Patents by Inventor Bruce W. Worster
Bruce W. Worster has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7384806Abstract: A method is described for characterizing defects on a test surface of a semiconductor wafer using a confocal-microscope-based automatic defect characterization (ADC) system. The surface to be tested and a reference surface are scanned using a confocal microscope to obtain three-dimensional images of the test and reference surfaces. The test and reference images are converted into sets of geometric constructs, or “primitives,” that are used to approximate features of the images. Next, the sets of test and reference primitives are compared to determine whether the set of test primitives is different from the set of reference primitives. If such a difference exists, then the difference data is used to generate defect parameters, which are then compared to a knowledge base of defect reference data. Based on this comparison, the ADC system characterizes the defect and estimates a degree of confidence in the characterization.Type: GrantFiled: December 21, 2006Date of Patent: June 10, 2008Assignee: KLA-Tencor CorporationInventors: Bruce W. Worster, Ken K. Lee
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Patent number: 7154605Abstract: A method is described for characterizing defects on a test surface of a semiconductor wafer using a confocal-microscope-based automatic defect characterization (ADC) system. The surface to be tested and a reference surface are scanned using a confocal microscope to obtain three-dimensional images of the test and reference surfaces. The test and reference images are converted into sets of geometric constructs, or “primitives,” that are used to approximate features of the images. Next, the sets of test and reference primitives are compared to determine whether the set of test primitives is different from the set of reference primitives. If such a difference exists, then the difference data is used to generate defect parameters, which are then compared to a knowledge base of defect reference data. Based on this comparison, the ADC system characterizes the defect and estimates a degree of confidence in the characterization.Type: GrantFiled: May 8, 2003Date of Patent: December 26, 2006Assignee: KLA-Tencor CorporationInventors: Bruce W. Worster, Ken K. Lee
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Patent number: 6661515Abstract: A method is described for characterizing defects on a test surface of a semiconductor wafer using a confocal-microscope-based automatic defect characterization (ADC) system. The surface to be tested and a reference surface are scanned using a confocal microscope to obtain three-dimensional images of the test and reference surfaces. The test and reference images are converted into sets of geometric constructs, or “primitives,” that are used to approximate features of the images. Next, the sets of test and reference primitives are compared to determine whether the set of test primitives is different from the set of reference primitives. If such a difference exists, then the difference data is used to generate defect parameters, which are then compared to a knowledge base of defect reference data. Based on this comparison, the ADC system characterizes the defect and estimates a degree of confidence in the characterization.Type: GrantFiled: September 11, 2001Date of Patent: December 9, 2003Assignee: KLA-Tencor CorporationInventors: Bruce W. Worster, Ken K. Lee
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Publication number: 20030203520Abstract: A method is described for characterizing defects on a test surface of a semiconductor wafer using a confocal-microscope-based automatic defect characterization (ADC) system. The surface to be tested and a reference surface are scanned using a confocal microscope to obtain three-dimensional images of the test and reference surfaces. The test and reference images are converted into sets of geometric constructs, or “primitives,” that are used to approximate features of the images. Next, the sets of test and reference primitives are compared to determine whether the set of test primitives is different from the set of reference primitives. If such a difference exists, then the difference data is used to generate defect parameters, which are then compared to a knowledge base of defect reference data. Based on this comparison, the ADC system characterizes the defect and estimates a degree of confidence in the characterization.Type: ApplicationFiled: May 8, 2003Publication date: October 30, 2003Inventors: Bruce W. Worster, Ken K. Lee
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Publication number: 20020012118Abstract: A method is described for characterizing defects on a test surface of a semiconductor wafer using a confocal-microscope-based automatic defect characterization (ADC) system. The surface to be tested and a reference surface are scanned using a confocal microscope to obtain three-dimensional images of the test and reference surfaces. The test and reference images are converted into sets of geometric constructs, or “primitives,” that are used to approximate features of the images. Next, the sets of test and reference primitives are compared to determine whether the set of test primitives is different from the set of reference primitives. If such a difference exists, then the difference data is used to generate defect parameters, which are then compared to a knowledge base of defect reference data. Based on this comparison, the ADC system characterizes the defect and estimates a degree of confidence in the characterization.Type: ApplicationFiled: September 11, 2001Publication date: January 31, 2002Inventors: Bruce W. Worster, Ken K. Lee
