Patents by Inventor Brice Arrazat
Brice Arrazat has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230327028Abstract: A semiconductor substrate includes excavations which form trenches sunk. A capacitive element includes: a first dielectric envelope conforming to sides and bottoms of the trenches; a first semiconductor layer conforming to a surface of the first dielectric envelope in the trenches; a second dielectric envelope conforming to a surface of the first semiconductor layer in the trenches; and a second semiconductor layer conforming to a surface of the second dielectric envelope in the trenches.Type: ApplicationFiled: June 15, 2023Publication date: October 12, 2023Applicant: STMicroelectronics (Rousset) SASInventors: Christian RIVERO, Brice ARRAZAT, Julien DELALLEAU, Joel METZ
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Patent number: 11721773Abstract: A semiconductor substrate includes excavations which form trenches sunk. A capacitive element includes: a first dielectric envelope conforming to sides and bottoms of the trenches; a first semiconductor layer conforming to a surface of the first dielectric envelope in the trenches; a second dielectric envelope conforming to a surface of the first semiconductor layer in the trenches; and a second semiconductor layer conforming to a surface of the second dielectric envelope in the trenches.Type: GrantFiled: July 2, 2021Date of Patent: August 8, 2023Assignee: STMicroelectronics (Rousset) SASInventors: Christian Rivero, Brice Arrazat, Julien Delalleau, Joel Metz
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Publication number: 20220109078Abstract: A semi-transparent photovoltaic module comprises a basic 2D pattern representing an arrangement of an electrically conductive zone and electrically non-conductive zones such that any point in the electrically conductive zone is electrically connected to any other point of the zone and the electrically conductive zone is a regular or pseudo-regular structure formed by an elementary geometrical figure. The module additionally comprises one or more active isolation lines and a plurality of non-functional isolation lines that are mutually parallel.Type: ApplicationFiled: December 15, 2021Publication date: April 7, 2022Inventors: Mohamed Bouchoucha, Brice Arrazat
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Publication number: 20220085233Abstract: A method for optimizing the electrical performance of all or part of a photovoltaic module (11) through breakdown at the metal/oxide/metal interface. The method may include: —Step 1: Illuminating all or part of said photovoltaic module with a luminous flux controlled by a control module (14); —Step 2: Reverse-biasing said photovoltaic module: by subjecting it to a voltage sweep ranging from ?Voc/2, Voc being the open-circuit voltage, to a limit bias voltage VL whose value depends on the mode of interconnection and on the number (NB) of cells forming all or part of said photovoltaic module.Type: ApplicationFiled: November 22, 2021Publication date: March 17, 2022Inventors: Sylvain De Vecchi, Brice Arrazat
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Publication number: 20220005960Abstract: A semiconductor substrate includes excavations which form trenches sunk. A capacitive element includes: a first dielectric envelope conforming to sides and bottoms of the trenches; a first semiconductor layer conforming to a surface of the first dielectric envelope in the trenches; a second dielectric envelope conforming to a surface of the first semiconductor layer in the trenches; and a second semiconductor layer conforming to a surface of the second dielectric envelope in the trenches.Type: ApplicationFiled: July 2, 2021Publication date: January 6, 2022Applicant: STMicroelectronics (Rousset) SASInventors: Christian RIVERO, Brice ARRAZAT, Julien DELALLEAU, Joel METZ
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Publication number: 20210210644Abstract: A semitransparent photovoltaic device comprising: a plurality of active photovoltaic areas including a transparent substrate, a front electrode, an absorber including one or more thin photoactive layers, and a rear electrode; a transparency area separating at least two of the active photovoltaic areas; and a collection grid. The collection grid includes a metallic contact layer and a plurality of VIAs between the front electrode and the metallic contact layer, wherein the VIAs are randomly distributed within the active photovoltaic area.Type: ApplicationFiled: March 23, 2021Publication date: July 8, 2021Inventors: Eric J. Betschitch, Oliver R. F. Gagliano, Emilie Bialic, Brice Arrazat
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Patent number: 10748726Abstract: A device includes a thermally deformable assembly accommodated in a cavity of the interconnection part of an integrated circuit. The assembly can bend when there is a variation in temperature, so that its free end zone is displaced vertically. The assembly can be formed in the back end of line of the integrated circuit.Type: GrantFiled: December 17, 2018Date of Patent: August 18, 2020Assignee: STMICROELECTRONICS (ROUSSET) SASInventors: Christian Rivero, Pascal Fornara, Antonio Di-Giacomo, Brice Arrazat
