Abstract: A unit pixel array of an image sensor includes a semiconductor substrate having a plurality of unit pixels, an interlayer insulating layer disposed on a front side of the semiconductor substrate, a plurality of color filters disposed on a back side of the semiconductor substrate, a plurality of light path converters, each of the light path converters being disposed adjacent to at least one color filter and having a pair of slanted side edges extending from opposing ends of a horizontal bottom edge, and a plurality of micro lenses disposed on the color filters.

Abstract: A method of manufacturing a backside illuminated image sensor, including forming a first isolation layer in a first semiconductor layer, such that the first isolation layer defines pixels of a pixel array in the first semiconductor layer, forming a second semiconductor layer on a first surface of the first semiconductor layer, forming a second isolation layer in the second semiconductor layer, such that the second isolation layer defines active device regions in the second semiconductor layer, forming photo detectors and circuit devices by implanting impurities into a first surface of the second semiconductor layer, the first surface of the second semiconductor layer facing away from the first semiconductor layer, forming a wiring layer on the first surface of the second semiconductor layer, and forming a light filter layer on a second surface of the first semiconductor layer.

Abstract: A complementary metal-oxide-semiconductor (CMOS) image sensor, including a wiring layer, a photodiode stacked with the wiring layer, a micro-lens stacked on the photodiode, an anti-reflection layer stacked on the photodiode. An anti-absorption layer may be provided between the photodiode and the anti-reflection layer. The photodiode may include a first portion and a second portion. Light may be focused on the first portion by the micro-lens and the second portion may at least partially surround the first portion. A material of the first portion may have a refractive index higher than a refractive index of a material of the second portion. The anti-absorption layer may include a compound semiconductor having an energy band gap greater than an energy band gap of a semiconductor included in the photodiode.

Abstract: An organic light-emitting device and a method of manufacturing the same. The organic light-emitting device includes a substrate, a first electrode formed on the substrate, a second electrode, an emission layer between the first electrode and the second electrode, a hole transport layer between the first electrode and the emission layer, and an electron transport layer between the second electrode and the emission layer. The hole transport layer includes a first hole transport unit comprising: a first hole transport layer comprising a hole transporting material, a third hole transport layer formed on the first hole transport layer and comprising a charge generating material; and a fifth hole transport layer formed on the third hole transport layer and comprising the hole transporting material.

Abstract: It is possible to prevent that a liquid refrigerant is included in a refrigerant injected into a compressor. Accordingly, the risk of liquid compression of the compressor is greatly reduced, thereby decreasing the possibility of damage to the compressor and improving reliability and performance.

Abstract: For color correction in an image sensor, an image sensor processing block generates a plurality of color correction parameters corresponding to a plurality of selected pixels of the image sensor for defining a plurality of areas of a sample image. In addition, a color correction value calculation block generates a respective color correction value corresponding to a given pixel from bilinear interpolation of a respective subset of the color correction parameters corresponding to a respective one of the areas including a respective location of the given pixel.

Abstract: Unit picture elements including photon-refracting microlenses. A unit picture element may include a photodiode, a metal layer, and a photo-refracting microlens. The photon-refracting microlens may be disposed between the photodiode and the metal layer. The photon-refracting microlens may refract photons reflected by the metal layer to a center portion of the photo diode.

Abstract: A heat pump controls heating and/or cooling using a refrigeration cycle unit and a booster module, The refrigeration cycle unit includes a compressor to compress a coolant, a first heat exchanger to condense the coolant compressed in the compressor, an expansion mechanism to expand the coolant condensed in the first heat exchanger, and a second heat exchanger to evaporate the coolant expanded in the expansion mechanism. The booster module separates a gaseous coolant from the coolant flowing from the first heat exchanger to the expansion mechanism and then allows for compression of the separated gaseous coolant or coolant evaporated in the second heat exchanger.

Abstract: A heat pump type cooling/heating apparatus comprises a coolant injection path and a gaseous coolant adjustment valve. The coolant injection path may be split between a cascade heat exchanger and an evaporator of a low-temperature refrigeration cycle to inject coolant into a low pressure side compressor, or between a water coolant heat exchanger and cascade heat exchanger to inject coolant into a high pressure side compressor of a high temperature refrigeration cycle.

Abstract: An air includes: a compressor for compressing a refrigerant; an indoor heat exchanger for cooling or heating indoor with a refrigerant; an outdoor heat exchanger for exchanging heat of a refrigerant and outdoor air; an outdoor fan for ventilating outdoor air with the outdoor heat exchanger; a cooling/heating switching valve for switching cooling/heating; a first expansion device installed between the indoor heat exchanger and the outdoor heat exchanger; a CNT heater module installed between the outdoor heat exchanger and the cooling/heating switching valve to evaporate a refrigerant; a second expansion device installed between the outdoor heat exchanger and the CNT heater module; and a controller for sustaining a heating mode of the cooling/heating switching valve.

