Abstract: A method and system can measure the weight of a bulk material within a container by applying excitation in the form of vibrational energy and interpreting the container's response to the vibration.

Abstract: Provided is a double-sided cooling structure for a semiconductor device using a low processing temperature and reduced processing time utilizing solid phase diffusion bonding. The fabrication method for this system is provided. The semiconductor device 1 comprising: a mounting substrate 70; a semiconductor chip 10 disposed on the mounting substrate 70 and a semiconductor substrate 26, a source pad electrode SP and a gate pad electrode GP disposed on a surface of the semiconductor substrate 26, and a drain pad electrode 36 disposed on a back side surface of the semiconductor substrate 26 to be contacted with the mounting substrate 70; and a source connector SC disposed on the source pad electrode SP. The mounting substrate 70 and the drain pad electrode 36 are bonded by using solid phase diffusion bonding.

Abstract: This invention relates to a data communication system/method for use in a downhole application wherein electrical energy is supplied over a multiple-conductor power cable to a motor assembly of a downhole tool such as an electric submersible pump. A power leg coupling interfaces a surface controller of a downhole instrument to the conductors of the tool's power cable. Uplink communication of telemetry data occurs via current modulation generated by the downhole instrument and interpreted by a surface controller. Downlink communication of downhole instrument data occurs over a different communication scheme supported by the downhole and surface controllers. Downlink communication scheme provides a supply of power to the downhole instrument. Protection of downhole electronics and continuity of communication is ensured in the event of a ground fault on the power cable. Both downlink and uplink communication frequencies are adaptive based on frequencies and voltages present on the power cable.

Abstract: A power substrate utilizing silver conductors on ceramic, and the process for making said device. The insulating portion of the substrate is fabricated from a ceramic by placing trenches into the ceramic which can be filled with silver conductors. These conductors can serve the purpose of traces for electrical interconnection, pads for die attachment, as well as thermal conductors for heat pipes and heat spreaders. The conductors can be made on both the top and the bottom of the ceramic. Such substrates may be used for a multitude of applications requiring power substrates for conducting large currents, and are suitable for high efficiency, high temperature, and/or high reliability applications.

Abstract: This invention relates to a data communication system/method for use in a downhole application wherein electrical energy is supplied over a multiple-conductor power cable to a motor assembly of a downhole tool such as an electric submersible pump. A power leg coupling interfaces a surface controller of a downhole instrument to the conductors of the tool's power cable. Uplink communication of telemetry data occurs via current modulation generated by the downhole instrument and interpreted by a surface controller. Downlink communication of downhole instrument data occurs over a different communication scheme supported by the downhole and surface controllers. Downlink communication scheme provides a supply of power to the downhole instrument. Protection of downhole electronics and continuity of communication is ensured in the event of a ground fault on the power cable. Both downlink and uplink communication frequencies are adaptive based on frequencies and voltages present on the power cable.

Abstract: A turbine environment wireless transmitter for monitoring bearing health inside jet turbines. This transmitter has the ability to operate in 225 to 300 degree Celsius environments and monitor real time bearing temperature and vibration and transmit that data to a centralized system for processing. The system is powered by a built in thermal electric generator, which produces power in response to a thermal gradient across it. The information transmitted is used to monitor and diagnose a bearing operating parameters in real-time and predict a failure event before any damage occurs.

Abstract: A voltage regulator circuitry (50) adapted to operate in a high-temperature environment of a turbine engine is provided. The voltage regulator may include a constant current source (52) including a first semiconductor switch (54) and a first resistor (56) connected between a gate terminal (G) and a source terminal (S) of the first semiconductor switch. A second resistor (58) is connected to the gate terminal of the first semiconductor switch (54) and to an electrical ground (64). The constant current source is coupled to generate a voltage reference across the second resistor 58. A source follower output stage 66 may include a second semiconductor switch (68) and a third resistor (58) connected between the electrical ground and a source terminal of the second semiconductor switch. The generated voltage reference is applied to a gating terminal of the second semiconductor switch (58).