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Publication number: 20200083011Abstract: Methods of operating a switching device are provided. The switching device is formed in an interconnect, the interconnect including a plurality of metallization levels, and has an assembly that includes a beam held by a structure. The beam and structure are located within the same metallization level. Locations of fixing of the structure on the beam are arranged so as to define for the beam a pivot point situated between these fixing locations. The structure is substantially symmetric with respect to the beam and to a plane perpendicular to the beam in the absence of a potential difference. The beam is able to pivot in a first direction in the presence of a first potential difference applied between a first part of the structure and to pivot in a second direction in the presence of a second potential difference applied between a second part of the structure.Type: ApplicationFiled: November 12, 2019Publication date: March 12, 2020Inventors: Christian Rivero, Pascal Fornara, Antonio Di-Giacomo, Brice Arrazat
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Patent number: 10510503Abstract: Methods of forming and operating a switching device are provided. The switching device is formed in an interconnect, the interconnect including a plurality of metallization levels, and has an assembly that includes a beam held by a structure. The beam and structure are located within the same metallization level. Locations of fixing of the structure on the beam are arranged so as to define for the beam a pivot point situated between these fixing locations. The structure is substantially symmetric with respect to the beam and to a plane perpendicular to the beam in the absence of a potential difference. The beam is able to pivot in a first direction in the presence of a first potential difference applied between a first part of the structure and to pivot in a second direction in the presence of a second potential difference applied between a second part of the structure.Type: GrantFiled: December 30, 2015Date of Patent: December 17, 2019Assignee: STMICROELECTRONICS (ROUSSET) SASInventors: Christian Rivero, Pascal Fornara, Antonio di-Giacomo, Brice Arrazat
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Patent number: 10461861Abstract: A coded-light communication device is described, in which the communication has an initial signal-to-noise ratio, which varies according to the lighting conditions. The device comprises at least one photodetector-type light receiver comprising an anode and a cathode and having an initial shunt resistance. The receiver is capable of being simultaneously exposed to a coded light source carrying a signal and a non-coded light source. The anode and cathode are short-circuited by at least one short-circuit resistance arranged inside the photodetector, having a value selected so that the new value of the shunt resistance of the photodetector resulting from the connection of the initial shunt resistance and the short-circuit resistance gives the communication device a new resultant signal-to-noise ratio which remains substantially independent of the intensity of the non-coded light.Type: GrantFiled: December 30, 2016Date of Patent: October 29, 2019Assignee: Garmin Switzerland GmbHInventors: Brice Arrazat, Emilie Bialic, Sylvain de Vecchi
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Publication number: 20190122845Abstract: A device includes a thermally deformable assembly accommodated in a cavity of the interconnection part of an integrated circuit. The assembly can bend when there is a variation in temperature, so that its free end zone is displaced vertically. The assembly can be formed in the back end of line of the integrated circuit.Type: ApplicationFiled: December 17, 2018Publication date: April 25, 2019Inventors: Christian Rivero, Pascal Fornara, Antonio Di-Giacomo, Brice Arrazat
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Publication number: 20190028194Abstract: A coded-light communication device is described, in which the communication has an initial signal-to-noise ratio, which varies according to the lighting conditions. The device comprises at least one photodetector-type light receiver comprising an anode and a cathode and having an initial shunt resistance. The receiver is capable of being simultaneously exposed to a coded light source carrying a signal and a non-coded light source. The anode and cathode are short-circuited by at least one short-circuit resistance arranged inside the photodetector, having a value selected so that the new value of the shunt resistance of the photodetector resulting from the connection of the initial shunt resistance and the short-circuit resistance gives the communication device a new resultant signal-to-noise ratio which remains substantially independent of the intensity of the non-coded light.Type: ApplicationFiled: December 30, 2016Publication date: January 24, 2019Applicant: Sunpartner TechnologiesInventors: Brice Arrazat, Emilie Bialic, Sylvain de Vecchi
