Patents by Inventor Bucknell Chapman Webb
Bucknell Chapman Webb has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8796138Abstract: Methods and apparatus for forming through-vias are presented, for example, a method for forming a via in a portion of a semiconductor wafer comprising a substrate. The method comprises forming a trench surrounding a first part of the substrate such that the first part is separated from a second part of the substrate, forming a hole through the substrate within the first part, and forming a first metal within the hole. The trench extends through the substrate. The first metal extends from a front surface of the substrate to a back surface of the substrate. The via comprises the hole and the first metal.Type: GrantFiled: May 10, 2012Date of Patent: August 5, 2014Assignee: International Business Machiness CorporationInventors: John Michael Cotte, Christopher Vincent Jahnes, Bucknell Chapman Webb
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Patent number: 8427780Abstract: A magnetic head in one embodiment includes a bottom pole; a top pole positioned above a plane extending through the bottom pole and parallel to a plane of deposition of the bottom pole, wherein the top pole is at least partially offset from the bottom pole in a direction parallel to a plane of deposition of the top pole; a first write gap in the top pole; and a first coil for generating a magnetic flux across the first write gap. A method in one embodiment includes forming a bottom pole; forming a top pole above a plane extending through the bottom pole and parallel to a plane of deposition of the bottom pole, wherein the top pole is at least partially offset from the bottom pole in a direction parallel to a plane of deposition of the top pole, wherein at least one write gap is formed in the top pole; forming side poles for coupling the top and bottom poles; and forming a first coil for generating a magnetic flux across the first write gap.Type: GrantFiled: January 23, 2009Date of Patent: April 23, 2013Assignee: International Business Machines CorporationInventors: Robert Glenn Biskeborn, Lubomyr T. Romankiw, Steven Erik Steen, Bucknell Chapman Webb
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Patent number: 8263492Abstract: Methods and apparatus for forming through-vias are presented, for example, a method for forming a via in a portion of a semiconductor wafer comprising a substrate. The method comprises forming a trench surrounding a first part of the substrate such that the first part is separated from a second part of the substrate, forming a hole through the substrate within the first part, and forming a first metal within the hole. The trench extends through the substrate. The first metal extends from a front surface of the substrate to a back surface of the substrate. The via comprises the hole and the first metal.Type: GrantFiled: April 29, 2009Date of Patent: September 11, 2012Assignee: International Business Machines CorporationInventors: John Michael Cotte, Christopher Vincent Jahnes, Bucknell Chapman Webb
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Publication number: 20120217651Abstract: Methods and apparatus for forming through-vias are presented, for example, a method for forming a via in a portion of a semiconductor wafer comprising a substrate. The method comprises forming a trench surrounding a first part of the substrate such that the first part is separated from a second part of the substrate, forming a hole through the substrate within the first part, and forming a first metal within the hole. The trench extends through the substrate. The first metal extends from a front surface of the substrate to a back surface of the substrate. The via comprises the hole and the first metal.Type: ApplicationFiled: May 10, 2012Publication date: August 30, 2012Applicant: International Business Machines CorporationInventors: John Michael Cotte, Christopher Vincent Jahnes, Bucknell Chapman Webb
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Patent number: 8168045Abstract: An apparatus for plating a magnetic film on a substrate includes: a track including a plurality of stopping points along the track; a permanent magnet placed on the track such that the permanent magnet can be moved along the track towards and away from the stopping points; at least one plating tank positioned on the stopping point; and a removable high permeability iron flux concentrator inserted into gaps between the substrate and inside walls of the plating tank, substantially surrounding the substrate and extending around and under the substrate.Type: GrantFiled: May 20, 2011Date of Patent: May 1, 2012Assignee: International Business CorporationInventors: Matteo Flotta, Lubomyr T. Romanikiw, Xiaoyan Shao, Steven Erik Steen, Bucknell Chapman Webb
