Patents by Inventor Bryan M. White

Bryan M. White has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Nanotube modified solder thermal intermediate structure, systems, and methods
    Patent number: 8129223
    Abstract: An apparatus and system, as well as fabrication methods therefor, may include a thermal intermediate structure with metal decorated carbon nanotubes incorporated in solder.
    Type: Grant
    Filed: February 19, 2007
    Date of Patent: March 6, 2012
    Assignee: Intel Corporation
    Inventors: Paul A. Koning, Bryan M. White
  • Thermal intermediate apparatus, systems, and methods
    Patent number: 7985627
    Abstract: Apparatus and system, as well as fabrication methods therefor, may include a thermal intermediate structure comprised of a plurality of carbon nanotubes some of which have organic moieties attached thereto to tether the nanotubes to at least one of a die and a heat sink. The organic moieties include thiol linkers and amide linkers.
    Type: Grant
    Filed: November 24, 2008
    Date of Patent: July 26, 2011
    Assignee: Intel Corporation
    Inventors: Bryan M. White, Paul A. Koning, Yuegang Zhang, C. M. Garner
  • NANOTUBE MODIFIED SOLDER THERMAL INTERMEDIATE STRUCTURE, SYSTEMS, AND METHODS
    Publication number: 20110168763
    Abstract: An apparatus and system, as well as fabrication methods therefor, may include a thermal intermediate structure with metal decorated carbon nanotubes incorporated in solder.
    Type: Application
    Filed: February 19, 2007
    Publication date: July 14, 2011
    Inventors: Paul A. Koning, Bryan M. White
  • THERMAL INTERMEDIATE APPARATUS, SYSTEMS, AND METHODS
    Publication number: 20090075430
    Abstract: Apparatus and system, as well as fabrication methods therefor, may include a thermal intermediate structure comprised of a plurality of carbon nanotubes some of which have organic moieties attached thereto to tether the nanotubes to at least one of a die and a heat sink. The organic moieties include thiol linkers and amide linkers.
    Type: Application
    Filed: November 24, 2008
    Publication date: March 19, 2009
    Inventors: Bryan M. White, Paul A. Koning, Yuegang Zhang, C. Michael Garner
  • Thermal intermediate apparatus, systems, and methods
    Patent number: 7456052
    Abstract: Apparatus and system, as well as fabrication methods therefor, may include a thermal intermediate structure comprised of a plurality of carbon nanotubes some of which have organic moieties attached thereto to tether the nanotubes to at least one of a die and a heat sink. The organic moieties include thiol linkers and amide linkers.
    Type: Grant
    Filed: December 30, 2003
    Date of Patent: November 25, 2008
    Assignee: Intel Corporation
    Inventors: Bryan M. White, Paul A. Koning, Yuegang Zhang, C. Michael Garner
  • Nanotube modified solder thermal intermediate structure, systems, and methods
    Patent number: 7180174
    Abstract: An apparatus and system, as well as fabrication methods therefor, may include a thermal intermediate structure with metal decorated carbon nanotubes incorporated in solder.
    Type: Grant
    Filed: December 30, 2003
    Date of Patent: February 20, 2007
    Assignee: Intel Corporation
    Inventors: Paul A. Koning, Bryan M. White
  • Thermal interface apparatus, systems, and methods
    Patent number: 7168484
    Abstract: An apparatus and system, may include a thermal interface material comprised of an array of carbon nanotubes and a buffer layer disposed between the thermal interface material and one of a die or a heat spreader. In some embodiments the carbon nanotubes may be formed above a buffer layer formed above a surface of the heat spreader.
    Type: Grant
    Filed: June 30, 2003
    Date of Patent: January 30, 2007
    Assignee: Intel Corporation
    Inventors: Yuegang Zhang, C. Michael Garner, Andrew A. Berlin, Valluri Rao, Bryan M. White, Paul A. Koning
  • Thermal interface apparatus, systems, and methods
    Publication number: 20040261987
    Abstract: An apparatus and system, as well as fabrication methods therefor, may include a thermal interface material comprised of an array of carbon nanotubes and a buffer layer disposed between the thermal interface material and one of a die or a heat spreader.
    Type: Application
    Filed: June 30, 2003
    Publication date: December 30, 2004
    Inventors: Yuegang Zhang, C. Michael Garner, Andrew A. Berlin, Valluri Rao, Bryan M. White, Paul A. Koning