Abstract: An infrared imaging system is provided with a shutter assembly having an integrated thermistor. In one example, a device includes a shutter assembly. The shutter assembly includes a paddle configured to move between an open position and a closed position. The paddle is configured to block external infrared radiation from reaching a focal plane array (FPA) in a closed position, and pass the external infrared radiation to the FPA in an open position. The shutter assembly also includes an embedded thermistor configured to sense a temperature of the paddle when the paddle is in the open position. In another example, an infrared sensor assembly includes a first set of mechanically engageable electrical contacts for engaging with a second set of mechanically engageable electrical contacts of a shutter assembly electrically coupled with a thermistor through a conductive path. Additional devices and related methods are also provided.

Abstract: Various techniques are provided to facilitate electrostatic discharge mitigation for imaging devices. In one example, an imaging device includes an imager assembly. The imaging device further includes a lens holder. The lens holder includes a receiving interface configured to receive a lens assembly therein. The lens holder further includes an alignment pin including electrically conductive material and coupled to the imager assembly to provide an electrostatic discharge path via the imager assembly, where a first portion of the alignment pin has the electrically conductive material exposed and a second portion of the alignment pin has an insulating layer disposed thereon. Related methods and systems are also provided.

Abstract: An infrared imaging system is provided with a shutter assembly having an integrated thermistor. In one example, a device includes a shutter assembly. The shutter assembly includes a paddle configured to move between an open position and a closed position. The paddle is configured to block external infrared radiation from reaching a focal plane array (FPA) in a closed position, and pass the external infrared radiation to the FPA in an open position. The shutter assembly also includes an embedded thermistor configured to sense a temperature of the paddle when the paddle is in the open position. In another example, an infrared sensor assembly includes a first set of mechanically engageable electrical contacts for engaging with a second set of mechanically engageable electrical contacts of a shutter assembly electrically coupled with a thermistor through a conductive path. Additional devices and related methods are also provided.

Abstract: Various techniques are provided to implement a modular infrared imager assembly configured to interface with supporting electronics provided, for example, by a third party. In one example, a system includes an imager assembly comprising a focal plane array configured to capture thermal image data from a scene and output the thermal image data, a printed circuit board assembly, and processing electronics communicatively connected to the focal plane array through the printed circuit board assembly and configured to receive and process the thermal image data. The system further includes a connector communicatively connected to the imager assembly and configured to interface with supporting electronics configured to receive and additionally process the thermal image data.

Abstract: Various techniques are provided to facilitate electrostatic discharge mitigation for imaging devices. In one example, an imaging device includes an imager assembly. The imaging device further includes a lens holder. The lens holder includes a receiving interface configured to receive a lens assembly therein. The lens holder further includes an alignment pin including electrically conductive material and coupled to the imager assembly to provide an electrostatic discharge path via the imager assembly, where a first portion of the alignment pin has the electrically conductive material exposed and a second portion of the alignment pin has an insulating layer disposed thereon. Related methods and systems are also provided.

Abstract: Various embodiments of the present disclosure may include a focal plane array configured to capture thermal image data from a scene. The embodiments may further include a sensor window displaced a first distance from the focal plane array. The embodiments may also include a protective window displaced a second distance greater than the first distance from the focal plane array, wherein the second distance causes damage or debris incident on the protective window to be out of focus in the thermal image data.

Abstract: Various techniques are provided to implement a modular infrared imager assembly configured to interface with supporting electronics provided, for example, by a third party. In one example, a system includes an imager assembly comprising a focal plane array configured to capture thermal image data from a scene and output the thermal image data, a printed circuit board assembly, and processing electronics communicatively connected to the focal plane array through the printed circuit board assembly and configured to receive and process the thermal image data. The system further includes a connector communicatively connected to the imager assembly and configured to interface with supporting electronics configured to receive and additionally process the thermal image data.

Abstract: Various embodiments of the present disclosure may include a focal plane array configured to capture thermal image data from a scene. The embodiments may further include a sensor window displaced a first distance from the focal plane array. The embodiments may also include a protective window displaced a second distance greater than the first distance from the focal plane array, wherein the second distance causes damage or debris incident on the protective window to be out of focus in the thermal image data.