: (a) a Ni—P layer, (b) a Pd layer and, optionally, (c) an Au layer, wherein the thickness of the Ni—P layer (a) is 0.2 to 10 m, the thickness of the Pd layer (b) is 0.05 to 1.0 m and the thickness of the optional Au layer (c) is 0.01 to 0.5 m, and wherein the Ni—P layer (a) has a P content of 10.5 to 14 wt.-%. The deposit internal stress of the resulting Ni—P/Pd stack is not higher than 34.48M?Pa (5,000 psi). Further, a process for the preparation of such a substrate is described.
    Type: Grant
    Filed: October 1, 2009
    Date of Patent: March 24, 2015
    Assignee: Atotech Deutschland GmbH
    Inventors: Albrecht Uhlig, Josef Gaida, Christof Suchentrunk, Michael Boyle, Brian Washo
  • Publication number: 20110200842
    Abstract: The invention relates to a substrate having a bondable metal coating comprising, in this order, on an Al or Cu surface: (a) a Ni—P layer, (b) a Pd layer and, optionally, (c) an Au layer, wherein the thickness of the Ni—P layer (a) is 0.2 to 10 m, the thickness of the Pd layer (b) is 0.05 to 1.0 m and the thickness of the optional Au layer (c) is 0.01 to 0.5 m, and wherein the Ni—P layer (a) has a P content of 10.5 to 14 wt.-%. The deposit internal stress of the resulting Ni—P/Pd stack is not higher than 34.48 M?Pa (5,000 psi). Further, a process for the preparation of such a substrate is described.
    Type: Application
    Filed: October 1, 2009
    Publication date: August 18, 2011
    Applicant: ATOTECH DEUTSCHLAND GMBH
    Inventors: Albrecht Uhlig, Josef Gaida, Christof Suchentrunk, Michael Boyle, Brian Washo