Abstract: A circuitry adapted to operate in a high-temperature environment of a turbine engine is provided. A relatively high-gain differential amplifier (102) may have an input terminal coupled to receive a voltage indicative of a sensed parameter of a component (20) of the turbine engine. A hybrid load circuitry may be coupled to the differential amplifier. A voltage regulator circuitry (244) may be coupled to power the differential amplifier. The differential amplifier, the hybrid load circuitry and the voltage regulator circuitry may each be disposed in the high-temperature environment of the turbine engine.

Abstract: A circuitry (120) adapted to operate in a high-temperature environment of a turbine engine is provided. The circuitry may include a differential amplifier (122) having an input terminal (124) coupled to a sensing element to receive a voltage indicative of a sensed parameter. A hybrid load circuitry (125) may be AC-coupled to the differential amplifier. The hybrid load circuitry may include a resistor-capacitor circuit (134) arranged to provide a path to an AC signal component with respect to the drain terminal of the switch (e.g., 126) of a differential pair of semiconductor switches 126, 128, which receives the voltage indicative of the sensed parameter.

Abstract: Chopper circuitry may be adapted to operate in a high-temperature environment of a turbine. A first semiconductor switch (122) may have a first terminal coupled to receive a first output signal from a first leg (148) of a differential amplifier (150). A second switch (128) may have a first terminal coupled thru a first resistive element (R1) to a second terminal of the first semiconductor switch. The first terminal of the second semiconductor switch may be coupled to receive thru a second resistive element (R2) a second output signal from a second leg (152) of the amplifier. Switches (122,128) may be responsive to a switching control signal to respective gate terminals of the switches to supply an output signal, which alternates in correspondence with a frequency of the switching control signal from a first amplitude level to a second amplitude level, which effectively provides a doubling amplification factor.

Abstract: In a telemetry system for use in an engine, a circuit structure (34) affixed to a moving part (20) of the engine is disposed for amplifying information sensed about a condition of the part and transmitting the sensed information to a receiver external to the engine. The circuit structure is adapted for the high temperature environment of the engine and includes a differential amplifier (102, 111) having an input for receiving a signal from a sensor (101, 110) disposed on the part. A voltage controlled oscillator (104, 115) with an input coupled to the output of the amplifier produces an oscillatory signal having a frequency representative of the sensed condition. A buffer (105, 116) with an input coupled to the output of the oscillator buffers the oscillatory signal, which is then coupled to an antenna (26) for transmitting the information to the receiver.

Abstract: Chopper circuitry may be adapted to operate in a high-temperature environment of a turbine. A first semiconductor switch (122) may have a first terminal coupled to receive a first output signal from a first leg (148) of a differential amplifier (150). A second switch (128) may have a first terminal coupled thru a first resistive element (R1) to a second terminal of the first semiconductor switch. The first terminal of the second semiconductor switch may be coupled to receive thru a second resistive element (R2) a second output signal from a second leg (152) of the amplifier. Switches (122,128) may be responsive to a switching control signal to respective gate terminals of the switches to supply an output signal, which alternates in correspondence with a frequency of the switching control signal from a first amplitude level to a second amplitude level, which effectively provides a doubling amplification factor.

Abstract: A voltage regulator circuitry (50) adapted to operate in a high-temperature environment of a turbine engine is provided. The voltage regulator may include a constant current source (52) including a first semiconductor switch (54) and a first resistor (56) connected between a gate terminal (G) and a source terminal (S) of the first semiconductor switch. A second resistor (58) is connected to the gate terminal of the first semiconductor switch (54) and to an electrical ground (64). The constant current source is coupled to generate a voltage reference across the second resistor 58. A source follower output stage 66 may include a second semiconductor switch (68) and a third resistor (58) connected between the electrical ground and a source terminal of the second semiconductor switch. The generated voltage reference is applied to a gating terminal of the second semiconductor switch (58).

