Abstract: A digital compensation system for a radio frequency (RF) power amplifier module is disclosed. The digital compensation system includes an RF power amplifier having a first input, a first output, and a first bias input, wherein the RF power amplifier is configured to receive an RF signal at the first input and generate an amplified version of the RF signal at the first output. The digital compensation system also includes compensation circuitry coupled between the first input and the first output and a bias output coupled to the RF power amplifier, wherein the compensation circuitry is configured, in response to the RF signal, to generate or adjust a bias signal at the first bias input to correct dynamic bias errors caused by amplification variations that have time constants.

Abstract: Disclosed is a filter bank module having a substrate, an antenna port terminal, and a filter bank die. The filter bank die is fixed to the substrate and includes a first acoustic wave (AW) filter having a first antenna terminal coupled to the antenna port terminal and a first filter terminal, wherein the first AW filter is configured to pass a first passband and attenuate frequencies outside the first passband, and a second AW filter having a second filter terminal, and a second antenna terminal coupled to the first antenna terminal to effectively diplex signals that pass through the first AW filter and the second AW filter, wherein the second AW filter is configured to pass a second passband that is spaced from the first passband to minimize interference between first bandpass and the second bandpass while attenuating frequencies outside the second passband.

Abstract: In some embodiments, a printed circuit board is disclosed. The printed circuit board includes a substrate, a conductive plane, and at least one switch. The conductive plane includes an edge enabled void construction (EEVC) along a geometric perimeter of the conductive plane, the EEVC having an EEVC void that defines an EEVC perimeter that extends into the conductive plane.

Abstract: The disclosure is directed to an integrated circuit (IC) die stacked with a backer die, including capacitors and thermal vias. The backer die includes a substrate material to contain and electrically insulate one or more capacitors at a back of the IC die. The backer die further includes a thermal material that is more thermally conductive than the substrate material for thermal spreading and increased heat dissipation. In particular, the backer die electrically couples capacitors to the IC die in a stacked configuration while also spreading and dissipating heat from the IC die. Such a configuration reduces an overall footprint of the electronic device, resulting in decreased integrated circuits (IC) packages and module sizes. In other words, instead of placing the capacitors next to the IC die, the capacitors are stacked on top of the IC die, thereby reducing an overall surface area of the package.

Abstract: Disclosed is a filter bank die that includes a first acoustic wave (AW) filter having a first antenna terminal coupled to the antenna port terminal and a first filter terminal, wherein the first AW filter is configured to have a filter skirt with a slope that spans at least a 100 MHz gap between adjacent passbands, and a second AW filter having a second filter terminal, and a second antenna terminal coupled to the first antenna terminal to effectively diplex signals that pass through the first AW filter and the second AW filter.

Abstract: Disclosed is a filter bank module having a substrate, an antenna port terminal, and a filter bank die. The filter bank die is fixed to the substrate and includes a first acoustic wave (AW) filter having a first antenna terminal coupled to the antenna port terminal and a first filter terminal, and a second AW filter having a second filter terminal, and a second antenna terminal coupled to the first antenna terminal to effectively diplex signals that pass through the first AW filter and the second AW filter.

Abstract: Disclosed is a filter bank die having a first acoustic wave (AW) filter having a first antenna terminal and a first filter terminal, and a second AW filter having a second filter terminal, and a second antenna terminal coupled to the first antenna terminal to effectively diplex signals that pass through the first AW filter and the second AW filter.

Abstract: Disclosed is a filter bank module having a substrate, an antenna port terminal, and a filter bank die. The filter bank die is fixed to the substrate and includes a first acoustic wave (AW) filter having a first antenna terminal coupled to the antenna port terminal and a first filter terminal, wherein the first AW filter is configured to pass a first passband and attenuate frequencies outside the first passband, and a second AW filter having a second filter terminal, and a second antenna terminal coupled to the first antenna terminal to effectively diplex signals that pass through the first AW filter and the second AW filter, wherein the second AW filter is configured to pass a second passband that is spaced from the first passband to minimize interference between first bandpass and the second bandpass while attenuating frequencies outside the second passband.

