Patents by Inventor Bryan Buckalew
Bryan Buckalew has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230366119Abstract: A chamber in a substrate processing system comprises a substrate holder configured to support a substrate, a nozzle arranged above the substrate, the nozzle configured to inject a pre-wetting liquid onto a surface of the substrate during a pre-wetting period, and at least one gas injector arranged radially outward of the nozzle. The at least one gas injector is configured to inject gas toward an edge of the substrate for a drying period subsequent to the pre-wetting period to remove the pre-wetting liquid from the edge of the substrate.Type: ApplicationFiled: September 29, 2021Publication date: November 16, 2023Inventors: Kari THORKELSSON, Stephen J. BANIK, Bryan BUCKALEW
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Publication number: 20230175161Abstract: A contact for providing a connection to a substrate in a substrate plating system includes a body having an arcuate shape. The arcuate shape of the body is configured to conform to a shape of at least a portion of a substrate arranged on a lip seal and a cup of the substrate plating system. A plurality of first contact fingers extend a first distance from the body. A plurality of second contact fingers extend a second distance from the body. The first distance is greater than the second distance.Type: ApplicationFiled: April 12, 2021Publication date: June 8, 2023Inventors: Stephen J. BANIK, John Floyd OSTROWSKI, Bryan BUCKALEW, Robert RASH, Meng Wee Edwin GOH, Santosh KUMAR, Frederick Dean WILMOT
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Patent number: 11655556Abstract: An apparatus for electroplating a semiconductor wafer includes an insert member configured to circumscribe a processing region. The insert member has a top surface. A portion of the top surface of the insert member has an upward slope that slopes upward from a peripheral area of the top surface of the insert member toward the processing region. The apparatus also includes a seal member having an annular-disk shape. The seal member is positioned on the top surface of the insert member. The seal member is flexible such that an outer radial portion of the seal member conforms to the upward slope of the top surface of the insert member and such that an inner radial portion of the seal member projects inward toward the processing region.Type: GrantFiled: April 6, 2020Date of Patent: May 23, 2023Assignee: Lam Research CorporationInventors: Aaron Berke, Stephen J. Banik, Bryan Buckalew, Robert Rash
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Patent number: 10930511Abstract: In one example, an electroplating system comprises a first bath reservoir, a second bath reservoir, a clamp, a first anode in the first bath reservoir, a second anode in the second bath reservoir, and a direct current power supply. The first bath reservoir contains a first electrolyte solution that includes an alkaline copper-complexed solution. The second bath reservoir contains a second electrolyte solution that includes an acidic copper plating solution. The direct current power supply generates a first direct current between the clamp and the first anode to electroplate a first copper layer on the cobalt layer of the wafer submerged in the first electrolyte solution. The direct current power supply then generates a second direct current between the clamp and the second anode to electroplate a second copper layer on the first copper layer of the wafer submerged in the second electrolyte solution.Type: GrantFiled: March 30, 2018Date of Patent: February 23, 2021Assignee: Lam Research CorporationInventors: Jeyavel Velmurugan, Bryan Buckalew, Thomas Ponnuswamy
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Publication number: 20200232114Abstract: An apparatus for electroplating a semiconductor wafer includes an insert member configured to circumscribe a processing region. The insert member has a top surface. A portion of the top surface of the insert member has an upward slope that slopes upward from a peripheral area of the top surface of the insert member toward the processing region. The apparatus also includes a seal member having an annular-disk shape. The seal member is positioned on the top surface of the insert member. The seal member is flexible such that an outer radial portion of the seal member conforms to the upward slope of the top surface of the insert member and such that an inner radial portion of the seal member projects inward toward the processing region.Type: ApplicationFiled: April 6, 2020Publication date: July 23, 2020Inventors: Aaron Berke, Stephen J. Banik, Bryan Buckalew, Robert Rash