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Publication number: 20110220020Abstract: An apparatus for plating a magnetic film on a substrate includes: a track including a plurality of stopping points along the track; a permanent magnet placed on the track such that the permanent magnet can be moved along the track towards and away from the stopping points; at least one plating tank positioned on the stopping point; and a removable high permeability iron flux concentrator inserted into gaps between the substrate and inside walls of the plating tank, substantially surrounding the substrate and extending around and under the substrate.Type: ApplicationFiled: May 20, 2011Publication date: September 15, 2011Applicant: International Business Machines CorporationInventors: MATTEO FLOTA, Lubomyr Taras Romankiw, Xiaoyan Shao, Steven Erik Steen, Bucknell Chapman Webb
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Patent number: 7964081Abstract: An apparatus for plating a magnetic film on a substrate includes: a track including a plurality of stopping points along the track; a permanent magnet placed on the track such that the permanent magnet can be moved along the track towards and away from the stopping points; at least one plating tank positioned on the stopping point; and a removable high permeability iron flux concentrator inserted into gaps between the substrate and inside walls of the plating tank, substantially surrounding the substrate and extending around and under the substrate.Type: GrantFiled: August 24, 2007Date of Patent: June 21, 2011Assignee: International Business Machines CorporationInventors: Matteo Flotta, Lubomyr Taras Romankiw, Xiaoyan Shao, Steven Erik Steen, Bucknell Chapman Webb
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Publication number: 20100276786Abstract: Methods and apparatus for forming through-vias are presented, for example, a method for forming a via in a portion of a semiconductor wafer comprising a substrate. The method comprises forming a trench surrounding a first part of the substrate such that the first part is separated from a second part of the substrate, forming a hole through the substrate within the first part, and forming a first metal within the hole. The trench extends through the substrate. The first metal extends from a front surface of the substrate to a back surface of the substrate. The via comprises the hole and the first metal.Type: ApplicationFiled: April 29, 2009Publication date: November 4, 2010Applicant: International Business Machines CorporationInventors: John Michael Cotte, Christopher Vincent Jahnes, Bucknell Chapman Webb
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Publication number: 20100188774Abstract: A magnetic head in one embodiment includes a bottom pole; a top pole positioned above a plane extending through the bottom pole and parallel to a plane of deposition of the bottom pole, wherein the top pole is at least partially offset from the bottom pole in a direction parallel to a plane of deposition of the top pole; a first write gap in the top pole; and a first coil for generating a magnetic flux across the first write gap. A method in one embodiment includes forming a bottom pole; forming a top pole above a plane extending through the bottom pole and parallel to a plane of deposition of the bottom pole, wherein the top pole is at least partially offset from the bottom pole in a direction parallel to a plane of deposition of the top pole, wherein at least one write gap is formed in the top pole; forming side poles for coupling the top and bottom poles; and forming a first coil for generating a magnetic flux across the first write gap.Type: ApplicationFiled: January 23, 2009Publication date: July 29, 2010Inventors: Robert Glenn Biskeborn, Lubomyr T. Romankiw, Steven Erik Steen, Bucknell Chapman Webb
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Patent number: 7763965Abstract: An electronic device and method of making the device. The device includes: a carrier; a silicon interposer connected to a top surface of the carrier, the interposer having wires extending from a top surface of the interposer, through the interposer, to a bottom surface of the interposer, the wires at the bottom surface of the interposer electrically connected to wires in a top surface of the carrier; an integrated circuit chip connected to the top surface of the interposer, wires at a surface of the integrated circuit chip electrically connected to the wires in the top surface of the interposer; and a stress relief structure attached to the interposer, the stress relief structure either (i) not electrically connected to the wires of the interposer or integrated circuit chip or (ii) electrically connected to ground by wires of the interposer or wires of the integrated circuit chip.Type: GrantFiled: September 25, 2007Date of Patent: July 27, 2010Assignee: International Business Machines CorporationInventor: Bucknell Chapman Webb
