Abstract: A thermally conductive laminate structure for use as a mounting base and/or chassis attachment member in combination with solid-state electronic devices, the laminate preferably comprising up to five layers including a pair of outer metallic layers disposed on opposite sides of center composite layers of electrically insulative layers separated by an interposed metallic layer. The center insulative layers are films of polyimide(amide) material, with the polyimide(amide) film being filled with a quantity of aluminum oxide, boron nitride, or other suitable particulate solid in an amount ranging from between about 30% and 100% by weight of polyimide(amide) solids. The outer layers are metallic, with the base member being a metallic pad of copper or aluminum, and with the opposed metallic layer being copper and arranged in a printed circuitry pattern or array.

Abstract: A thermally conductive electrically insulative laminate for use as chassis barriers in combination with solid-state electronic devices, the laminate comprising at least three layers and including a pair of outer layers disposed on opposite sides of a center layer. The center layer comprises a film of a polyimide (amide) filled with a quantity of either aluminum oxide or boron nitride particulate solids and included in an amount ranging from between about 10% to about 50% by volume. The outer layers consist essentially of silicone base rubber, and are preferably filled with a quantity of aluminum oxide or boron nitride particulate solids in an amount ranging from between about 25% and 50% by volume.