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Patent number: 10612151Abstract: An apparatus for electroplating a semiconductor wafer includes an insert member configured to circumscribe a processing region. The insert member has a top surface. A portion of the top surface of the insert member has an upward slope that slopes upward from a peripheral area of the top surface of the insert member toward the processing region. The apparatus also includes a seal member having an annular-disk shape. The seal member is positioned on the top surface of the insert member. The seal member is flexible such that an outer radial portion of the seal member conforms to the upward slope of the top surface of the insert member and such that an inner radial portion of the seal member projects inward toward the processing region.Type: GrantFiled: July 24, 2018Date of Patent: April 7, 2020Assignee: Lam Research CorporationInventors: Aaron Berke, Stephen J. Banik, Bryan Buckalew, Robert Rash
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Publication number: 20200035484Abstract: A wetting tool that provides improved wettability and debris removal from features defined by a patterned resist layer on a substrate. The substrate wetting tool relies on a wetting solution having a pH of 2.0 or less and/or a temperature ranging from 20 to 50° C. With a pH of 2.0 or less, the resist material used to form features chemically reacts, making it more hydrophilic. The wetting solution is therefore attracted into the features, beneficially reducing the chance of bubble formation and removing debris. At elevated temperatures, the heated wetting solution improves particle de-lamination and aids in dissolving debris and oxides from the substrate surface.Type: ApplicationFiled: July 30, 2018Publication date: January 30, 2020Inventors: Justin OBERST, Bryan BUCKALEW, Stephen J. BANIK, Meng Wee Edwin GOH, Joseph RICHARDSON, Lawrence OSSOWSKI, Marc QUAGLIO, Douglas HIGLEY
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Publication number: 20190304789Abstract: In one example, an electroplating system comprises a first bath reservoir, a second bath reservoir, a clamp, a first anode in the first bath reservoir, a second anode in the second bath reservoir, and a direct current power supply. The first bath reservoir contains a first electrolyte solution that includes an alkaline copper-complexed solution. The second bath reservoir contains a second electrolyte solution that includes an acidic copper plating solution. The direct current power supply generates a first direct current between the clamp and the first anode to electroplate a first copper layer on the cobalt layer of the wafer submerged in the first electrolyte solution. The direct current power supply then generates a second direct current between the clamp and the second anode to electroplate a second copper layer on the first copper layer of the wafer submerged in the second electrolyte solution.Type: ApplicationFiled: March 30, 2018Publication date: October 3, 2019Inventors: Jeyavel Velmurugan, Bryan Buckalew, Thomas Ponnuswamy
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Publication number: 20190301040Abstract: In one example, an electroplating system comprises a bath reservoir, a holding device, an anode, a direct current power supply, and a controller. The bath reservoir contains an electrolyte solution. The holding device holds a wafer submerged in the electrolyte solution. The wafer comprises features covered by a cobalt layer. The anode is opposite to the wafer and submerged in the electrolyte solution. The direct current power supply generates a direct current between the holding device and the anode. A combination of forward and reverse pulses is applied between the holding device and the anode to electroplate a copper layer on the cobalt layer of the wafer.Type: ApplicationFiled: March 30, 2018Publication date: October 3, 2019Inventors: Jeyavel Velmurugan, Bryan Buckalew, Thomas Ponnuswamy
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Publication number: 20190264347Abstract: An apparatus for electroplating a semiconductor wafer includes an insert member configured to circumscribe a processing region. The insert member has a top surface. A portion of the top surface of the insert member has an upward slope that slopes upward from a peripheral area of the top surface of the insert member toward the processing region. The apparatus also includes a seal member having an annular-disk shape. The seal member is positioned on the top surface of the insert member. The seal member is flexible such that an outer radial portion of the seal member conforms to the upward slope of the top surface of the insert member and such that an inner radial portion of the seal member projects inward toward the processing region.Type: ApplicationFiled: July 24, 2018Publication date: August 29, 2019Inventors: Aaron Berke, Stephen J. Banik, Bryan Buckalew, Robert Rash