Abstract: The disclosure is directed to an integrated circuit (IC) die stacked with a backer die, including capacitors and thermal vias. The backer die includes a substrate material to contain and electrically insulate one or more capacitors at a back of the IC die. The backer die further includes a thermal material that is more thermally conductive than the substrate material for thermal spreading and increased heat dissipation. In particular, the backer die electrically couples capacitors to the IC die in a stacked configuration while also spreading and dissipating heat from the IC die. Such a configuration reduces an overall footprint of the electronic device, resulting in decreased integrated circuits (IC) packages and module sizes. In other words, instead of placing the capacitors next to the IC die, the capacitors are stacked on top of the IC die, thereby reducing an overall surface area of the package.

Abstract: A radio frequency (RF) control circuit is provided. The RF control circuit includes power amplifier (PA) circuitry for amplifying an RF signal and control circuitry configured to improve linearity of the PA circuitry based on a PA signature(s) already available and utilized to perform digital pre-distortion (DPD) in the RF control circuit. In examples discussed herein, the control circuitry determines a performance deviation of the PA circuitry based on the PA signature and continuously adjusts a bias voltage(s) supplied to the PA circuitry until the performance deviation is reduced to a predetermined performance deviation threshold. By continuously monitoring the performance deviation based on the PA signature(s) and adjusting the bias voltage(s), the control circuitry can detect and correct an operation abnormality of the PA circuitry in a timely manner. As a result, it is possible to maintain linearity in the PA circuitry for enhanced PA performance.

Abstract: System-in-package (SiP) devices are disclosed that include power amplifiers and controllers such as beamformer integrated circuits that are packaged together. Packaging and thermal management configurations are disclosed that allow a plurality of power amplifiers and a beamformer integrated circuit to operate efficiently while in close proximity to one another. SiP devices are disclosed that include heat spreaders that are incorporated within the SiP devices and exposed at top surfaces of the SiP devices to effectively dissipate heat. Heat spreaders may be provided as part of a lead frame that allows multiple SiP devices to be uniformly assembled with dimensions sized for high frequency applications, including millimeter wave operation.

Abstract: A digital compensation system for a radio frequency (RF) power amplifier module is disclosed. The digital compensation system includes an RF power amplifier having a first input, a first output, and a first bias input, wherein the RF power amplifier is configured to receive an RF signal at the first input and generate an amplified version of the RF signal at the first output. The digital compensation system also includes compensation circuitry coupled between the first input and the first output and a bias output coupled to the RF power amplifier, wherein the compensation circuitry is configured, in response to the RF signal, to generate or adjust a bias signal at the first bias input to correct dynamic bias errors caused by amplification variations that have time constants.

Abstract: System-in-package (SiP) devices are disclosed that include power amplifiers and controllers such as beamformer integrated circuits that are packaged together. Packaging and thermal management configurations are disclosed that allow a plurality of power amplifiers and a beamformer integrated circuit to operate efficiently while in close proximity to one another. SiP devices are disclosed that include heat spreaders that are incorporated within the SiP devices and exposed at top surfaces of the SiP devices to effectively dissipate heat. Heat spreaders may be provided as part of a lead frame that allows multiple SiP devices to be uniformly assembled with dimensions sized for high frequency applications, including millimeter wave operation.

Abstract: A radio frequency (RF) control circuit is provided. The RF control circuit includes power amplifier (PA) circuitry for amplifying an RF signal and control circuitry configured to improve linearity of the PA circuitry based on a PA signature(s) already available and utilized to perform digital pre-distortion (DPD) in the RF control circuit. In examples discussed herein, the control circuitry determines a performance deviation of the PA circuitry based on the PA signature and continuously adjusts a bias voltage(s) supplied to the PA circuitry until the performance deviation is reduced to a predetermined performance deviation threshold. By continuously monitoring the performance deviation based on the PA signature(s) and adjusting the bias voltage(s), the control circuitry can detect and correct an operation abnormality of the PA circuitry in a timely manner. As a result, it is possible to maintain linearity in the PA circuitry for enhanced PA performance.

