Abstract: The present disclosure relates to a lead-free solder alloy composition in which a nanosized ceramic powder additive is added to a lead-free solder alloy of Sn—Cu—Bi, Sn—Ag—Bi or Sn—Ag—Cu—Bi, and a method for preparing the same.

Abstract: This invention relates to a lead-free solder alloy composition and a method of preparing a lead-free solder alloy, wherein the lead-free solder alloy composition includes a ceramic powder added to a lead-free solder of Sn-(0.1 to 2) wt % Cu, Sn-(0.5 to 5) wt % Ag, or Sn-(0.1 to 2) wt % Cu-(0.5 to 5) wt % Ag. According to this invention, a novel lead-free solder alloy, which functions as a replacement for a conventional lead-free solder, is provided, thus exhibiting superior spreadability, wettability, and mechanical properties than a conventional lead-free solder.

Abstract: The present invention relates to a method for manufacturing a low density inorganic powder insulator having a low density molded structure using expanded perlite without a binder and a mold machine for manufacturing the same, and more particularly, to a technology of uniformly dispersing perlite particles having a shape of irregular fragments of glass using expanded perlite to form a framework among synthetic silica to improve molding strength even at a low density, thereby reducing thermal conductivity (conduction and convection blocking) due to a low density and an increase in a specific surface area.

Abstract: This invention relates to a lead-free solder alloy composition and a method of preparing a lead-free solder alloy, wherein the lead-free solder alloy composition includes a ceramic powder added to a lead-free solder of Sn-(0.1 to 2) wt % Cu, Sn-(0.5 to 5) wt % Ag, or Sn-(0.1 to 2) wt % Cu-(0.5 to 5) wt % Ag. According to this invention, a novel lead-free solder alloy, which functions as a replacement for a conventional lead-free solder, is provided, thus exhibiting superior spreadability, wettability, and mechanical properties than a conventional lead-free solder.

Abstract: The present invention relates to a method for manufacturing a low density inorganic powder insulator having a low density molded structure using expanded perlite without a binder and a mold machine for manufacturing the same, and more particularly, to a technology of uniformly dispersing perlite particles having a shape of irregular fragments of glass using expanded perlite to form a framework among synthetic silica to improve molding strength even at a low density, thereby reducing thermal conductivity (conduction and convection blocking) due to a low density and an increase in a specific surface area.

Abstract: The present invention relates to a thermal insulator using closed cell expanded perlite. The thermal insulator using closed cell expanded perlite of the present invention includes: expanded perlite 10 to 84 wt %ç, including dried and expanded perlite ore particles, having a surface with a closed cell shape, as an active ingredient; a liquid binder 15 to 85 wt %; and a reinforcing fiber 0.25 to 5 wt %. Accordingly, the present invention provides a thermal insulator, which enhances the rigidity of expanded perlite, minimizes porosity and gaps between the expanded perlite particles, by reducing compression ratio during compression molding, which results in lower density, improves constructability by lowering thermal conductivity, reduces material and energy costs and can reduce the area required for equipment installation by reducing the thickness of the thermal insulator.

Abstract: The present invention relates to a thermal insulator using closed cell expanded perlite. The thermal insulator using closed cell expanded perlite of the present invention includes: expanded perlite 10 to 84 wt %,ç, including dried and expanded perlite ore particles, having a surface with a closed cell shape, as an active ingredient; a liquid binder 15 to 85 wt %; and a reinforcing fiber 0.25 to 5 wt %. Accordingly, the present invention provides a thermal insulator, which enhances the rigidity of expanded perlite, minimizes porosity and gaps between the expanded perlite particles, by reducing compression ratio during compression molding, which results in lower density, improves constructability by lowering thermal conductivity, reduces material and energy costs and can reduce the area required for equipment installation by reducing the thickness of the thermal insulator.