Abstract: An air conditioning system is able to decrease the amount of refrigerant between a first expansion device and an injection valve and thus adjust the pressure of an injected refrigerant by decreasing the opening degree of the first expansion device and maintaining the opening degree of a second expansion device upon opening of the injection valve, thereby making the system stable upon opening of the injection valve. Furthermore, upon starting up a compressor, the opening degrees of the first and second expansion devices are partly decreased based on the start-up of the compressor and then gradually opened again, and upon completion of the start-up of the compressor, the opening amounts of the first and second expansion devices and the injection valve are controlled, thereby making the cycle more stable.

Abstract: An air conditioning system can improve the cooling/heating performance of the system because the injection of refrigerant into the compressor is achieved. The air conditioning system can further improve the cooling/heating performance in a low temperature region by injecting refrigerant as a two-phase refrigerant or a superheated vapor state into the compressor. The air conditioning system can prevent damage of the compressor and further improve reliability by controlling such that the ratio of a liquid refrigerant in the refrigerant injected into the compressor may be less than a set value.

Abstract: The image sensor includes a pixel array including a plurality of pixels arranged in a non-red-green-blue (RGB) Bayer pattern, an analog-to-digital converter configured to convert an analog pixel signal output from each of the pixels into a digital pixel signal, and an RGB converter configured to convert the digital pixel signal into an RGB Bayer signal. Accordingly, the image sensor is compatible with a universal image signal processor (ISP), which receives and processes RGB Bayer signals, without an additional compatible device or module.

Abstract: A color filter array is provided. The color filter array includes a plurality of basic filter blocks arranged in all directions. Each of the basic filter blocks include one or more color filters. The color filters include a first type color filter that passes through all light without filtering it or has a higher light transmittance than a second type color filter, a third type color filter, and a fourth type color filter. The second through fourth color filters being a red, green or blue filter. Accordingly, the color filter array increases sensitivity to incident light or increases brightness of outgoing light.

Abstract: The present invention relates to a controlling method of an air conditioner. The controlling method of an air conditioner having a phase separator, an expansion valve, a control valve, an evaporator, a multistage compressor, and a condenser, includes the steps of sensing an order to operate the air conditioner, stabilizing the air conditioner, setting a degree of superheat of refrigerant in the air conditioner, and setting an optimum intermediate pressure of the refrigerant of the air conditioner.

Abstract: A color filter array includes a plurality of white filters, a plurality of yellow filters, a plurality of cyan filters and a plurality of green filters. The plurality of white filters transmits incident light. The plurality of yellow filters transmits a green component and a red component of the incident light. The plurality of cyan filters transmits the green component and a blue component of the incident light. The plurality of green filters transmits the green component of the incident light. An image sensor including the color filter array has high sensitivity and high SNR by increasing transmittance of the incident light.

Abstract: A solid-state image sensing device including an anti-reflection structure that uses polysilicon and a method of manufacturing the same, in which the solid-state image sensing device includes a photodiode region and a transistor region. The photodiode region includes a semiconductor substrate, a first anti-refection layer, a second anti-reflection layer, and a top layer. The first anti-reflection layer is formed on the semiconductor substrate, and the second anti-reflection layer is formed on the first anti-reflection layer. The top layer is formed on the second anti-reflection layer. Each of the semiconductor substrate and the second anti-reflection layer is formed of a first material, and each of the first anti-reflection layer and the top layer is formed of a second material different from the first material.

Abstract: A pixel cell includes a substrate, an epitaxial layer, and a photo converting device in the epitaxial layer. The epitaxial layer has a doping concentration profile of embossing shape, and includes a plurality of layers that are stacked on the substrate. The photo converting device does not include a neutral region that has a constant potential in the vertical direction. Therefore, the image sensor including the pixel cell has high quantization efficiency, and a crosstalk between photo-converting devices is decreased.

Abstract: Provided are image sensors and a methods of manufacturing image sensors. The image sensors may include a substrate, a pixel array region, and a peripheral circuit region. The substrate includes a first region and a second region. The pixel array region may be formed on the first region. The peripheral circuit region may be formed on the second region. The first region may be located higher than the second region. According to the image sensor and the method of manufacturing the same, the vertical height of the pixel array region is decreased as compared to the prior art, and thus the aspect ratio at the pixel array region is minimized. As a result, condensing efficiency the image sensor may be improved.

Abstract: An image pickup device includes a pixel array including a plurality of photo sensitive devices and a color filter array including a plurality of color filters each disposed above a corresponding one of the plurality of photo sensitive devices. The color filters include a first type color filter formed on a glass substrate to filter light to pass a first spectrum and a second type color filter stacked on at least part of the first type color filter to filter light to pass a second spectrum. Accordingly, fabrication of a color filter array can be simplified and a color filter array having a small lay out can be fabricated.