Abstract: Techniques are provided to allow for implicit determination of the full spatial signature of a wireless channel between first and second wireless devices for multiple-input multiple-output (MIMO) wireless communication between the first and second wireless devices. The first wireless device receives uplink signals at a plurality of antennas of the first wireless device that are transmitted via a plurality of antennas of a second wireless device. Values at a plurality of subcarriers of the received signals across the plurality of antennas of the first wireless device are derived. Using a sliding window for groups of adjacent subcarriers, downlink beamforming weights are computed for each group of subcarriers using channel information of one or more proximate groups of subcarriers. The downlink beamforming weights for the respective groups of subcarriers are applied to a number of spatial streams in a downlink transmission to be transmitted to the second wireless device.

Abstract: Techniques are provided to allow for implicit determination of the full spatial signature of a wireless channel between first and second wireless devices for multiple-input multiple-output (MIMO) wireless communication between the first and second wireless devices. The first wireless device receives uplink signals at a plurality of antennas of the first wireless device that are transmitted via a plurality of antennas of a second wireless device. Values at a plurality of subcarriers of the received signals across the plurality of antennas of the first wireless device are derived. Using a sliding window for groups of adjacent subcarriers, downlink beamforming weights are computed for each group of subcarriers using channel information of one or more proximate groups of subcarriers. The downlink beamforming weights for the respective groups of subcarriers are applied to a number of spatial streams in a downlink transmission to be transmitted to the second wireless device.

Abstract: Techniques are provided to pre-distort a signal that is transmitted by a transmitter of a wireless communication device, e.g., a device configured for wireless radio frequency communication. The transmitter of the device inherently introduces distortion to the baseband signal to be transmitted. In at least one frame of a baseband signal to be transmitted, at least one subcarrier in a preamble of the frame is shifted in frequency such that the at least one subcarrier is offset from a normal subcarrier frequency position. The at least one frame of the baseband signal is supplied to the transmitter that is configured to produce a transmit signal for transmission. The transmit signal at an output of the transmitter is sampled or detected and inter-modulation distortion in the transmit signal is determined at one or more frequencies as a result of shifting of the frequency of the at least one subcarrier in the preamble of the at least one frame.

Abstract: Techniques are provided for crest factor reduction of a symbol to be transmitted by a communication device. The symbol may be an orthogonal frequency division multiplexed (OFDM) formatted symbol. In a communication device, samples of the symbol are clipped with a clipping level. A signal quality of the symbol is computed after it is clipped. A determination is made as to whether the signal quality satisfies a predetermined criterion. When the signal quality does not satisfy the predetermined criterion, the clipping level is adjusted. The clipping, computing, determining and adjusting operations are repeated until the signal quality satisfies the predetermined criterion. The symbol clipped by the clipping level determined to result in satisfying the predetermined criterion is output for supply to a transmitter in the communication device.

Abstract: A method for determining timing positions in a wireless communications system comprises creating a time-domain timing detection window from a preamble of a receiving signal, generating a first vector of correlations between sampling points in the time-domain timing detection window and sampling points of a known preamble, identifying a pivot position from the largest correlation value of the first vector and generating second vectors based on the pivot position, generating a third vector comprising the largest elements of the second vectors; generating a fourth vector comprising sums of elements in the second vectors, generating fifth and sixth vectors comprising a sum of subsets of the third and fourth vectors, respectively, calculating a seventh vector using the fifth and sixth vectors according to a predetermined equation, and selecting an index of one element from the fifth and seventh vectors to be the timing position according to a predetermined rule.

Abstract: Techniques are provided to pre-distort a signal that is transmitted by a transmitter of a wireless communication device, e.g., a device configured for wireless radio frequency communication. The transmitter of the device inherently introduces distortion to the baseband signal to be transmitted. In at least one frame of a baseband signal to be transmitted, at least one subcarrier in a preamble of the frame is shifted in frequency such that the at least one subcarrier is offset from a normal subcarrier frequency position. The at least one frame of the baseband signal is supplied to the transmitter that is configured to produce a transmit signal for transmission. The transmit signal at an output of the transmitter is sampled or detected and inter-modulation distortion in the transmit signal is determined at one or more frequencies as a result of shifting of the frequency of the at least one subcarrier in the preamble of the at least one frame.