Patents by Inventor Bruce P. Mahler

Bruce P. Mahler has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Circuit board material and method of making
    Patent number: 4888574
    Abstract: An improved multilayered circuit board material and process for making that material is disclosed. The material includes an insulating material support layer, an electrical resistance material layer adhering to the support layer, and a conductive material layer adhering to the resistance material layer and in intimate contact with that layer. The electrical resistance material layer comprises electroplated nickel-phosphorous containing up to about 30% by weight of phosphorous; however, no appreciable amounts of sulfur are present within at least the top about ten atomic layers of the electrical resistance material layer. As a result, the stability of the electrical resistance material layer is significantly increased. In addition, the electroplating bath does not contain chloride salts resulting in decreased pitting in the electrical resistance material layer.
    Type: Grant
    Filed: March 28, 1988
    Date of Patent: December 19, 1989
    Assignee: 501 Ohmega Electronics, Inc.
    Inventors: James M. Rice, Bruce P. Mahler
  • Circuit board material
    Patent number: 4808967
    Abstract: A multilayered circuit board material is disclosed. The material includes an insulating material support layer, an electrical resistance material layer adhering to the support layer, and a conductive material layer adhering to the resistance material layer and in intimate contact with that layer. The electrical resistance material layer is formed from electroplated nickel-phosphorous containing up to about 30% by weight of phosphorous; however, no appreciable amounts of sulfur are present within at least the top about ten atomic layers of the electrical resistance material layer. As a result, the stability of the electrical resistance material layer is significantly increased. In addition, the electroplating bath does not contain chloride salts resulting in decreased pitting in the electrical resistance material layer.
    Type: Grant
    Filed: May 29, 1985
    Date of Patent: February 28, 1989
    Assignee: Ohmega Electronics
    Inventors: James M. Rice, Bruce P. Mahler