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Publication number: 20180251907Abstract: A lipseal is designed for use in a lipseal assembly of an electroplating apparatus wherein a clamshell engages and supplies electrical current to a semiconductor substrate during electroplating. The lipseal includes an elastomeric body having an outer portion configured to engage a cup of the lipseal assembly and an inner portion configured to engage a peripheral region of the semiconductor substrate. The inner portion includes a protrusion having a width in a radial direction sufficient to provide a contact area with the semiconductor substrate which inhibits diffusion of acid in an electroplating solution used during the electroplating. The protrusion is located at an inner periphery of the lipseal.Type: ApplicationFiled: March 1, 2017Publication date: September 6, 2018Applicant: LAM RESEARCH CORPORATIONInventors: Kari Thorkelsson, Aaron Berke, Santosh Kumar, Robert Rash, Lee Peng Chua, Bryan Buckalew
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Patent number: 9045841Abstract: In a copper electroplating apparatus having separate anolyte and catholyte portions, the concentration of anolyte components (e.g., acid or copper salt) is controlled by providing a diluent to the recirculating anolyte. The dosing of the diluent can be controlled by the user and can follow a pre-determined schedule. For example, the schedule may specify the diluent dosing parameters, so as to prevent precipitation of copper salt in the anolyte. Thus, precipitation-induced anode passivation can be minimized.Type: GrantFiled: January 26, 2012Date of Patent: June 2, 2015Assignee: Novellus Systems, Inc.Inventors: Bryan Buckalew, Jonathan Reid, John Sukamto, Zhian He, Seshasayee Varadarajan, Steven T. Mayer
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Patent number: 8398831Abstract: Embodiments of a closed-contact electroplating cup assembly that may be rapidly cleaned while an electroplating system is on-line are disclosed. One disclosed embodiment comprises a cup assembly and a cone assembly, wherein the cup assembly comprises a cup bottom comprising an opening, a seal surrounding the opening, an electrical contact structure comprising a plurality of electrical contacts disposed around the opening, and an interior cup side that is tapered inwardly in along an axial direction of the cup from a cup top toward the cup bottom.Type: GrantFiled: April 4, 2011Date of Patent: March 19, 2013Assignee: Novellus Systems, Inc.Inventors: Shantinath Ghongadi, Robert Rash, Jeff Hawkins, Seshasayee Varadarajan, Tariq Majid, Kousik Ganesan, Bryan Buckalew, Brian Evans
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Patent number: 8377268Abstract: Embodiments of a closed-contact electroplating cup are disclosed. One embodiment comprises a cup bottom comprising an opening, and a seal disposed on the cup bottom around the opening. The seal comprises a wafer-contacting peak located substantially at an inner edge of the seal. The embodiment also comprises an electrical contact structure disposed over a portion of the seal, wherein the electrical contact structure comprises an outer ring and a plurality of contacts extending inwardly from the outer ring, and wherein each contact has a generally flat wafer-contacting surface. The embodiment further comprises a wafer-centering mechanism configured to center a wafer in the cup.Type: GrantFiled: June 6, 2011Date of Patent: February 19, 2013Assignee: Novellus Systems, Inc.Inventors: Robert Rash, Shantinath Ghongadi, Kousik Ganesan, Zhian He, Tariq Majid, Jeff Hawkins, Seshasayee Varadarajan, Bryan Buckalew
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Patent number: 8308931Abstract: An apparatus for electroplating a layer of metal on the surface of a wafer includes an ionically resistive ionically permeable element located in close proximity of the wafer (preferably within 5 mm of the wafer surface) which serves to modulate ionic current at the wafer surface, and a second cathode configured to divert a portion of current from the wafer surface. The ionically resistive ionically permeable element in a preferred embodiment is a disk made of a resistive material having a plurality of perforations formed therein, such that perforations do not form communicating channels within the body of the disk. The provided configuration effectively redistributes ionic current in the plating system allowing plating of uniform metal layers and mitigating the terminal effect.Type: GrantFiled: November 7, 2008Date of Patent: November 13, 2012Assignee: Novellus Systems, Inc.Inventors: Jonathan Reid, Bryan Buckalew, Zhian He, Seyang Park, Seshasayee Varadarajan, Bryan Pennington, Thomas Ponnuswamy, Patrick Breling, Glenn Ibarreta, Steven Mayer
