Abstract: A winged heat sink includes one or more arms that transport heat from a pedestal that is thermally coupled to an integrated circuit to convective fins. For example, the one or more arms may include one or more heat pipes. Moreover, the arms extend the vertical position of the winged heat sink away from a plane of the pedestal so that the convective fins extend downward back toward a circuit board on which the integrated circuit is mounted. These downward facing fins may match the topologies of components on the underlying circuit board.

Abstract: A chip package includes adjacent integrated circuits on a circuit board, and separate heat sinks are thermally coupled to the integrated circuits. Because the integrated circuits are in close proximity, heat pipes in the separate heat sinks are interdigitated to prevent mechanical interference between the heat sinks. The amount of interdigitation depends on the separation between the integrated circuits and how the integrated circuits are arranged relative to an external fluid (such as flowing air). At the minimum, the heat pipes in fin regions of the heat sinks (which include fins for convective heat transfer to the external fluid) are interdigitated. However, the heat pipes may be interdigitated in pedestal regions of the heat sinks (which are thermally coupled to the integrated circuits) and/or in ramp regions of the heat sinks (in which vertical positions of the heat sinks change from the pedestal regions to the fin regions).

Abstract: A chip package includes adjacent integrated circuits on a circuit board, and separate heat sinks are thermally coupled to the integrated circuits. Because the integrated circuits are in close proximity, heat pipes in the separate heat sinks are interdigitated to prevent mechanical interference between the heat sinks. The amount of interdigitation depends on the separation between the integrated circuits and how the integrated circuits are arranged relative to an external fluid (such as flowing air). At the minimum, the heat pipes in fin regions of the heat sinks (which include fins for convective heat transfer to the external fluid) are interdigitated. However, the heat pipes may be interdigitated in pedestal regions of the heat sinks (which are thermally coupled to the integrated circuits) and/or in ramp regions of the heat sinks (in which vertical positions of the heat sinks change from the pedestal regions to the fin regions).

Abstract: A winged heat sink includes one or more arms that transport heat from a pedestal that is thermally coupled to an integrated circuit to convective fins. For example, the one or more arms may include one or more heat pipes. Moreover, the arms extend the vertical position of the winged heat sink away from a plane of the pedestal so that the convective fins extend downward back toward a circuit board on which the integrated circuit is mounted. These downward facing fins may match the topologies of components on the underlying circuit board.

Abstract: In a chip package, semiconductor dies in a vertical stack of semiconductor dies or chips (which is referred to as a ‘plank stack’) are separated by a mechanical spacer (such as a filler material or an adhesive). Moreover, the chip package includes a substrate at a right angle to the plank stack, which is electrically coupled to the semiconductor dies along an edge of the plank stack. In particular, electrical pads proximate to a surface of the substrate (which are along a stacking direction of the plank stack) are electrically coupled to pads that are proximate to edges of the semiconductor dies by an intervening conductive material, such as: solder, stud bumps, plated traces, wire bonds, spring connectors, a conductive adhesive and/or an anisotropic conducting film. Note that the chip package may facilitate high-bandwidth communication of signals between the semiconductor dies and the substrate.

Abstract: One embodiment of the present invention provides a system that facilitates adjusting the wavelengths of lasers via temperature control. This system includes a chip with an active face upon which active circuitry and signal pads reside. A thermal-control mechanism provides localized thermal control of two lasers mounted upon the active face of the chip. By individually controlling the temperature of the lasers, the thermal-control mechanism controls the wavelengths emitted by each respective laser. By creating a temperature gradient that causes a temperature difference between two or more lasers, the system can cause the lasers to emit different wavelengths.

Abstract: In a chip package, semiconductor dies in a vertical stack of semiconductor dies or chips (which is referred to as a ‘plank stack’) are separated by a mechanical spacer (such as a filler material or an adhesive). Moreover, the chip package includes a substrate at a right angle to the plank stack, which is electrically coupled to the semiconductor dies along an edge of the plank stack. In particular, electrical pads proximate to a surface of the substrate (which are along a stacking direction of the plank stack) are electrically coupled to pads that are proximate to edges of the semiconductor dies by an intervening conductive material, such as: solder, stud bumps, plated traces, wire bonds, spring connectors, a conductive adhesive and/or an anisotropic conducting film. Note that the chip package may facilitate high-bandwidth communication of signals between the semiconductor dies and the substrate.

Abstract: A base mechanism for use in a multi-chip module (MCM) is described. This base mechanism includes a substrate having top and bottom surfaces. The bottom surface includes first electrical connectors that convey power, and through-substrate vias (TSVs) between the top and bottom surfaces are electrically coupled to these electrical connectors. Furthermore, a bridge chip is rigidly mechanically coupled to the top surface. This bridge chip includes proximity communication connectors that communicate information via proximity communication with one or more island chips in the MCM. Additionally, spacers are rigidly mechanically coupled to the top surface of the substrate. In conjunction with the bridge chip, the spacers define cavities on the top surface, which include second electrical connectors. These second electrical connectors are electrically coupled to the TSVs, and communicate additional information with and convey power to the one or more island chips.

Abstract: One embodiment of the present invention provides a system that facilitates adjusting the wavelengths of lasers via temperature control. This system includes a chip with an active face upon which active circuitry and signal pads reside. A thermal-control mechanism provides localized thermal control of two lasers mounted upon the active face of the chip. By individually controlling the temperature of the lasers, the thermal-control mechanism controls the wavelengths emitted by each respective laser. By creating a temperature gradient that causes a temperature difference between two or more lasers, the system can cause the lasers to emit different wavelengths.