Abstract: A circuitry (120) adapted to operate in a high-temperature environment of a turbine engine is provided. The circuitry may include a differential amplifier (122) having an input terminal (124) coupled to a sensing element to receive a voltage indicative of a sensed parameter. A hybrid load circuitry (125) may be AC-coupled to the differential amplifier. The hybrid load circuitry may include a resistor-capacitor circuit (134) arranged to provide a path to an AC signal component with respect to the drain terminal of the switch (e.g., 126) of a differential pair of semiconductor switches 126, 128, which receives the voltage indicative of the sensed parameter.

Abstract: A circuit assembly (34) resistant to high-temperature and high g centrifugal force is disclosed. A printed circuit board (42) is first fabricated from alumina and has conductive traces of said circuit formed thereon by the use of a thick film gold paste. Active and passive components of the circuit assembly are attached to the printed circuit board by means of gold powder diffused under high temperature. Gold wire is used for bonding between the circuit traces and the active components in order to complete the circuit assembly (34). Also, a method for manufacturing a circuit assembly resistant to elevated temperature is disclosed.

Abstract: Provided is a double-sided cooling structure for a semiconductor device using a low processing temperature and reduced processing time utilizing solid phase diffusion bonding. The fabrication method for this system is provided. The semiconductor device 1 comprising: a mounting substrate 70; a semiconductor chip 10 disposed on the mounting substrate 70 and a semiconductor substrate 26, a source pad electrode SP and a gate pad electrode GP disposed on a surface of the semiconductor substrate 26, and a drain pad electrode 36 disposed on a back side surface of the semiconductor substrate 26 to be contacted with the mounting substrate 70; and a source connector SC disposed on the source pad electrode SP. The mounting substrate 70 and the drain pad electrode 36 are bonded by using solid phase diffusion bonding.

Abstract: A circuit assembly (34) resistant to high-temperature and high g centrifugal force is disclosed. A printed circuit board (42) is first fabricated from alumina and has conductive traces of said circuit formed thereon by the use of a thick film gold paste. Active and passive components of the circuit assembly are attached to the printed circuit board by means of gold powder diffused under high temperature. Gold wire is used for bonding between the circuit traces and the active components in order to complete the circuit assembly (34). Also, a method for manufacturing a circuit assembly resistant to elevated temperature is disclosed.

Abstract: A circuitry adapted to operate in a high-temperature environment of a turbine engine is provided. A relatively high-gain differential amplifier (102) may have an input terminal coupled to receive a voltage indicative of a sensed parameter of a component (20) of the turbine engine. A hybrid load circuitry may be coupled to the differential amplifier. A voltage regulator circuitry (244) may be coupled to power the differential amplifier. The differential amplifier, the hybrid load circuitry and the voltage regulator circuitry may each be disposed in the high-temperature environment of the turbine engine.

Abstract: In a telemetry system for use in an engine, a circuit structure (34) affixed to a moving part (20) of the engine is disposed for amplifying information sensed about a condition of the part and transmitting the sensed information to a receiver external to the engine. The circuit structure is adapted for the high temperature environment of the engine and includes a differential amplifier (102, 111) having an input for receiving a signal from a sensor (101, 110) disposed on the part. A voltage controlled oscillator (104, 115) with an input coupled to the output of the amplifier produces an oscillatory signal having a frequency representative of the sensed condition. A buffer (105, 116) with an input coupled to the output of the oscillator buffers the oscillatory signal, which is then coupled to an antenna (26) for transmitting the information to the receiver.

Abstract: A circuit assembly (34) affixed to a moving part (20) of a turbine for receiving information about a condition of the part and transmitting this information external to the engine. The circuit assembly includes a high-temperature resistant package (34A) that attaches to the part. A high temperature resistant PC board (42) supports both active and passive components of the circuit, wherein a first group of the passive components are fabricated with zero temperature coefficient of resistance and a second group of the passive components are fabricated with a positive temperature coefficient of resistance. The active components are fabricated with high temperature metallization. Connectors (40) attached to the PC board pass through a wall of the package (34A) for communication with sensors (30) on the part and with an antenna (26) for transmitting data about the condition of the part to outside the turbine.