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Publication number: 20090079071Abstract: An electronic device and method of making the device. The device includes: a carrier; a silicon interposer connected to a top surface of the carrier, the interposer having wires extending from a top surface of the interposer, through the interposer, to a bottom surface of the interposer, the wires at the bottom surface of the interposer electrically connected to wires in a top surface of the carrier; an integrated circuit chip connected to the top surface of the interposer, wires at a surface of the integrated circuit chip electrically connected to the wires in the top surface of the interposer; and a stress relief structure attached to the interposer, the stress relief structure either (i) not electrically connected to the wires of the interposer or integrated circuit chip or (ii) electrically connected to ground by wires of the interposer or wires of the integrated circuit chip.Type: ApplicationFiled: September 25, 2007Publication date: March 26, 2009Inventor: Bucknell Chapman Webb
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Publication number: 20090050486Abstract: An apparatus for plating a magnetic film on a substrate includes: a track including a plurality of stopping points along the track; a permanent magnet placed on the track such that the permanent magnet can be moved along the track towards and away from the stopping points; at least one plating tank positioned on the stopping point; and a removable high permeability iron flux concentrator inserted into gaps between the substrate and inside walls of the plating tank, substantially surrounding the substrate and extending around and under the substrate.Type: ApplicationFiled: August 24, 2007Publication date: February 26, 2009Applicant: International Business Machines CorporationInventors: Matteo Flotta, Lubomyr Taras Romankiw, Xiaoyan Shao, Steven Erik Steen, Bucknell Chapman Webb
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Patent number: 6898035Abstract: Improvements in placement of timing patterns in self-servowriting include correcting for systematic errors due to geometric effects. A correction is made for varying systematic errors, such as when the recording head has spatially separate read and write elements. Further, servopattern rotation due to residual or unmeasured systematic errors is reduced by using a once per revolution clock index derived from the motor drive current waveform or any other sensor. In one aspect of correcting for systematic errors in the writing of timing patterns on a storage medium of a storage device, a time interval between a trigger pattern written at a first radial position of the storage medium and a rotational index is measured. The rotational index is related to the rotational orientation of the storage medium with respect to a fixed frame of the storage device.Type: GrantFiled: November 27, 2000Date of Patent: May 24, 2005Assignee: Hitachi Global Storage Technologies Netherlands B.V.Inventors: Timothy Joseph Chainer, Anthony Paul Praino, Mark Delorman Schultz, Bucknell Chapman Webb, Edward John Yarmchuk
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Patent number: 6476989Abstract: An improved servowriting system and method whereby errors introduced into the written servo information are reduced or eliminated for greater servowriting accuracy. Accuracy is enhanced by one or more of the following improvements: 1) optimizing write current and write frequency to minimize write width modulation; 2) optimizing the RPM of the storage medium to minimize random mechanical vibration; and 3) providing a clip level check to eliminate the introduction of large errors in product servopattern. The proposed improvements provide substantial rejection of, for example, mechanical and magnetic disturbances, ensuring a robust servowriting process.Type: GrantFiled: May 3, 1999Date of Patent: November 5, 2002Assignee: International Business Machines CorporationInventors: Timothy Chainer, Mark Delorman Schultz, Bucknell Chapman Webb, Edward John Yarmchuk
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Patent number: 6469859Abstract: An accurate and time-efficient method and system for self-servowriting wherein at least one reference value used to position the transducer is updated for some, but not all, of the tracks to be written. The reference value(s) is dependent upon a predefined indicium of transducer position, such as the amplitude of the readback signal obtained from a written track when the transducer is positioned on the track. In a first embodiment, updating of the reference value(s) is performed at every Nth track written, where N is a fixed number or range of numbers determined by an expected track-to-track variation of the indicium. The servowriting system may be designed to dynamically increase or decrease N during servowriting in response to actual variations in the indicium. According to a second embodiment, updating is only performed when needed, e.g. when the variation of the measured indicium between two written tracks (not necessarily adjacent tracks) exceeds a predefined threshold value.Type: GrantFiled: November 24, 1998Date of Patent: October 22, 2002Assignee: International Business Machines CorporationInventors: Timothy Chainer, Mark Delorman Schultz, Bucknell Chapman Webb, Edward John Yarmchuk
