Abstract: A read sensor for a magneto resistive head is formed through the use of a bilayer lift-off mask. According to one embodiment, a release layer is formed on top of a sensor layer. A silicon-containing resist layer is formed over the release layer. The resist layer is patterned according to the desired dimensions of the read sensor. Then, plasma etching, such as oxygen plasma etching, is used to remove the portion of the release layer that is exposed by removal of resist material. The release layer may be etched to undercut the patterned resist layer, or may entirely removed beneath the patterned resist layer to provide a bridge of the resist material. In either case, isotropic plasma etching, anisotropic plasma etching, or some combination thereof may be applied.

Abstract: A process to reduce step heights in planarization of thin film carriers in an encapsulation system. The improvements include using an adhesive tape having a thinner adhesive thickness and a stiffer tape for the film sealing the encapsulant on the carrier to result in a low step height surface transition between the carrier and the cured encapsulant. The composition of the encapsulant is modified to reduce the shrinkage upon curing of the encapsulant. The encapsulant may include an absorbent that absorbs the irradiation and cause the top surface to harden first compared to the bulk of the encapsulant, and/or a gas-emitting additive that creates gaseous products that expand upon irradiation to thereby reduce the shrinkage of the encapsulant upon curing. Alternatively, irradiation at very low incidence angle relative to the top surface of the encapsulant causes the top surface to harden before the bulk of the encapsulant.

Abstract: A read sensor for a magneto resistive head is formed through the use of a bilayer lift-off mask. According to one embodiment, a release layer is formed on top of a sensor layer. A silicon-containing resist layer is formed over the release layer. The resist layer is patterned according to the desired dimensions of the read sensor. Then, plasma etching, such as oxygen plasma etching, is used to remove the portion of the release layer that is exposed by removal of resist material. The release layer may be etched to undercut the patterned resist layer, or may entirely removed beneath the patterned resist layer to provide a bridge of the resist material. In either case, isotropic plasma etching, anisotropic plasma etching, or some combination thereof may be applied.

Abstract: A process to reduce step heights in planarization of thin film carriers in an encapsulation system. The improvements include using an adhesive tape having a thinner adhesive thickness and a stiffer tape for the film sealing the encapsulant on the carrier to result in a low step height surface transition between the carrier and the cured encapsulant. The composition of the encapsulant is modified to reduce the shrinkage upon curing of the encapsulant. The encapsulant may include an absorbent that absorbs the irradiation and cause the top surface to harden first compared to the bulk of the encapsulant, and/or a gas-emitting additive that creates gaseous products that expand upon irradiation to thereby reduce the shrinkage of the encapsulant upon curing. Alternatively, irradiation at very low incidence angle relative to the top surface of the encapsulant causes the top surface to harden before the bulk of the encapsulant.

Abstract: A method for preparing the air bearing surface of a slider for etch patterning including the steps of applying a first thin film to a carrier, applying a second thin film to the carrier, the first thin film and the second thin film separated by a recess, each of the first and second thin films having respective first and second air bearing surfaces, applying an adhesive film over the first and second thin films, depositing a fluid in the recess, the fluid held in the recess by the adhesive film, curing the fluid, and removing the adhesive film. The method of the invention may also include coating the first and second air bearing surfaces with an etch mask, developing the etch mask, and patterning the first and second air bearing surfaces.