Patents by Inventor Bryan Keith Caskey

Bryan Keith Caskey has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11691320
    Abstract: An apparatus for molding a foam pad with a wire assembly for an automotive vehicle includes a mold bowl operably coupled to a mold lid to define a mold cavity therebetween. The mold bowl includes a bottom surface and a peripheral wall extending upwardly from and encircling the bottom surface. A plurality of wire holders extend inwardly from and are spaced around the peripheral wall for vertically positioning the wire assembly within the mold cavity. A holding element, such as an arcuate recess, is disposed along an upper ledge of at least one of the wire holders for horizontally positioning the wire assembly within the mold cavity. The mold cavity receives a foam material for filling the mold cavity and surrounding the wire assembly to form the foam pad with the wire assembly embedded therein.
    Type: Grant
    Filed: April 8, 2020
    Date of Patent: July 4, 2023
    Assignee: Magna Seating Inc
    Inventors: Christopher John Meurer, Ricky Brown, Bryan Keith Caskey, Russel Eugene Strang
  • Publication number: 20200324443
    Abstract: An apparatus for molding a foam pad with a wire assembly for an automotive vehicle includes a mold bowl operably coupled to a mold lid to define a mold cavity therebetween. The mold bowl includes a bottom surface and a peripheral wall extending upwardly from and encircling the bottom surface. A plurality of wire holders extend inwardly from and are spaced around the peripheral wall for vertically positioning the wire assembly within the mold cavity. A holding element, such as an arcuate recess, is disposed along an upper ledge of at least one of the wire holders for horizontally positioning the wire assembly within the mold cavity. The mold cavity receives a foam material for filling the mold cavity and surrounding the wire assembly to form the foam pad with the wire assembly embedded therein.
    Type: Application
    Filed: April 8, 2020
    Publication date: October 15, 2020
    Inventors: Christopher John Meurer, Ricky Brown, Bryan Keith Caskey, Russel Eugene Strang