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Patent number: 8128791Abstract: In a copper electroplating apparatus having separate anolyte and catholyte portions, the concentration of anolyte components (e.g., acid or copper salt) is controlled by providing a diluent to the recirculating anolyte. The dosing of the diluent can be controlled by the user and can follow a pre-determined schedule. For example, the schedule may specify the diluent dosing parameters, so as to prevent precipitation of copper salt in the anolyte. Thus, precipitation-induced anode passivation can be minimized.Type: GrantFiled: October 30, 2006Date of Patent: March 6, 2012Assignee: Novellus Systems, Inc.Inventors: Bryan Buckalew, Jonathan Reid, John Sukamto, Zhian He, Seshasayee Varadarajan, Steven T. Mayer
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Publication number: 20110233056Abstract: Embodiments of a closed-contact electroplating cup are disclosed. One embodiment comprises a cup bottom comprising an opening, and a seal disposed on the cup bottom around the opening. The seal comprises a wafer-contacting peak located substantially at an inner edge of the seal. The embodiment also comprises an electrical contact structure disposed over a portion of the seal, wherein the electrical contact structure comprises an outer ring and a plurality of contacts extending inwardly from the outer ring, and wherein each contact has a generally flat wafer-contacting surface. The embodiment further comprises a wafer-centering mechanism configured to center a wafer in the cup.Type: ApplicationFiled: June 6, 2011Publication date: September 29, 2011Applicant: NOVELLUS SYSTEMS, INC.Inventors: Robert Rash, Shantinath Ghongadi, Kousik Ganesan, Zhian He, Tariq Majid, Jeff Hawkins, Seshasayee Varadarajan, Bryan Buckalew
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Publication number: 20110181000Abstract: Embodiments of a closed-contact electroplating cup assembly that may be rapidly cleaned while an electroplating system is on-line are disclosed. One disclosed embodiment comprises a cup assembly and a cone assembly, wherein the cup assembly comprises a cup bottom comprising an opening, a seal surrounding the opening, an electrical contact structure comprising a plurality of electrical contacts disposed around the opening, and an interior cup side that is tapered inwardly in along an axial direction of the cup from a cup top toward the cup bottom.Type: ApplicationFiled: April 4, 2011Publication date: July 28, 2011Applicant: NOVELLUS SYSTEMS, INC.Inventors: Shantinath Ghongadi, Robert Rash, Jeff Hawkins, Seshasayee Varadarajan, Tariq Majid, Kousik Ganesan, Bryan Buckalew, Brian Evans
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Patent number: 7985325Abstract: Embodiments of a closed-contact electroplating cup are disclosed. One embodiment comprises a cup bottom comprising an opening, and a seal disposed on the cup bottom around the opening. The seal comprises a wafer-contacting peak located substantially at an inner edge of the seal. The embodiment also comprises an electrical contact structure disposed over a portion of the seal, wherein the electrical contact structure comprises an outer ring and a plurality of contacts extending inwardly from the outer ring, and wherein each contact has a generally flat wafer-contacting surface. The embodiment further comprises a wafer-centering mechanism configured to center a wafer in the cup.Type: GrantFiled: October 30, 2007Date of Patent: July 26, 2011Assignee: Novellus Systems, Inc.Inventors: Robert Rash, Shantinath Ghongadi, Kousik Ganesan, Zhian He, Tariq Majid, Jeff Hawkins, Seshasayee Varadarajan, Bryan Buckalew
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Patent number: 7935231Abstract: Embodiments of a closed-contact electroplating cup assembly that may be rapidly cleaned while an electroplating system is on-line are disclosed. One disclosed embodiment comprises a cup assembly and a cone assembly, wherein the cup assembly comprises a cup bottom comprising an opening, a seal surrounding the opening, an electrical contact structure comprising a plurality of electrical contacts disposed around the opening, and an interior cup side that is tapered inwardly in along an axial direction of the cup from a cup top toward the cup bottom.Type: GrantFiled: October 31, 2007Date of Patent: May 3, 2011Assignee: Novellus Systems, Inc.Inventors: Shantinath Ghongadi, Robert Rash, Jeff Hawkins, Seshasayee Varadarajan, Tariq Majid, Kousik Ganesan, Bryan Buckalew, Brian Evans