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Patent number: 6324027Abstract: Improvements in placement of timing patterns in self-servowriting include correcting for random errors. Random errors may be caused by variations in disk velocity and therefore, one technique for correcting for random errors includes reducing velocity jitter. Additionally, random errors can be corrected by improving interval control during the propagation of trigger patterns used in writing timing information on storage media. Further, random errors, in the writing of timing information, can be corrected during a single revolution of the storage media. This eliminates additional rotations, thereby providing a large capital cost savings.Type: GrantFiled: May 21, 1999Date of Patent: November 27, 2001Assignee: International Business Machines CorporationInventors: Timothy Joseph Chainer, Mark Delorman Schultz, Bucknell Chapman Webb, Edward John Yarmchuk
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Patent number: 6307697Abstract: Improvements in placement of timing patterns in self-servowriting include correcting for systematic errors due to geometric effects. A correction is made for varying systematic errors, such as when the recording head has spatially separate read and write elements. Further, servopattern rotation due to residual or unmeasured systematic errors is reduced by using a once per revolution clock index derived from the motor drive current waveform or any other sensor. In one aspect of correcting for systematic errors in the writing of timing patterns on a storage medium of a storage device, a time interval between a trigger pattern written at a first-radial position of the storage medium and a rotational index is measured. The rotational index is related to the rotational orientation of the storage medium with respect to a fixed frame of the storage device.Type: GrantFiled: April 14, 2000Date of Patent: October 23, 2001Assignee: International Business Machines CorporationInventors: Timothy Joseph Chainer, Anthony Paul Praino, Mark Delorman Schultz, Bucknell Chapman Webb, Edward John Yarmchuk
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Patent number: 6301071Abstract: Methods and systems for self-servowriting a data storage medium are disclosed, including servoing to propagation bursts of a propagation pattern located in tracks other than an immediately preceding track. Reference levels used to position a recording head are accordingly kept in a usable dynamic range necessary to keep servo track spacing constant across the medium. The methods and systems are disclosed in connection with a rotary actuator having spaced read and write heads. Similar methods are disclosed for writing trigger or timing bursts of the propagation pattern.Type: GrantFiled: March 19, 2001Date of Patent: October 9, 2001Assignee: International Business Machines CorporationInventors: Timothy Joseph Chainer, Mark Delorman Schultz, Bucknell Chapman Webb, Edward John Yarmchuk
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Patent number: 6259574Abstract: Improvements in placement of timing patterns in self-servowriting include detecting and correcting for media defects. A detector is used to detect whether a trigger pattern is within an expected location on the storage medium. If the trigger pattern is not detected, then a physical defect may be present. Thus, in one example, a false trigger pattern is generated. Additionally, a determination is made as to whether a trigger pattern is within an expected trigger pattern region. When the trigger pattern is not within the expected range, then a valid interval window may be modified to adjust the expected trigger pattern region.Type: GrantFiled: May 4, 2000Date of Patent: July 10, 2001Assignee: International Business Machines CorporationInventors: Timothy Joseph Chainer, Mark Delorman Schultz, Bucknell Chapman Webb, Edward John Yarmchuk
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Patent number: 6252732Abstract: Improvements in placement of timing patterns in self-servowriting include correcting for systematic errors due to geometric effects. A correction is made for varying systematic errors, such as when the recording head has spatially separate read and write elements. Further, servopattern rotation due to residual or unmeasured systematic errors is reduced by using a once per revolution clock index derived from the motor drive current waveform or any other sensor. In one aspect of correcting for systematic errors in the writing of timing patterns on a storage medium of a storage device, a time interval between a trigger pattern written at a first radial position of the storage medium and a rotational index is measured. The rotational index is related to the rotational orientation of the storage medium with respect to a fixed frame of the storage device.Type: GrantFiled: July 10, 1997Date of Patent: June 26, 2001Assignee: International Business Machines CorporationInventors: Timothy Joseph Chainer, Anthony Paul Praino, Mark Delorman Schultz, Bucknell Chapman Webb, Edward John Yarmchuk