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Patent number: 6288782Abstract: A method is described for characterizing defects on a test surface of a semiconductor wafer using a confocal-microscope-based automatic defect characterization (ADC) system. The surface to be tested and a reference surface are scanned using a confocal microscope to obtain three-dimensional images of the test and reference surfaces. The test and reference images are converted into sets of geometric constructs, or “primitives,” that are used to approximate features of the images. Next, the sets of test and reference primitives are compared to determine whether the set of test primitives is different from the set of reference primitives. If such a difference a exists, then the difference data is used to generate defect parameters, which are then compared to a knowledge base of defect reference data. Based on this comparison, the ADC system characterizes the defect and estimates a degree of confidence in the characterization.Type: GrantFiled: May 5, 1999Date of Patent: September 11, 2001Assignee: Ultrapointe CorporationInventors: Bruce W. Worster, Ken K. Lee
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Patent number: 6167148Abstract: An improved wafer surface inspection system is disclosed. In one embodiment, the object surface inspection system includes a translation stage that generates relative motion between an object viewing device such as an objective lens and the surface of the object being inspected. A translation stage controller controls the relative movement of the object surface and the object viewing device. The translation stage controller determines current coordinates for the object surface and the object viewing device, compares the current coordinates to target coordinates generated by a processor, and generates a trigger signal in response to a match between the current coordinates to the target coordinates. A camera receives an image through the object viewing device and captures the image in response to the trigger signal while the translation stage generates relative motion between the object surface and the object viewing device.Type: GrantFiled: June 30, 1998Date of Patent: December 26, 2000Assignee: Ultrapointe CorporationInventors: Louis D. Calitz, Kexing Cecilia Du, M. Kent Norton, Bruce W. Worster
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Patent number: 5963314Abstract: A laser imaging system is used to analyze defects on semiconductor wafers that have been detected by patterned wafer defect detecting systems (wafer scanners). The laser imaging system replaces optical microscope review stations now utilized in the semiconductor fab environment to examine detected optical anomalies that may represent wafer defects. In addition to analyzing defects, the laser imaging system can perform a variety of microscopic inspection functions including defect detection and metrology. The laser imaging system uses confocal laser scanning microscopy techniques, and operates under class 1 cleanroom conditions and without exposure of the wafers to operator contamination or airflow.Type: GrantFiled: October 15, 1996Date of Patent: October 5, 1999Assignee: Ultrapointe CorporationInventors: Bruce W. Worster, Dale E. Crane, Hans J. Hansen, Christopher R. Fairley, Ken K. Lee
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Patent number: 5923430Abstract: A method is described for characterizing defects on a test surface of a semiconductor wafer using a confocal-microscope-based automatic defect characterization (ADC) system. The surface to be tested and a reference surface are scanned using a confocal microscope to obtain three-dimensional images of the test and reference surfaces. The test and reference images are converted into sets of geometric constructs, or "primitives," that are used to approximate features of the images. Next, the sets of test and reference primitives are compared to determine whether the set of test primitives is different from the set of reference primitives. If such a difference exists, then the difference data is used to generate defect parameters, which are then compared to a knowledge base of defect reference data. Based on this comparison, the ADC system characterizes the defect and estimates a degree of confidence in the characterization.Type: GrantFiled: February 3, 1997Date of Patent: July 13, 1999Assignee: Ultrapointe CorporationInventors: Bruce W. Worster, Ken K. Lee
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Patent number: 5808735Abstract: 10A method is described for detecting and characterizing defects on a test surface of a semiconductor wafer. A three-dimensional image of the test surface is aligned and compared with a three-dimensional image of a defect-free reference surface. Intensity differences between corresponding pixels in the two images that exceed a predefined threshold value are deemed defect pixels. According to the method, the pixels of the reference image are grouped according to their respective z values (elevation) to identify different physical layers of the reference surface. Because different surface layers can have different image properties, such as reflectance and image texture, the groups of pixels are analyzed separately to determine an optimal threshold value for each of the groups, and therefore for each layer of the reference surface.Type: GrantFiled: November 26, 1996Date of Patent: September 15, 1998Assignee: Ultrapointe CorporationInventors: Ken K. Lee, Ke Han, Lakshman Srinivasan, Bruce W. Worster
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Patent number: 5479252Abstract: A laser imaging system is used to analyze defects on semiconductor wafers that have been detected by patterned wafer defect detecting systems (wafer scanners). The laser imaging system replaces optical microscope review stations now utilized in the semiconductor fab environment to examine detected optical anomalies that may represent wafer defects. In addition to analyzing defects, the laser imaging system can perform a variety of microscopic inspection functions including defect detection and metrology. The laser imaging system uses confocal laser scanning microscopy techniques, and operates under class 1 cleanroom conditions and without exposure of the wafers to operator contamination or airflow.Type: GrantFiled: June 17, 1993Date of Patent: December 26, 1995Assignee: Ultrapointe CorporationInventors: Bruce W. Worster, Dale E. Crane, Hans J. Hansen, Christopher R. Fairley, Ken K. Lee