Abstract: The electronic computer according to the invention comprises: a storage case comprising a housing including an air inlet and an air outlet for the circulation of a flow of cooling air through the housing, an electronic motherboard comprising a first surface and a second surface, the second surface being provided with connectors for receiving electronic daughterboards, and an air channeling system configured so as to channel the air hitting the first surface of the electronic motherboard to bring it to the side of the second surface of the electronic motherboard. According to one aspect of the invention, the air channeling system is configured to spray the electronic daughterboards, so as to cool said electronic daughterboards through convection of the air.

Abstract: This housing comprises rackable electronic equipment modules (2) housed in a bay. A module (2) has both internal (12, 13) and external (45) thermal radiators cooled by natural and forced ventilation. The internal thermal radiators (12, 13) are placed in thermal contact with the hot spots of the electronic equipment placed in the module (2) via hear collectors (40, 41) connected by heat pipe (42, 43) to the external thermal radiators (45) arranged outside on the edge (44) of the module (2). The internal thermal radiators (12, 13) are sized to be sufficient to cool the electric equipment when the forced ventilation is functioning normally. The external thermal radiators (45) are sized to complement the cooling provided by the internal radiators (12, 13) should the forced ventilation be lost.

Abstract: The operational reliability of a heat pipe 200 provided for carrying heat dissipated by an electronic component 101 to a heat exchanger 300 is tested by using the heat pipe in the reverse direction, by providing energy in the form of heat at the exchanger 300, and by measuring the propagation time ?P of the heat from the exchanger to the electronic component. Application to heat pipe tests in onboard computers.

Abstract: The present invention proposes an onboard computer equipped with a stand-alone aeraulic cooling device. Its main benefit is that it improves the effectiveness of the aeraulic cooling of onboard computers, thanks to the provision of ducts (N1, N2, N3) routing a cool air stream (FA) to the hot spots of the electronic modules (E1, E2, E3, E4).

Abstract: The invention proposes a new aeraulic cooling design for ARINC series 600 computers. Using a network of ducts (N) and holes (HM) on an intermediate plate (M) situated just above the bottom place (B) through which a stream of cool air (AF) is injected into said computer (C), the present invention makes it possible to effectively cool the dissipative areas and the identified hot spots on the electronic modules (E) that it contains.

Abstract: This rack (1) houses rackable electronic gear modules (2, 3) and has cooling by natural convection thanks to ventilation orifices (20, 21) provided in its bottom (10) and top (11) walls and forced air cooling thanks to internal air distribution ramps (30) fed with air under pressure through the intermediary of a distribution box (31) connected to a forced air circulation duct (37). The use of internal distribution ramps for the forced air makes it possible to produce a pulsed air circulation providing only a slight obstacle to the air circulation obtained by natural convection. Compared to usual configurations, this makes it possible to lower the operating temperature reached by the equipment in the event of loss of the forced ventilation.

Abstract: The present invention proposes an onboard computer equipped with a stand-alone aeraulic cooling device. Its main benefit is that it improves the effectiveness of the aeraulic cooling of onboard computers, thanks to the provision of ducts (N1, N2, N3) routing a cool air stream (FA) to the hot spots of the electronic modules (E1, E2, E3, E4).

Abstract: The invention proposes a new aeraulic cooling design for ARINC series 600 computers. Using a network of ducts (N) and holes (HM) on an intermediate plate (M) situated just above the bottom place (B) through which a stream of cool air (AF) is injected into said computer (C), the present invention makes it possible to effectively cool the dissipative areas and the identified hot spots on the electronic modules (E) that it contains.

Abstract: This rack (1) houses rackable electronic gear modules (2, 3) and has cooling by natural convection thanks to ventilation orifices (20, 21) provided in its bottom (10) and top (11) walls and forced air cooling thanks to internal air distribution ramps (30) fed with air under pressure through the intermediary of a distribution box (31) connected to a forced air circulation duct (37). The use of internal distribution ramps for the forced air makes it possible to produce a pulsed air circulation providing only a slight obstacle to the air circulation obtained by natural convection. Compared to usual configurations, this makes it possible to lower the operating temperature reached by the equipment in the event of loss of the forced ventilation.

Abstract: This housing comprises rackable electronic equipment modules (2) housed in a bay. A module (2) has both internal (12, 13) and external (45) thermal radiators cooled by natural and forced ventilation. The internal thermal radiators (12, 13) are placed in thermal contact with the hot spots of the electronic equipment placed in the module (2) via hear collectors (40, 41) connected by heat pipe (42, 43) to the external thermal radiators (45) arranged outside on the edge (44) of the module (2). The internal thermal radiators (12, 13) are sized to be sufficient to cool the electric equipment when the forced ventilation is functioning normally. The external thermal radiators (45) are sized to complement the cooling provided by the internal radiators (12, 13) should the forced ventilation be lost.

Abstract: The operational reliability of a heat pipe 200 provided for carrying heat dissipated by an electronic component 101 to a heat exchanger 300 is tested by using the heat pipe in the reverse direction, by providing energy in the form of heat at the exchanger 300, and by measuring the propagation time ?P of the heat from the exchanger to the electronic component. Application to heat pipe tests in onboard computers.