Patents by Inventor Buddini I. KARAWDENIYA

Buddini I. KARAWDENIYA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Ohmic nanopore fabrication and real-time cleaning
    Patent number: 11981557
    Abstract: The present invention includes one or more nanopores in a SixNy membrane comprising a monoprotic surface termination, methods of making, and methods of using the one or more nanopores, where the one or more nanopores are a chemically-tuned controlled dielectric breakdown (CT-CDB) nanopore membrane, wherein the CT-CDB allows for long-term stability of measurements in the presence of only electrolyte (open pore current stability) and ability to support many molecular detection events. In addition, the CT-CBD has pore that unclog spontaneously, in response to voltage cessation or application, or both.
    Type: Grant
    Filed: April 16, 2021
    Date of Patent: May 14, 2024
    Assignee: SOUTHERN METHODIST UNIVERSITY
    Inventors: Y. M. Nuwan D. Y. Bandara, Buddini I. Karawdeniya, Jugal Saharia, Min Jun Kim, Jason Rodger Dwyer
  • OHMIC NANOPORE FABRICATION AND REAL-TIME CLEANING
    Publication number: 20210325329
    Abstract: The present invention includes one or more nanopores in a SixNy membrane comprising a monoprotic surface termination, methods of making, and methods of using the one or more nanopores, where the one or more nanopores are a chemically-tuned controlled dielectric breakdown (CT-CDB) nanopore membrane, wherein the CT-CDB allows for long-term stability of measurements in the presence of only electrolyte (open pore current stability) and ability to support many molecular detection events. In addition, the CT-CBD has pore that unclog spontaneously, in response to voltage cessation or application, or both.
    Type: Application
    Filed: April 16, 2021
    Publication date: October 21, 2021
    Inventors: Y.M. Nuwan D.Y. Bandara, Buddini I. Karawdeniya, Jugal Saharia, Min Jun Kim, Jason Rodger Dwyer
  • Systems and methods for electroless plating of thin gold films directly onto silicon nitride and into pores in silicon nitride
    Patent number: 10351958
    Abstract: A method is disclosed for electroless plating of thin metal film directly onto a substrate. The method includes the steps of: cleaning the substrate to remove organic material; etching a surface of the substrate to remove an oxygen-containing surface layer; soaking and rinsing the substrate in a plurality of baths following etching; and electroless plating the metal onto the substrate.
    Type: Grant
    Filed: June 22, 2015
    Date of Patent: July 16, 2019
    Assignee: Council On Postsecondary Education
    Inventors: Jason Rodger Dwyer, Julie C. Whelan, Y. M. Nuwan D. Y. Bandara, Buddini I. Karawdeniya
  • SYSTEMS AND METHODS FOR ELECTROLESS PLATING OF THIN GOLD FILMS DIRECTLY ONTO SILICON NITRIDE AND INTO PORES IN SILICON NITRIDE
    Publication number: 20170130338
    Abstract: A method is disclosed for electroless plating of thin metal film directly onto a substrate. The method includes the steps of: cleaning the substrate to remove organic material; etching a surface of the substrate to remove an oxygen-containing surface layer; soaking and rinsing the substrate in a plurality of baths following etching; and electroless plating the metal onto the substrate.
    Type: Application
    Filed: June 22, 2015
    Publication date: May 11, 2017
    Inventors: Jason Rodger DWYER, Julie C. WHELAN, Y.M. Nuwan D.Y. BANDARA, Buddini I. KARAWDENIYA