Patents by Inventor Brian WERNEKE

Brian WERNEKE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11849562
    Abstract: A computer equipment cooling device comprising: a temperature dependent thermal conduction member that includes a first major surface and a second major surface; a set of fins connected in thermal communication with the first major surface; and a cold plate connected in thermal communication with the second major surface.
    Type: Grant
    Filed: February 24, 2022
    Date of Patent: December 19, 2023
    Assignee: International Business Machines Corporation
    Inventors: Sadegh Khalili, Yuanchen Hu, Milnes P. David, Brian Werneke
  • Publication number: 20230269902
    Abstract: A computer equipment cooling device comprising: a temperature dependent thermal conduction member that includes a first major surface and a second major surface; a set of fins connected in thermal communication with the first major surface; and a cold plate connected in thermal communication with the second major surface.
    Type: Application
    Filed: February 24, 2022
    Publication date: August 24, 2023
    Inventors: Sadegh Khalili, Yuanchen Hu, MILNES P. DAVID, Brian Werneke
  • Patent number: 10772188
    Abstract: An apparatus for providing a stiffener and cooling to a printed circuit board includes a printed circuit board coupled to a top surface of a stiffening cooling structure, where a lower surface of the printed circuit board is opposite the top surface of the stiffening cooling structure. One or more channels of the stiffening cooling structure defined by the top surface of the stiffening cooling structure, a bottom surface of the stiffening cooling structure, and one or more support members, where the one or more support members are positioned between the top surface of the stiffening cooling structure and the bottom surface of the stiffening cooling. One or more apertures in the top surface of the stiffening cooling structure directs airflow from the one or more channels of the stiffening cooling structure to one or more components disposed on a top surface of the printed circuit board.
    Type: Grant
    Filed: June 11, 2019
    Date of Patent: September 8, 2020
    Assignee: International Business Machines Corporation
    Inventors: Ryan Elsasser, David Charles Olson, Brian Werneke
  • Patent number: 10662961
    Abstract: A pump is provided which includes a rotating element, and a volute housing having a fluid inlet and a fluid outlet. In operational state, the rotating element rotates, drawing fluid through the fluid inlet of the volute housing and expelling the fluid at a higher pressure through the fluid outlet. Further, the pump includes a bypass mechanism integrated, at least in part, within the volute housing and exposing in nonoperational state of the pump, a bypass path through, at least in part, the volute housing that allows the fluid to pass from the fluid inlet to the fluid outlet of the pump.
    Type: Grant
    Filed: November 2, 2017
    Date of Patent: May 26, 2020
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Levi A. Campbell, Francis R. Krug, Jr., Milnes David, Dustin Demetriou, Michael J. Ellsworth, Jr., Brian Werneke
  • Publication number: 20190128271
    Abstract: A pump is provided which includes a rotating element, and a volute housing having a fluid inlet and a fluid outlet. In operational state, the rotating element rotates, drawing fluid through the fluid inlet of the volute housing and expelling the fluid at a higher pressure through the fluid outlet. Further, the pump includes a bypass mechanism integrated, at least in part, within the volute housing and exposing in nonoperational state of the pump, a bypass path through, at least in part, the volute housing that allows the fluid to pass from the fluid inlet to the fluid outlet of the pump.
    Type: Application
    Filed: November 2, 2017
    Publication date: May 2, 2019
    Inventors: Levi A. CAMPBELL, Francis R. KRUG, JR., Milnes DAVID, Dustin DEMETRIOU, Michael J. ELLSWORTH, JR., Brian WERNEKE