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Patent number: 10157720Abstract: A device includes a thermally deformable assembly accommodated in a cavity of the interconnection part of an integrated circuit. The assembly can bend when there is a variation in temperature, so that its free end zone is displaced vertically. The assembly can be formed in the back end of line of the integrated circuit.Type: GrantFiled: October 17, 2014Date of Patent: December 18, 2018Assignee: STMICROELECTRONICS (ROUSSET) SASInventors: Christian Rivero, Pascal Fornara, Antonio di-Giacomo, Brice Arrazat
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Patent number: 9355802Abstract: An integrated circuit includes an interconnection part with several metallization levels. An electrically activatable switching device within the interconnection part has an assembly that includes a beam held by a structure. The beam and structure are located within the same metallization level. Locations of fixing of the structure on the beam are arranged so as to define for the beam a pivot point situated between these fixing locations. The structure is substantially symmetric with respect to the beam and to a plane perpendicular to the beam in the absence of a potential difference. The beam is able to pivot in a first direction in the presence of a first potential difference applied between a first part of the structure and to pivot in a second direction in the presence of a second potential difference applied between a second part of the structure.Type: GrantFiled: May 23, 2014Date of Patent: May 31, 2016Assignee: STMICROELECTRONICS (ROUSSET) SASInventors: Christian Rivero, Pascal Fornara, Antonio di-Giacomo, Brice Arrazat
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Publication number: 20160107886Abstract: Methods of forming and operating a switching device are provided. The switching device is formed in an interconnect, the interconnect including a plurality of metallization levels, and has an assembly that includes a beam held by a structure. The beam and structure are located within the same metallization level. Locations of fixing of the structure on the beam are arranged so as to define for the beam a pivot point situated between these fixing locations. The structure is substantially symmetric with respect to the beam and to a plane perpendicular to the beam in the absence of a potential difference. The beam is able to pivot in a first direction in the presence of a first potential difference applied between a first part of the structure and to pivot in a second direction in the presence of a second potential difference applied between a second part of the structure.Type: ApplicationFiled: December 30, 2015Publication date: April 21, 2016Inventors: Christian Rivero, Pascal Fornara, Antonio di-Giacomo, Brice Arrazat
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Publication number: 20150116072Abstract: A device includes a thermally deformable assembly accommodated in a cavity of the interconnection part of an integrated circuit. The assembly can bend when there is a variation in temperature, so that its free end zone is displaced vertically. The assembly can be formed in the back end of line of the integrated circuit.Type: ApplicationFiled: October 17, 2014Publication date: April 30, 2015Inventors: Christian Rivero, Pascal Fornara, Antonio di-Giacomo, Brice Arrazat
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Publication number: 20140360851Abstract: An integrated circuit includes an interconnection part with several metallization levels. An electrically activatable switching device within the interconnection part has an assembly that includes a beam held by a structure. The beam and structure are located within the same metallization level. Locations of fixing of the structure on the beam are arranged so as to define for the beam a pivot point situated between these fixing locations. The structure is substantially symmetric with respect to the beam and to a plane perpendicular to the beam in the absence of a potential difference. The beam is able to pivot in a first direction in the presence of a first potential difference applied between a first part of the structure and to pivot in a second direction in the presence of a second potential difference applied between a second part of the structure.Type: ApplicationFiled: May 23, 2014Publication date: December 11, 2014Applicant: STMICROELECTRONICS (ROUSSET) SASInventors: Christian Rivero, Pascal Fornara, Antonio di-Giacomo, Brice Arrazat