Abstract: One embodiment of the present invention provides a system that facilitates adjusting the wavelengths of lasers via temperature control. This system includes a chip with an active face upon which active circuitry and signal pads reside. A thermal-control mechanism provides localized thermal control of two lasers mounted upon the active face of the chip. By individually controlling the temperature of the lasers, the thermal-control mechanism controls the wavelengths emitted by each respective laser. By creating a temperature gradient that causes a temperature difference between two or more lasers, the system can cause the lasers to emit different wavelengths.

Abstract: A base mechanism for use in a multi-chip module (MCM) is described. This base mechanism includes a substrate having top and bottom surfaces. The bottom surface includes first electrical connectors that convey power, and through-substrate vias (TSVs) between the top and bottom surfaces are electrically coupled to these electrical connectors. Furthermore, a bridge chip is rigidly mechanically coupled to the top surface. This bridge chip includes proximity communication connectors that communicate information via proximity communication with one or more island chips in the MCM. Additionally, spacers are rigidly mechanically coupled to the top surface of the substrate. In conjunction with the bridge chip, the spacers define cavities on the top surface, which include second electrical connectors. These second electrical connectors are electrically coupled to the TSVs, and communicate additional information with and convey power to the one or more island chips.

Abstract: One embodiment of the present invention provides a system that facilitates high-bandwidth communication using a flexible bridge. This system includes a chip with an active face upon which active circuitry and signal pads reside, and a second component with a surface upon which active circuitry and/or signal pads reside. A flexible bridge provides high-bandwidth communication between the active face of the chip and the surface of the second component. This flexible bridge provides a flexible connection that allows the chip to be moved with six degrees of freedom relative to the second component without affecting communication between the chip and the second component. Hence, the flexible bridge allows the chip and the second component to communicate without requiring precise alignment between the chip and the second component.

Abstract: One embodiment of the present invention provides a system that facilitates high-bandwidth communication using a flexible bridge. This system includes a chip with an active face upon which active circuitry and signal pads reside, and a second component with a surface upon which active circuitry and/or signal pads reside. A flexible bridge provides high-bandwidth communication between the active face of the chip and the surface of the second component. This flexible bridge provides a flexible connection that allows the chip to be moved with six degrees of freedom relative to the second component without affecting communication between the chip and the second component. Hence, the flexible bridge allows the chip and the second component to communicate without requiring precise alignment between the chip and the second component.

Abstract: One embodiment of the present invention provides a system that facilitates high-bandwidth communication using a flexible bridge. This system includes a chip with an active face upon which active circuitry and signal pads reside, and a second component with a surface upon which active circuitry and/or signal pads reside. A flexible bridge provides high-bandwidth communication between the active face of the chip and the surface of the second component. This flexible bridge provides a flexible connection that allows the chip to be moved with six degrees of freedom relative to the second component without affecting communication between the chip and the second component. Hence, the flexible bridge allows the chip and the second component to communicate without requiring precise alignment between the chip and the second component.

Abstract: One embodiment of the present invention provides a system that facilitates high-bandwidth communication using a flexible bridge. This system includes a chip with an active face upon which active circuitry and signal pads reside, and a second component with a surface upon which active circuitry and/or signal pads reside. A flexible bridge provides high-bandwidth communication between the active face of the chip and the surface of the second component. By matching the wire line size in the flexible bridge to the size of circuits and/or signal pads on the chip and on the second component, the system allows signals to be sent between the circuits on the chip and the second component without having to change the scale of the interconnect, thereby alleviating wireability and bandwidth limitations of conventional chip packaging technologies.

Abstract: A single-chip module is described. The module includes a first semiconductor die having a first surface and a second surface. The first semiconductor die is configured to communicate by capacitive coupling using one or more of a plurality of proximity connectors coupled to the first semiconductor die. A cable coupled to the first semiconductor die is configured to couple power signals to the first semiconductor die. A flexibility compliance of at least one section of the cable is greater than a threshold value thereby allowing the module to be positioned in a mounting structure.

Abstract: One embodiment of the present invention provides an integrated circuit module. This module includes a semiconductor die with an active face, upon which active circuitry and signal pads reside, and a back face opposite the active face. The module uses a flexible cable to deliver electrical power to the active face of the semiconductor die from a power distribution board located above the active face of the semiconductor die. This flexible cable provides electrical power to the semiconductor die without interfering with the alignment and heat removal functions of the module.

Abstract: A single-chip module is described. The module includes a first semiconductor die having a first surface and a second surface. The first semiconductor die is configured to communicate by capacitive coupling using one or more of a plurality of proximity connectors coupled to the first semiconductor die. A cable coupled to the first semiconductor die is configured to couple power signals to the first semiconductor die. A flexibility compliance of at least one section of the cable is greater than a threshold value thereby allowing the module to be positioned in a mounting structure.

Abstract: A single-chip module is described. The module includes a first semiconductor die having a first surface and a second surface. The first semiconductor die is configured to communicate by capacitive coupling using one or more of a plurality of proximity connectors coupled to the first semiconductor die. A cable coupled to the first semiconductor die is configured to couple power signals to the first semiconductor die. A flexibility compliance of at least one section of the cable is greater than a threshold value thereby allowing the module to be positioned in a mounting structure.

Abstract: One embodiment of the present invention provides a system that facilitates adjusting the wavelengths of lasers via temperature control. This system includes a chip with an active face upon which active circuitry and signal pads reside. A thermal-control mechanism provides localized thermal control of two lasers mounted upon the active face of the chip. By individually controlling the temperature of the lasers, the thermal-control mechanism controls the wavelengths emitted by each respective laser. By creating a temperature gradient that causes a temperature difference between two or more lasers, the system can cause the lasers to emit different wavelengths.